• 제목/요약/키워드: PF resin

검색결과 53건 처리시간 0.035초

Physical Properties of Hybrid Poplar Flakeboard Bonded with Alkaline Phenolic Soy Adhesives

  • Yang, In;Kuo, Monlin;Myers, Deland J.
    • Journal of the Korean Wood Science and Technology
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    • 제33권5호통권133호
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    • pp.66-75
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    • 2005
  • Soybean-based adhesives have recently been reconsidered as alternatives to petroleum-based adhesives due to the uncertainty of availability of petrochemical products and the increased demand for wood adhesives. This study was conducted to investigate the adhesive properties of alkaline phenolic soy (APS) resin for hybrid poplar flakeboard. The APS resin was formulated by crosslinking an alkaline soy flour hydrolyzate with lab-prepared PF resin in the soy hydrolyzate to PF resin weight ratios of 70/30, 60/40, and 50/50. The APS resins were used to fabricate homogeneous hybrid poplar flakeboards with different resin solid levels (5%, 7%, and 9%), press temperatures (175 and $200^{\circ}C$), and press times of 8 and 10 minutes. The IB, wet MOR, and dimensional stability properties of board improved with increasing press time, press temperature, and PF level in APS resins. Increasing press time can be used to offset poor IB strength associated with a 9% resin solid level and the excessive moisture content in the mat. The following conditions were concluded to meet the requirements of the CSA standard for exterior-grade flakeboard: a 50% PF level, a 5% resin content, a $200^{\circ}C$ press temperature, and an 8 minute press time.

Effect of universal adhesive pretreatments on the bond strength durability of conventional and adhesive resin cements to zirconia ceramic

  • Tae-Yub Kwon;Seung-Hee Han;Du-Hyeong Lee;Jin-Woo Park;Young Kyung Kim
    • The Journal of Advanced Prosthodontics
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    • 제16권2호
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    • pp.105-114
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    • 2024
  • PURPOSE. This study aimed to evaluate the effect of pretreatment of three different universal adhesives (Single Bond Universal [SBU], All-Bond Universal [ABU], and Prime&Bond universal [PBU]) on the bonding durability of an adhesive (Panavia F 2.0, PF) and a conventional (Duo-Link, DL) resin cements to air-abraded zirconia. MATERIALS AND METHODS. Rectangular-shaped zirconia specimens were prepared. The chemical composition and surface energy parameters of the materials were studied by Fourier transform infrared spectroscopy and contact angle measurement, respectively. To evaluate resin bonding to the zirconia, all the bonding specimens were immersed in water for 24 h and the specimens to be aged were additionally thermocycled 10000 times before the shear bond strength (SBS) test. RESULTS. The materials showed different surface energy parameters, including the degree of hydrophilicity/hydrophobicity. While the DL/CON (no pretreatment) showed the lowest SBS and a significant decrease in the value after thermocycling (P < .001), the PF/CON obtained a higher SBS value than the DL/CON (P < .001) and no decrease even after thermocycling (P = .839). When the universal adhesives were used with DL, their SBS values were higher than the CON (P < .05), but the trend was adhesive-specific. In conjunction with PF, the PF/SBU produced the highest SBS followed by the PF/ABU (P = .002), showing no significant decrease after thermocycling (P > .05). The initial SBS of the PF/PBU was similar to the PF/CON (P = .999), but the value decreased after thermocycling (P < .001). CONCLUSION. The universal adhesive pretreatment did not necessarily show a synergistic effect on the bonding performance of an adhesive resin cement, whereas the pretreatment was beneficial to bond strength and durability of a conventional resin cement.

목재 단판-대나무 제퍼 복합보드 제조: II. 복합보드의 성능에 미치는 제조조건의 영향 (Manufacture of Wood Veneer-Bamboo Zephyr Composite Board: II. Effect of Manufacturing Conditions on Properties of Composite Board)

  • 노정관
    • Journal of the Korean Wood Science and Technology
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    • 제35권6호
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    • pp.108-117
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    • 2007
  • 생장 기간이 매우 빠르고 섬유방향의 강도적 성질이 우수한 대나무를 합판의 원료로 이용하기 위하여 케루잉단판-솜대 zephyr 복합 패널(WBCB)의 제조 조건(수지접착제의 종류, 도포량, 도포방법)이 패널의 성능에 미치는 영향을 검토하였다. 수지의 종류에 따른 5-ply WBCB의 성능은 폴리메릭 이소시아네이트수지(PMDI)가 가장 좋은 결과를 나타내었으며, 이어 페놀수지(PF), 페놀 멜라민수지, 요소 멜라민수지 및 요소수지의 순이었다. 사용한 수지 중 강도적 측면과 작업성을 고려할 때 PF 수지에 의한 복합 패널 제조가 가장 적절한 것으로 생각된다. PF수지를 사용하여 제조한 12 mm 두께의 5-ply WBCB의 경우, 수지의 도포량이 증가하면 패널의 성능도 향상되는 경향이었다. 또한 박리강도 측정 후의 파괴양상은 도포량이 증가함에 따라 대나무 외층-대나무 내층 경계층의 파괴가 증가한 데 반하여 대나무 제퍼 내부층의 파괴는 상대적으로 감소하였다. 따라서 WBCB 제조시 수지가 다소 zephyr 내부까지 침투할 정도의 수지 도포량이 적절한 것으로 생각되며, 표면 단판의 오염성과 경제성 등을 고려할 때 $320g/m^2$이 가장 적합한 것으로 판단된다. 동일한 PF수지 도포량에서 수지의 도포방법을 달리하여 제조한 5-ply 복합 패널의 성능은 양면과 편면 스프레이 도포 간과 스프레이와 롤러에 의한 도포방법 간에 현저한 차이가 나타나지 않아 주어진 환경에서 작업성이 좋은 도포방법을 채택하면 될 것으로 생각된다.

