• 분석과학
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• 제25권6호
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• pp.421-428
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• 2012

본 연구는 국내에서 배출되는 금속과 플라스틱 및 폐수처리시설 폐기물 중 유기오염물질류인 PCDD/PCDFs, PAHs, PCBs의 배출 특성을 파악하고자 수행하였다. PCDD/PCDFs의 농도는 비산재가 7.37~432.20 ng-TEQ/kg, 소각재는 0.51~855.01 ng-TEQ/kg, 분진의 0.37~385.81 ng-TEQ/kg 범위로 나타났으며 외국의 분석결과에 비해 다이옥신의 함량농도가 낮은 것으로 조사되었다. PAHs의 농도는 공정오니의 평균 함량농도가 0.0075~2.9225 mg/kg, 폐수처리오니는 0.0035~1.6716 mg/kg 범위로 나타나 해양환경관리법의 규제기준을 모두 만족하였으며, 공정오니 및 폐수슬러지의 PAHs 농도는 외국의 경우와 비교하여 다소 낮은 것으로 조사되었다. 또한, 해양환경보전법에서 관리하고 있는 PCBs 7 종을 분석한 결과(제 1기준 0.15 mg/kg 비교) 검출농도는 0.0~0.65 mg/kg으로 나타났으며, 일부 기계유 및 작동유에서 PCB-52, PCB-101, PCB-138, PCB-153 및 PCB-180 개별이성체가 초과되었다.

• 한국정밀공학회지
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• 제19권2호
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• pp.106-113
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• 2002

Stencil is used normally as a mask for seeder pasting on pad of PCB. The objective of this study is to develop stencil cutting system and determine optimal conditions which make good-quality stencil by using a Nd:YAG laser. The effects of process parameters such as laser power, type of mask, gas pressure, cutting speed and pulse width old the cut edge quality were investigated. In order to analyse fille cut surface characteristics(roughness, kerf width, dross) optical microscopy, SEM photography and roughness test were used. As a result, the optimal conditions of process parameters were determined, and the practical feasibility of the proposed system is also examined by using a commercial Gerber file for PCB stencil manufacturing.

• 한국전자파학회논문지
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• 제16권11호
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• pp.1099-1105
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• 2005

TRL 오차 수정 방법은 PCB 위에 제작된 고주파 소자를 측정할 때 많이 사용되는 방법이지만 오차 수정을 위해 제작된 표준 전송선 패턴의 특성 임피던스를 알아야만 보다 정확하게 측정 오차를 수정할 수 있다. 기존의 방법에서는 저항을 종단 처리한 표준 패턴을 추가로 이용하여 전송선의 단위 길이당 커패시턴스를 계산하고 주파수에 대해 fitting하는 방법으로 표준 전송선의 특성 임피던스를 계산하고 있으나 제작상의 부정확성에 의해 추출된 특성 임피던스가 영향을 받고 있음을 확인하였다. 본 논문에서는 측정된 S-parameter를 이용하여 제작상의 부정확성을 줄일 수 있고 기존 방법보다 정확한 특성 임피던스를 추출할 수 있다.

• 한국기계가공학회지
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• 제4권4호
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• pp.54-60
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• 2005

In a $CO_2$ inverter welding machine, stable arcs can be generated and a welding performance that is a goal of welding can be improved when stable electric power with a low voltage and a high current is supplied to a electrode that is the secondary part (output load terminal) and the base metal. For such a stable power supply, therefore, the AC arc welding machine, the thyristor welder, and the inverter welder have been developed in order according to development of the power electronics techniques. Up to now, the thyristor welding machine is still broadly used but the application volume is gradually reduced by development of the inverter welder. Because the welding performance of the inverter welder is very good and the weight and size of the welder is remarkably light and small. The final goal of this research is to develop the voltage loss compensator that is a drawback of the inverter welder and improve the welding performance using the developed compensator.

• 한국생산제조학회지
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• 제25권3호
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• pp.230-236
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• 2016

This research attempted simplifications to the LED street light for price competitiveness. The street light was simplified by replacing the SMPS with an IC driver on the PCB using an AC-type LED. The optical element that shape of a line-shaped lens covered LED crowded. Thus, this study aims to improve LED efficiency by using the minimum optical system. In order to satisfy the M3 regulation of street lighting at grade, the lens was divided into two parts depending on the forward direction of the light. Further, the changes in the number of LEDs located on part 1 and part 2 of the lens were analyzed. Through simulation, we determined the proper light distribution that meets M3 regulation of street lighting.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.545-545
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• 2007

