• Title/Summary/Keyword: PR strip

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Activation of Stripper Solution by Plasma and Hardness/Modulus of Elasticity Change of the Surface (Plasma를 이용한 세정액의 활성화와 시료 표면의 탄성계수 및 강도 변화에 대한 연구)

  • Kim, Soo-In;Kim, Hyun-Woo;Noh, Seong-Cheol;Yoon, Duk-Jin;Chang, Hong-Jun;Lee, Jong-Rim;Lee, Chang-Woo
    • Journal of the Korean Vacuum Society
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    • v.18 no.2
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    • pp.97-101
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    • 2009
  • In the modem semiconductor industry, the progress that consumes the most capital and labor is cleansing process. Cleansing process is to remove impurities that can affect the operation of the device and deteriorate its function. Especially, Photoresist (PR) progress that etches the device always requires cleansing at the end of the progress. Also, HDI-PR (High-Dose Ion-implanted Photoresist) created from PR progress is difficult to remove. Thus, in modem IC cleansing, many steps of cleansing are used, including dry and wet cleansing. In this paper, we suggested to combine existing dry-cleansing and wet-cleansing, each represented by plasma cleansing and stripper solution, as Plasma Liquid-Vapor Activation (PLVA). This PLVA method enhances the effect of existing cleansing solution, and decreases the amount of solution and time required to strip. We stripped HDI-PR by activated solution and measured surface hardness and Young's modulus by Nano-indenter. Nano-indenter is the equipment that determines the hardness and the modulus of elasticity by indenting nano-sized tip with specific shape into the surface and measuring weight and z-axis displacement. We measured the change of surface hardness and Young's modulus before and after the cleansing. As a result, we found out that the surface hardness of the sample sharply decreased after the cleansing by plasma-activated PR stripper solution. It can be considered that if physical surface-cleansing process is inserted after this, more effective elimination of HDI-PR is possible.

Thermo-Flow Analysis of Offset-Strip Fins according to Prandtl Number (Prandtl 수에 따른 옵셋 스트립 핀에서의 열 및 유동 분석)

  • Joo, Youn-Sik;Kong, Dong-Hyun;Lee, Kwan-Soo
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.21 no.6
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    • pp.340-346
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    • 2009
  • This paper numerically investigates thermo-flow characteristics of offset strip fins to obtain a correlation between heat transfer and pressure drop. The flow was divided into three regimes, i.e. laminar, transition and turbulent. The predicted j and f values from the SST k-$\omega$ turbulence model agreed with previous correlations with the error less than 20% in transition and turbulent regimes. Heat transfer and pressure drop were predicted by varying Prandtl number from 0.5 to 40. The Prandtl number showed little effects on pressure drop but had great effect on the heat transfer characteristics. An overall correlation to predict j was suggested by incorporating the effect of Pr and a new j correlation was suggested for each Pr.

Thermo-Flow Analysis of Offset-strip fins according to Prandtl Number (Plandtl 수에 따른 옵셋 스트립핀에서의 열 및 유동 분석)

  • Joo, Youn-Sik;Kim, Min-Soo;Lee, Kwan-Soo
    • Proceedings of the SAREK Conference
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    • 2008.11a
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    • pp.233-238
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    • 2008
  • This paper numerically investigates thermo-flow characteristics of offset strip fins to obtain a correlation between heat transfer and pressure drop. The flow was divided into three regimes, i.e. laminar, transition and turbulent. The predicted j and f values from the SST k-$\omega$ turbulence model agreed with previous correlations with the error less than 20% in transition and turbulent regimes. Heat transfer and pressure drop were predicted by varying Prandtl number from 0.5 to 40. The Prandtl number showed little effects on pressure drop but had great effect on the heat transfer characteristics. An overall correlation to predict j was suggested by incorporating the effect of Pr and a new j correlation was suggested for each Pr.

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A Study on Photoresist Strip Process using DIO3 (오존수를 이용한 감광막 제거 공정에 관한 연구)

  • Chai, Sang-Hoon;Son, Young-Soo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.17 no.11
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    • pp.1143-1148
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    • 2004
  • In this study, photoresist stripping in semiconductor or LCD (liquid crystal display) fabrication processes using DIO, was investigated. In order to obtain the high PR stripping efficiency of DIO. we have developed new ozone-generating system with high ozone concentration and ozone-resolving system with high contact ratio. In this study, we obtained ozone gas concentrations of 11 % by new ozone-generating system, ozone-resolving efficiency of 99.5 % and maximum solubility of 130 ppm in deionized water. We applied the newly designed equipments to photoresist stripping processes and obtained similar results to SPM(sulfuric-peroxide mixture) process characteristics.

Study on selective PR removal at Color filter process (Color Filter Process에서 선택적 Photoresist 제거방안에 대한 연구)

  • Lee, Sang-Eon;Park, Jung-Dae;Huh, Dong-Chul;Hah, Steve;Lee, Sun-Yong;Roh, Yong-Han
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.11a
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    • pp.95-96
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    • 2006
  • CMOS Image Sensor(CIS) 소자에서 광감도의 향상과 천연색 형성을 위하여 적용하고 있는 Color-Filter 공정에서 국부적으로 발생하는 strip성 불량과 막질손상을 제거하기 위한 연구를 진행하였다. 우선 지역적 경향성을 보이는 불량에 대해서는 PR strip process type을 액조 진행방식에서 회전식으로 변경했을 때 제거됨을 확인하였고, 막질손상을 최소화하기 위해서는 새로운 유기용매의 적용이 필요하였다. 실험 결과, 케톤기를 가지는 화합물과 Polar Apotic 용매의 혼합화합물을 적용하였을 때 각 막질에 attack을 최소화하면서 원하는 PR만 선택적으로 제거 되며 미세잔류성분에 대한 제거력도 향상됨을 확인하였다.

