• Journal of the Korean Institute of Telematics and Electronics C
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• v.35C no.11
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• pp.21-30
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• 1998

In this paper, a digital current control system using a FPGA(Field Programmable Gate Array) was implemented, and the system was applied to an induction motor widely used as an industrial driving machine. The FPGA designed by VHDL(VHSIC Hardware Description Language) consists of a PWM(Pulse Width Modulation) generation block, a PWM protection block, a speed measuring block, a watch dog timer block, an interrupt control block, a decoder logic block, a wait control block and digital input and output blocks respectively. Dedicated clock inputs on the FPGA were used for high-speed execution, and an up-down counter and a latch block were designed in parallel, in order that the triangle wave could be operated at 40 MHz clock. When triangle wave is compared with many registers respectively, gate delay occurs from excessive fan-outs. To reduce the delay, two triangle wave registers were implemented in parallel. Amplitude and frequency of the triangle wave, and dead time of PWM could be changed by software. This FPGA was synthesized by pASIC 2SpDE and Synplify-Lite synthesis tool of Quick Logic company. The final simulation for worst cases was successfully performed under a Verilog HDL simulation environment. And the FPGA programmed for an 84 pin PLCC package was applied to digital current control system for 3-phase induction motor. The digital current control system of the 3 phase induction motor was configured using the DSP(TMS320C31-40 MHz), FPGA, A/D converter and Hall CT etc., and experimental results showed the effectiveness of the digital current control system.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.4
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• pp.175-182
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• 2017

In light emitting diode (LED) chip packaging, wire bonding is an important process that connects the LED chip on the lead frame pad with the Au wire and enables electrical operation for the next process. The wire bonding process is divided by two types: thermo compression bonding and ultrasonic bonding. Generally, the wire bonding process consists of three steps: 1st ball bonding that bonds the shape of the ball on the LED chip electrode, looping process that hangs the wire toward another connecting part with a loop shape, and 2nd stitch bonding that forms and bonds to another electrode. This study analyzed the factors affecting the LED die bonding processes to optimize the process capability that bonds a small Zener diode chip on the PLCC (plastic-leaded chip-carrier) LED package frame, and then applied response surface analysis. The design of experiment (DOE) was established considering the five factors, three levels, and four responses by analyzing the factors. As a result, the optimal conditions that meet all the response targets can be derived.

• The Transactions of the Korean Institute of Electrical Engineers A
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• v.48 no.12
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• pp.1554-1563
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• 1999

This paper presents the design of high speed processor for a sequence logic control using field programmable gate array(FPGA). The sequence logic controller is widely used for automating a variety of industrial plants. The FPGA designed by VHDL consists of program and data memory interface block, input and output block, instruction fetch and decoder block, register and ALU block, program counter block, debug control block respectively. Dedicated clock inputs in the FPGA were used for high speed execution, and also the program memory was separated from the data memory for high speed execution of the sequence instructions at 40 MHz clock. Therefore it was possible that sequence instructions could be operated at the same time during the instruction fetch cycle. In order to reduce the instruction decoding time and the interface time of the data memory interface, an instruction code size was implemented by 16 bits or 32 bits respectively. And the real time debug operation was implemented for easy debugging the designed processor. This FPGA was synthesized by pASIC 2 SpDE and Synplify-Lite synthesis tool of Quick Logic company. The final simulation for worst cases was successfully performed under a Verilog HDL simulation environment. And the FPGA programmed for an 84 pin PLCC package was applied to sequence control system with inputs and outputs of 256 points. The designed processor for the sequence logic was compared with the control system using the DSP(TM320C32-40MHz) and conventional PLC system. The designed processor for the sequence logic showed good performance.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.34C no.2
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• pp.1-11
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• 1997

We developed a base station modulator ASIC for CDMA digital cellular system. In CDMA digital cellular system, the modulation is performed by convolutional encoding and QPSK with spread spectrum. The function blocks of base station modulator are CRC, convolutional encoder, interleaver pseudo-moise scrambler, power control bit puncturing, walsh cover, QPSK, gain controller, combiner and multiplexer. Each function block was designed by the logic synthesis of VHDL codes. The VHDL code was described at register transfer level and the size of code is about 8,000 lines. The circuit simulation and logic simulation were performed by COMPASS tools. The chip (ES-C2212B CMB) contains 25,205 gates and 3 Kbit SRAM, and its chip size is 5.25 mm * 5,45 mm in 0.8 mm CMOS cell-based design technology. It is packaged in 68 pin PLCC and the power dissipation at 10MHz is 300 mW at 5V. The ASIC has been fully tested and successfully working on the CDMA base station system.