• Proceedings of the KIEE Conference
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• 1998.07g
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• pp.2518-2520
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• 1998

Silicon can be reactive ion etched (RIE) either isotropically or anisotropically. In this paper, a new micromachining technology combining these two etching characteristics is proposed. In the proposed method, the fabrication steps are as follows. First. a polysilicon layer, which is used as the bottom electrode, is deposited on the silicon wafer and patterned. Then the silicon substrate is etched anisotropically to a few micrometer depth that forms a cavity. Then an PECVD oxide layer is deposited to passivate the cavity side walls. The oxide layers at the top and bottom faces are removed while the passivation layers of the side walls are left. Then the substrate is etched again but in an isotropic etch condition to form a round trench with a larger radius than the anisotropic cavity. Then a sacrificial PECVD oxide layer is deposited and patterned. Then a polysilicon structural layer is deposited and patterned. This polysilicon layer forms a pivot structure of a rocker-arm. Finally, oxide sacrificial layers are etched away. This new micromachining technology is quite simpler than conventional method to fabricate joint structures, and the devices that are fabricated using this technology do not require a flexing structure for motion.

• Journal of the Semiconductor & Display Technology
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• v.12 no.3
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• pp.41-46
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• 2013

Efficient and inexpensive solar cells are necessary for photo-voltaic to be widely adopted for mainstream electricity generation. For this to occur, the recombination losses of charge carriers (i.e. electrons or holes) must be minimized using a surface passivation technique suitable for manufacturing. Recently it has been shown that aluminum oxide thin films are negatively charged dielectrics that provide excellent surface passivation of silicon solar cells to attract positive-charged holes. Especially aluminum oxide thin film is a quite suitable passivation on the rear side of p-type silicon solar cells. This paper, it demonstrate the interfacial microstructure and electrical properties of mono-crystalline silicon surface passivated by $Al_2O_3$ films during firing process as applied for screen-printed solar cells. The first task is a comparison of the interfacial microstructure and chemical bonds of PECVD $Al_2O_3$ and of PEALD $Al_2O_3$ films for the surface passivation of silicon. The second is to study electrical properties of double-stacked layers of PEALD $Al_2O_3$/PECVD SiN films after firing process in the temperature range of $650{\sim}950^{\circ}C$.

• Journal of the Korean Ceramic Society
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• v.31 no.2
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• pp.206-212
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• 1994

Effects of the film deposition process parameters on the properties such as deposition rate, etch rate, refractive index, stress and step coverage of plasma enhanced chemical vapor deposited (PECVD) tetraethylorthosilicate glass (TEOS) SiO2 film were investigated and analysed using SEM, FTIR and SIMS techniques. Increasing TEOS flow or decreasing O2 flow increased the deposition rate and the compressive stress of the oxide film but produced a less denser film. The deposition rate decreased owing to the decrease in the sticking coefficient of the TEOS and the O2 molecules onto the substrate Si with increasing the substrate temperature. Increasing the substrate temperature produced a denser film with a lower etch rate and the higher refractive index by lowering SiOH and moisture contents. Increasing the rf power increases the ion bombardment energy. This increase in energy, in turn, increases the deposition rate and tends to make the film denser. No appreciable changes were found in the deposition rate but the refractive index and the stress of the film decreased with increasing the deposition pressure. The carbon content in the plasma TEOS CVD oxide film prepared under our standard deposition conditions were very low according to the SIMS analysis results.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.830-833
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• 2003

This paper describes the fabrication and characteristics of 3C-SiCOI sotctures by SDB and etch-back technology for high-temperature MEMS applications. In this work, insulator layers were formed on a heteroepitaxial 3C-SiC film grown on a Si(001) wafer by thermal wet oxidation and PECVD process, successively. The pre-bonding of two polished PECVD oxide layers made the surface activation in HF and bonded under applied pressure. The wafer bonding characteristics were evaluated by the effect of HF concentration used in the surface treatment on the roughness of the oxide and pre-bonding strength. Hydrophilic character of the oxidized 3C-SiC film surface was investigated by ATR-FTIR. The strength of the bond was measured by tensile strengthmeter. The bonded interface was also analyzed by SEM. The properties of fabricated 3C-SiCOI structures using etch-back technology in TMAH solution were analyzed by XRD and SEM. These results indicate that the 3C-SiCOI structure will offers significant advantages in the high-temperature MEMS applications.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.406-406
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• 2011