Recently, innovative process has been investigated in order to replace the conventional high-cost micro patterning processes on the electronic products. To produce desirable profit margins from this low cost products, printed circuit board(PCB), will require dramatic changes in the current manufacturing philosophies and processes. Innovative process using metal nano particles replaces the current industry standard of subtractive etched of copper as a highly efficient way to produce robust circuitry on low cost substrates. An advantage of using metal nano particles process in patterned conductive line manufacturing is that the process is additive. Material is only deposited in desired locations, thereby reducing the amount of chemical and material waste. Simply, it just draws on the substrate as glass epoxy or polyimide with metal nano particles. Particles, when their size becomes nano-meter scale, show some specific characteristics such as enhanced reactivity of surface atoms, decrease in melting point, high electric conductivity compared with the bulk. Melting temperature of metal gets low, the metal nano particles could be formated onto polymer substrates and sintered under $300^{\circ}C$, which would be applied in PCB. It can be getting the metal line of excellent electric conductivity.

• 반도체디스플레이기술학회지
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• 제8권2호
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• pp.15-21
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• 2009

Atmospheric pressure plasma equipment was successfully applied to the flip chip BGA manufacturing process to improve the uniformity of flux printing process. The problem was characterized as shrinkage of the printed flux layer due to insufficient surface energy of the flip chip BGA substrate. To improve the hydrophilic characteristics of the flip chip BGA substrate, remote DBD type atmospheric pressure plasma equipment was developed and adapted to the flux print process. The equipment enhanced the surface energy of the substrate to reasonable level and made the flux be distributed over the entire flip chip BGA substrate uniformly. This research was the first adaptation of the atmospheric pressure plasma equipment to the flip chip BGA manufacturing process and a lot of possible applications are supposed to be extended to other PCB manufacturing processes such as organic cleaning, etc.

• 한국IT서비스학회지
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• 제13권4호
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• pp.139-153
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• 2014

The purpose of this study is to examine the impact of relationship quality on customer value, customer satisfaction and relationship retention intention in the B2B transaction relationship. For the empirical study, we conducted a survey of the PCB corporation's client companies and used 110 surveys of them for analysis. The results of this study are summarized as follows : First, trust, relationship satisfaction, unity and performance as factors of relationship quality had significantly positive effect on relationship retention intention by the medium of customer satisfaction. Second, utilitarian value which is a parameter did not have significantly effect on customer satisfaction and relationship retention intention. Whereas, hedonic value which is influenced by relationship satisfaction, unity and performance had significantly positive effect on customer satisfaction and relationship retention intention. These results are not treated weightily in the preceding studies and managing the hedonic value in B2B transaction relationship is considered important to improve the customer satisfaction and relationship retention intention.

• 한국전기전자재료학회논문지
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• 제21권3호
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• pp.265-271
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• 2008

TCP(Tape Carrier Package), COG (Chip On Glass), COF(Chip On Film) are three methods for connecting LDI(LCD Driver IC) with LCD panels. Especially COF is growing its portion of market place because of low cost and fine pitch correspondence. But COF has a problem of the lead broken failure in LCD module process and the usage of customer. During PCB (Printed Circuit Board) bonding process, the mismatch of the coefficient of thermal expansion between PCB and D-IC makes stress-concentration in COF lead, and also D-IC bending process during module assembly process makes the level of stress in COF lead higher. As an affecting factors of lead-broken failure, the effects of SR(Solder Resister) coating on the COF lead, surface roughness and grain size of COF lead, PI(Polyimide) film thickness, lead width and the ACF(Anisotropic Conductive Film) overlap were studied, The optimization of these affecting manufacturing processes and materials were suggested and verified to prevent the lead-broken failure.

• 한국정밀공학회지
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• 제27권12호
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• pp.92-98
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• 2010

The design of press bonding tool in LCD module equipment is a very complex and difficult task because many design able variables are involved while their effects are not known. It takes longtime experiments and much expenses to verify the effects of these design variables. However the optimization of bonding tool using OLB(outer lead bonding) and PCB Bonding is a very important problem in LCD manufacturing process, so much design efforts have been made for improving the bonding tool performance. In this paper, a reasonable and fast process which gives optimized solution under the design requirements has been presented. Both analytical and statistical methods are employed in this process. A reliable analytic model using experiment-oriented FE analysis can be obtained, in which the regression equations that predict the tool efficiency from various DOE method are found. Improvement of tool efficiency could be estimated by the regression equations using meaningful factors converged by RSM(Response Surface Method). With this process a reasonable optimized solution that meets a variety of design requirements can be easily obtained.