Effect of Phenol Formaldehyde Impregnation on The Physical and Mechanical Properties of Soft-Inner Part of Oil Palm Trunk

  • Hartono, Rudi;Hidayat, Wahyu;Wahyudi, Imam;Febrianto, Fauzi;Dwianto, Wahyu;Jang, Jae-Hyuk;Kim, Nam-Hun
    • Journal of the Korean Wood Science and Technology
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    • 제44권6호
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    • pp.842-851
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    • 2016
  • The objective of this study was to improve physical and mechanical properties of soft-inner part of oil palm trunk (S-OPT) after impregnation with phenol formaldehyde (PF) resin and densification by close system compression (CSC) method. Effect of different methods of PF resin impregnation (i.e., no vacuum-pressure, vacuum, and vacuum-pressure) was evaluated. The results showed that PF resin impregnation and CSC significantly improved the physical and mechanical properties of S-OPT up to: (1) 176% in density; (2) 309% in modulus of rupture (MOR); (3) 287% modulus of elasticity (MOE); and (4) 191% in the compressive strength. Physical and mechanical properties of S-OPT showed their best performances when PF resin impregnated with vacuum-pressure method as shown by higher weight gain, density, MOR, MOE, compressive strength, and lower recovery of set due to better penetration of PF resin into S-OPT. Combining PF resin impregnation and densification by CSC method could be a good method to improve physical and mechanical properties of S-OPT.

Properties and Curing Behavior of Urea-Modified Phenolic Resins

  • Lee, Sang-Min;Park, Sang-Bum;Park, Jong-Young
    • 한국응용과학기술학회지
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    • 제24권4호
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    • pp.339-346
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    • 2007
  • The influence of adding urea to phenol-formaldehyde (PF) resins as a co-polymer component were investigated aiming at synthesizing useful phenol-urea-formaldehyde resins. Urea was added at 10% by total resin weight. Several methods for the addition of urea to the PF resins during synthesizing resins to see the co-polymerization occurs between urea and PF resins. The urea was added at the beginning, at three different middle stages, and at the end of PF resin synthesis. The copolymerized methylene bridges between phenol and urea molecules were not observed by $^{13}C-NMR;$ no signal around 50ppm. The curing of urea-modified PF resins, evaluated by dynamic mechanical analysis(DMA), showed some differences among the resins. DMA gel times ranged from 2.75 min to 3.25 min and the resins made with earlier urea additions showed slightly shorter gel times. The longest cure time and gelation time was observed for the resin PFU. Catalyst effects on the DMA cure time values of resins were not significant with different amounts of catalyst or different types of catalyst for all resins tested. Gel times of urea-modified PF resins shortened the most by triacetin catalyst.

Resol형 페놀수지의 합성과 반응특성 (Synthesis of Resol Type Phenol Resins and Their Reaction Properties)

  • 김동권;조지은;김정훈;박인준;이수복
    • 공업화학
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    • 제16권2호
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    • pp.288-291
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    • 2005
  • Resol형 페놀수지(phenol-formaldehyde (PF) resin)는 페놀(phenol: P)에 포름알데히드(formaldehyde: F)를 첨가하여 반응시키는 부가반응과 물을 제거하는 축합반응에 의해 합성된다. 본 연구에서는 부가반응 반응변수인 F/P몰비, 촉매의 농도, 반응온도 및 반응시간 등의 영향에 관하여 연구하였다. 또한 반응시간의 조절에 따른 합성된 페놀수지의 분자량과 점도에 미치는 영향을 조사하였다. 실험결과, 부가반응에서 촉매농도와 반응온도가 높아질수록 반응시간은 크게 감소되는 경향을 나타내었다. 또한 축합반응에서 페놀수지의 점도는 반응시간이 증가할수록 1500cps에서 9000 cps까지 증가하였고, 분자량은 500~1100 g/mol 범위의 저 분자량을 나타내었다.