최근 결정질 실리콘 태양전지 분야에서는 태양전지의 Voc와 Isc의 증가를 통한 효율 향상을 목적으로 후면 passivation 박막에 대한 연구가 활발하게 진행되고 있다. Local-Back Contact Cell은 최적화된 후면 passivation 박막을 이용한 태양전지 제조방법이다. 본 연구에서는 고효율의 LBC 태양전지 개발을 위해 Rapid Thermal Oxide(RTO)를 이용한 후면 passivation 박막에 screen printing을 이용한 point contact 구조의 LBC 태양전지를 제작하고 그 특성을 분석하였다. 본 연구에 사용된 RTO 박막은 O2와 N2, 2L/min의 조건에서 $850^{\circ}C$에서 3분 동안 열처리하여 성장시켰다. 이렇게 성장된 박막은 3nm의 두께로 형성되어 passivation 효과를 나타내었으며, carrier lifetime 측정 결과 37.8us의 값을 나타냈다. 전면 ARC형성을 위해 RTO 박막 위에 PECVD를 이용하여 SiNx passivation 처리를 하였고, 그 결과 carrier lifetime은 49.1us까지 향상하였다. 후면의 전극 형성을 위해 screen printing 방법으로 Al point contact을 형성하여 local 한 BSF를 형성 시켰으며, 이후 후면 전극 연결을 위한 방법으로 300nm의 두께로 full Al evaporation 공정을 진행 하였다. 결과적으로 RTO 후면 passivation 박막에 Al point contact 형성을 통해 제작된 태양전지는, Suns-Voc 579mV, FF 82.3%, 16.7%의 효율을 달성하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.387-390
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• 2002

SiC direct bonding technology is very attractive for both SiCOI(SiC-on-insulator) electric devices and SiC-MEMS(micro electro mechanical system) fields because of its application possibility in harsh environments. This paper presents pre-bonding techniques with variation of HF pre-treatment conditions for 2 inch SiC wafer direct bonding using PECVD(plasma enhanced chemical vapor deposition) oxide. The PECVD oxide was characterized by XPS(X-ray photoelectron spectrometer) and AFM(atomic force microscopy). The characteristics of the bonded sample were measured under different bonding conditions of HF concentration and an applied pressure. The bonding strength was evaluated by the tensile strength method. The bonded interface was analyzed by using IR camera and SEM(scanning electron microscope). Components existed in the interlayer were analyzed by using FT-IR(fourier transform infrared spectroscopy). The bonding strength was varied with HF pre-treatment conditions before the pre-bonding in the range of $5.3 kgf/cm^2$ to $15.5 kgf/cm^2$

• Journal of the Korean institute of surface engineering
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• v.30 no.2
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• pp.93-103
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• 1997

High temperature materials used in the elevated temperature and corrosive atmosphere must have the good oxidation resistance and preserve their own mechanical properties simultaneously. For the oxidation resistance, it is very important to form a protective oxide scale such as $Al_2O_3$ or $Cr_2O_3$ on the substrate. However, the additions of protective oxide forming elements such as Cr and Al in the alloy to enhance its oxidation resistance are limited due to the deleterious effects on their mechanical properties. PECVD(P1asma Enhanced Chemical Vapor Deposition) coating processes were employed to improve the oxidation resistance at high temperature. Cr and/or A1 were coated on the substrates of Ni and Inconel 600 at various temperatures of 400, 500, $600^{\circ}C$ and at different conditions of specimen surfaces. Then, coated specimens were exposed to isothermal and cyclic oxidation conditions in air at 1000 and $1100^{\circ}C$. In order to enhance the adhesion between the substrate and coated layer, heat treatments of the coated specimens were conducted in a vacuum. At isothermal oxidation experiments, Al-coated Ni specimen showed better oxidation resistance than pure Ni. At cyclic oxidation experiments at $1000^{\circ}C$. Cr and Al-coated specimen showed better oxidation resistance. Cr-coated Inconel 600 had also showed better oxidation resistance due to Cr in the substrate. By PECVD coating process, oxidation resistance could be improved, but it was not improved as expected due to the weakness of the adhesion between the substrate and the coated layer.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.180-180
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• 2010