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DESIGN ANALYSIS OF OFFSET STRIP FIN HEAT EXCHANGER

  • Bhowmik, Himangshu;Lee, Kwan-Soo
    • Proceedings of the KSME Conference
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    • 2008.11b
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    • pp.2131-2136
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    • 2008
  • The characteristics of heat transfer and pressure drop in an offset strip fin heat exchanger was studied with a steady-state three dimensional numerical model. Flow Reynolds number $Re_{dh}$ ranged from 10 to 3500 and Prandtl number Pr ranged from 0.7 to 50. The dimensionless performance factors, i.e. 'the pumping power factor F' and 'the heat transfer performance factor J' were analyzed and obtained a relationship between them. Finally, the prediction of F and J factors was generalized for different Prandtl numbers.

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Semiconductor Wafer Cleaning and PR Strip Processes using Ozone (오존을 이용한 반도체 웨이퍼 세정 및 PR 제거 공정)

  • 채상훈;정현채;문세호;손영수
    • Proceedings of the IEEK Conference
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    • 2003.07b
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    • pp.1089-1092
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    • 2003
  • This paper has been studied on wafer cleaning and photoresist striping in semiconductor fabrication processes using ozone solved deionized water. In this work, we have developed high concentration ozone generating system and high contact ratio ozone solving system to get high efficiency DIO$_3$. Through this study, we obtained 11% ozone gas concentration, 99.5% of ozone efficiency and 51% of solubility in deionized water.

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Fabrication of Single Body Probe Pad using Polyimide Film (Polyimide Film을 이용한 일체형 탐침 패드의 제작)

  • Oh, Min-Sup;Kim, Chang-Kyo;Lee, Jae-Hong
    • Proceedings of the KIEE Conference
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    • 2011.07a
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    • pp.1704-1705
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    • 2011
  • MEMS(Micro Electro Mechanical Systems) 기술과 니켈 전기도금공정을 이용하여 수십 내지 수백개의 탐침을 갖는 일체형 탐침 패드(Probe Pad)를 제작하였다. PI(Polyimide) Film은 일본 UBE사의 $50{\mu}m$ 두께를 갖는 유피렉스를 사용하였다. 일체형 탐침 패드는 Polyimide Film에 Cu를 증착 후 사진식각공정을 통하여 PR Mold 형성한 후 전류가 흐르는 Cu 라인(line) 배선을 형성하기 위해 Cu를 식각하였으며 형성된 Cu Line 위에 니켈 전해도금공정을 실시하여 니켈 배선을 형성하였다. Ni 배선 위에 니켈 범프를 형성하기 위하여 PR Strip을 실시한 후 다시 PR Mold를 형성하였다. PR Mold 형성 후 다시 니켈 전해도 금을 실시하여 니켈 범프(bump)를 형성하였다. 제작된 탐침패드의 니켈배선의 폭은 $18.0{\mu}m$이고 피치(Pitch)는 $35{\mu}m$이며, 니켈 범프의 두께(Thickness)는 $10.0{\mu}m$로 제작되었다. 본 연구에서 제작된 탐침패드를 더욱 더 고집적화(Fine Pitch)하여 일체형 탐침 패드를 제작하게 되면 이를 사용하는 프로브유니트의 제작에 있어서 비용 절감 및 생산성(Throughput)을 크게 향상 시킬 수 있을 것이다.

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Change in Community Composition and Soil Carbon Stock Along Transitional Boundary in a Sub-Tropical Forest of Garhwal Himalaya

  • Kumar, Munesh;Kumar, Manish;Saleem, Sajid;Prasad, Sunil;Rajwar, G.S.
    • Journal of Forest and Environmental Science
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    • v.29 no.3
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    • pp.194-199
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    • 2013
  • The aim of the present study was to assess the effect of transitional boundary on community composition and soil carbon stock. Five vegetation types were recognized horizontally along the transitional strip based on the dominance of tree species i.e., Pure Anogeissus latifolia forest (P.AL), mixed Pinus roxburghii and Lannea coromandelica forest (M.PR&LC), pure Pinus roxburghii forest (P.PR), mixed Pinus roxburghii and Lannea coromandelica (M.PR&LC) and pure Anogeissus latifolia forest (P.AL). The results revealed that Anogeissus latifolia was reported dominant tree in the outer transitional boundaries of the forest, which reduced dominance of trees towards middle where Pinus roxburghii was found dominant. The soil carbon stock was reported higher in the Anogeissus latifolia dominant forest and reduced with the dominance of Pinus roxburghii in the middle site. Both the species are growing close to one another and competing for survival, but the aggressive nature of Anogeissus latifolia particular in this region may change new growth of Pinus roxburghii and will enhance soil carbon stock. But high anthropogenic pressure on Anogeissus latifolia tree species could be limited chance to further its flourish.