저농도 페놀수지 주입처리에 의한 평죽판 개발(1) (Development of Compressed-flattened Bamboo Impregnated with Low Molecular Weight PF Resin(1))

  • 이화형;김관의
    • 한국가구학회지
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    • 제12권2호
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    • pp.29-38
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    • 2001
  • This study was carried out to develope a new process of flattening bamboo pieces(3 months old) by two steps of utilizing microwave oven and hot press. Internode bamboo pieces were impregnated with low molecular weight phenol formaldehyde resin (PF) under vacuum of 76 cmHg, heated in a household microwave oven in 1 minute, pressed on the temperature of $145^{\circ}C$ by the hot press for 10 minute, and then cooled by the cold press in their flattened form. The physical and mechanical . Properties of compressed flattened bamboo were as follows: 1) PF1(Mw:427) and PF2(Mw:246) sol. met the success of flattening of internode bamboo pieces in both of P. bambusoides and P. nigra var. PF2 showed the more plasticity to flatten the bamboo than PFI. The PF2 sol. with low molecular weight(Mw:246) gave the more weight gain than that of PF1 in the equal concentration. PF1 of 5% (NVC) and PF2 of 10% (NVC) sol. gave the best result for physical and mechanical properties and from a economical view point. 2) The PFI of 5% (NVC) sol. with low molecular weight decreased the water absorption of 62-63% and increased the bending strength (MaR) of 80-90%, compression strength of 43-54%. 3) The PF2 of 10% (NVC) sol. with low molecular weight decreased the water absorption of 56-57% and increased the bending strength (MaR) of 64-86%, compression strength of 39-63%.

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Phenol-Formaldehyde (PF) Resin Bonded Medium Density Fiberboard

  • Park, Byung-Dae;Riedl, Bernard;Park, Sang-Jin
    • Journal of the Korean Wood Science and Technology
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    • 제27권1호
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    • pp.64-71
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    • 1999
  • 본 연구는 통상적으로 충밀도 섬유판 제조에 사용되고있는 요소수지를 페놀수지로 대체함으로써 그 장단점을 찾아 보기 위해 실행되었다. 페놀수지을 이용해 제조한 중밀도 섬유판의 성능은 표준 요건을 충족시켰으며 높은 내구성을 보였다. 아울러 24 시간 냉수 침적후 두께팽창은 2 퍼센트 이하로 낮게 나타났다. 요소수지를 페놀수지로 대체했을 경우 단점들은 비교적 높은 수지함량 (8% 섬유전건종량기준)과 긴 열압시간 (7 분)으로 판명되었다. 이러한 결과들은 페놀수지을 사용한 중밀도 섬유판제조시 열압공정의 최적화가 되어야함을 시사하였다.

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Effect of Several Exterior Adhesive Types on Dimensional Stability of Bamboo Oriented Particleboard

  • Iswanto, Apri Heri;Munthe, Rensus;Darwis, Atmawi;Azhar, Irawati;Susilowati, Arida;Prabuningrum, Dita Sari;Fatriasari, Widya
    • 한국재료학회지
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    • 제29권5호
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    • pp.277-281
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    • 2019
  • The objective of this research is to evaluate the effect of adhesive types on dimensional stability of bamboo-oriented particleboard. The materials used in this research are bamboo tali(Gigantochloa apus J.A & J.H. Schult. Kurz), UF/MDI(8, 10, 12 % level), and MF, MDI, and PF at 7 % level. Particle and adhesive are mixed using a blending machine; then, mat forming and hot pressing processes are performed using adhesive-suitable temperature and time references. MDI resin is set at $160^{\circ}C$ temperature for 5 minutes. PF resin and MF resin are pressed at $170^{\circ}C$ for 10 minutes, and $140^{\circ}C$ for 10 minutes, respectively, while UF/MDI sets at temperature of $140^{\circ}C$ for 10 minutes. The results show that particleboard using PF resin produces the lowest thickness swelling value. The particleboard using UF/MDI resin also produces good response for thickness swelling value. Interesting things happen in that UF/MDI adhesive produces a thickness swelling value better than that of MDI resin. FTIR analysis on particleboard bonded by UF/MDI resin combination shows the presence of carbonyl group C=O vibration on multi substitution of urea at wave number of around $1,700cm^{-1}$.

단열재용 페놀폼의 물성과 열적특성 (Properties and Thermal Characteristics of Phenol Foam for Heat Insulating Materials)

  • 김동권;이수복
    • 공업화학
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    • 제17권4호
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    • pp.357-360
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    • 2006
  • 본 연구에서는 단열재로서의 페놀수지(PF) 발포폼의 물성과 응용가능성을 검토하였다. 실험결과 페놀수지 발포폼의 밀도는 $0.030g/cm^3$를 나타내었고, 열전도율은 $0.026kcal/m.h.^{\circ}C$를 나타내었다. 또한 페놀수지 발포폼은 $500^{\circ}C$로 1 h 동안 열을 가했을 경우 약 71.7 wt%가 휘발되었다. 그리고 페놀수지 발포폼의 화학구조는 단열재로서의 중요 물성인 closed cell 구조형태를 갖는 것으로 분석되었다. 따라서 제조된 페놀수지 발포폼은 단열소재로서의 우수한 물성을 갖는 것으로 확인되었다.