The design and implementation of high rate deposition process and anti-scratch property of silicon oxide film by PECVD with UHF power were investigated according to the effect of UHF input power with HF bias. New regime of high rate deposition of SiOx films by hybrid plasma process was investigated. The dissociation of OMCTS (C8H24Si4O4) precursor was controlled by plasma processes. SiOx films were deposited on polyethylene terephthalate (PET) and polycarbonate substrate by plasma enhanced chemical vapor deposition (PECVD) using OMCTS with oxygen carrier gas. As the input energy increased, the deposition rate of SiOx film increased. The plasma diagnostics were performed by optical emission spectrometry. The deposition rate was characterized by alpha-step. The mechanical properties of the coatings were examined by nano-indenter and pencil hardness, respectively. The deposition rate of the SiOx films could be controlled by the appropriate intensity of excited neutrals, ionized atoms and UHF input power with HF bias at room temperature, as well as the dissociation of OMCTS.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.232.2-232.2
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• 2014

Since its discovery in 2004, graphene, a sp2-hybridized 2-Dimension carbon material, has drawn enormous attention. A variety of approaches have been attempted, such as epitaxial growth from silicon carbide, chemical reduction of graphene oxide and CVD. Among these approaches, the CVD process takes great attention due to its guarantee of high quality and large scale with high yield on various transition metals. After synthesis of graphene on metal substrate, the subsequent transfer process is needed to transfer graphene onto various target substrates, such as bubbling transfer, renewable epoxy transfer and wet etching transfer. However, those transfer processes are hard to control and inevitably induce defects to graphene film. Especially for wet etching transfer, the metal substrate is totally etched away, which is horrendous resources wasting, time consuming, and unsuitable for industry production. Thus, our group develops one-step process to directly grow graphene on glass substrate in plasma enhanced chemical vapor deposition (PECVD). Copper foil is used as catalyst to enhance the growth of graphene, as well as a temperature shield to provide relatively low temperature to glass substrate. The effect of growth time is reported that longer growth time will provide lower sheet resistance and higher VSG flakes. The VSG with conductivity of $800{\Omega}/sq$ and thickness of 270 nm grown on glass substrate can be obtained under 12 min growing time. The morphology is clearly showed by SEM image and Raman spectra that VSG film is composed of base layer of amorphous carbon and vertically arranged graphene flakes.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.121-122
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• 2011

광도파로 기반 센서의 성능을 개선시키기 위해서는 코어와 클래딩 층의 굴절률 차를 크게 하여 표면감도를 향상시켜야 한다. 이를 위해 센서용 광도파로 코어 층을 위한 고굴절률 SiNx 박막을 플라즈마 화학기상증착(PECVD, plasma enhanced chemical vapor deposition)법을 이용하여 성장한 후 그 표면특성을 분석하였다. 이 때 플라즈마 화학기상증착 공정 조건 중 NH3 가스를 제외하여 Si 성분이 많은 고굴절률 SiNx 박막의 성장을 유도하고 He/SiH4 가스유량비를 0에서 100까지 변화시켜 SiNx 박막의 표면거칠기를 제어하였다. Si기판 위에 SiNx 박막을 10분 성장 후 BOE(buffered oxide etchant)로 선택식각하여 그 박막두께를 alpha step으로 측정하는 방법으로 He/SiH4 가스유량비 조건별 박막성장률을 계산하였다. 그 결과 He/SiH4 가스유량비 증가함에 따라 박막성장률이 33 nm/min에서 19 nm/min으로 선형적인 감소함을 알 수 있었다. 박막두께가 190 nm가 되도록 He/SiH4 가스유량비 조건별 SiNx 박막을 성장한 후 그 표면특성을 AFM (atomic force microscope)으로 관찰하였다. 이를 통해 He/SiH4 가스유량비가 50일 때 SiNx 박막의 표면거칠기가 최소가 됨을 알 수 있었다.