• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 D
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• pp.2241-2242
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• 2006

As developing the information society, Lighting Emitted diode(LED) which is light source for illumination of next generation is attracted public attention. LED have many problem as narrow light view angle, high price, drift phenomenon of color coordinate, high heating problem for lower power, lower weight and small size. So, many researches have continued in a illumination as LED module type. in this problem, heating problem is very important and difficult and that is caused in decreasing phenomenon of brightness and drift phenomenon of color coordinate. so the problem of heating is urgent question for illumination of LED. In this paper, structural design of PCB changed as two type for solving the heating problem. also the properties of heating is analysed and optical properties is measured with heating image camera and spectrometer according to change in this design.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 B
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• pp.1275-1276
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• 2006

As developing the information society, Lighting Emitted diode(LED) which is light source for illumination of next generation is attracted public attention. LED have many problem as narrow light view angle, high price, drift phenomenon of color coordinate, high heating problem for lower power, lower weight and small size. So, many researches have continued in a illumination as LED module type. in this problem, heating problem is very important and difficult and that is caused in decreasing phenomenon of brightness and drift phenomenon of color coordinate. so the problem of heating is urgent question for illumination of LED. In this paper, structural design of PCB changed as two type for solving the heating problem. also the properties of heating is analysed and optical properties is measured with heating image camera and spectrometer according to change in this design.

• 한국정보통신학회:학술대회논문집
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• 한국정보통신학회 2013년도 추계학술대회
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• pp.386-389
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• 2013

본 논문에서는 Processor와 DDR2 사이에 인터페이스되는 고속신호의 Signal Integrity 해석을 위해 IC Chip의 IBIS Model과 Transmission Line의 S-Parameter를 이용하여 고속신호의 Transient 해석을 수행하고 Eye Diagram을 생성하였다. 고속으로 동작하는 DQ, DQS/DQSb 신호 및 Clock, Address, Control 신호의 Eye Diagram에서 Setup/Hold 구간동안 Timing Margin과 Voltage Margin을 측정하였으며 Over-/Under-shoot 및 Differential 신호의 Cross Point가 Spec에 만족하는지 확인하여 신호의 품질을 확보하였다.

• 설비공학논문집
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• 제17권12호
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• pp.1169-1176
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• 2005

In this paper, thermal reliability of a closed type BLDC (Brushless DC) motor for high speed axial fan was analyzed by the accelerated life test. The closed type BLDC (Model No. MB1-8855-J01) motor was controlled by PCB module, which was composed of various electrical components. The failure of the closed type BLDC motor happened in PCB module due to high temperature. Failure mechanism of the closed type BLDC motor appears to be electrolyte dry out of capacitor. The accelerate life test was performed in temperature stress of $85^{\circ}C\;and\;105^{\circ}C$, respectively The failure data from the accelerated life test were analyzed and the life in each stress level was estimated with 960h and 261 h. At last, both life expression according to operating temperature of PCB module and life of the closed type BLBC motor in normal condition $(50^{\circ}C)$ were suggested.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 춘계학술대회 논문집 반도체 재료 센서 박막재료 전자세라믹스
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• pp.150-152
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• 2004

The number of layers in rigid PCB(printed circuit board) is restricted, so the number of components can be embedded in module is restricted also. But using flexible multilayer PCB, the layers over than 7 can be evaluated. In this study, to verify the possibility of application of flexible multilayer PCB to RF modules, multilayered embedded capacitor is fabricated and analyzed. The characteristics of embedded capacitor is analyzed and compared to that of MLCC and LTCC capacitor. Embedded capacitor has better electrical features than MLCC and compatible one to LTCC capacitor.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2000년도 제15차 학술회의논문집
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• pp.295-295
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• 2000

In this paper, the measurement algorithm of PCB alignment error is developed using image processing. The X-Y-$\theta$ table correcting PCB alignment error is driven by drive module based on microprocessor according to calculation results obtained through image processing procedure. In order to recognize the X-Y-$\theta$ position errors, two fiducial points are marked on PCB and two cameras of ultraviolet rays types are used for detection of the points to capture exactly fiducial points under disturbance of illumination change. Through application for a practical screen printer, the precision control using the developed position control system can be realized about 2.5${\mu}{\textrm}{m}$ in table moving range and 8${\mu}{\textrm}{m}$ in camera processing precision.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2015년도 제46회 하계학술대회
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• pp.137-138
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• 2015

본 논문은 알루미늄 재질로 된 방열판을 LED조명기구에 적용해서 열 해석을 한 것으로서, PCB에 25[W]급 LED를 배치하여 COMSOL Multi-physics로 시뮬레이션 하였다. 그 결과 LED와 PCB 경계면의 온도는 $69^{\circ}C$이고, PCB바닥면의 온도는 $28^{\circ}C$로 실제작한 FR-4 재질의 LED Module과 근접한 온도임을 확인 할 수 있었다.

• 한국산학기술학회논문지
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• 제15권5호
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• pp.2567-2572
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• 2014

본 연구개발은 PCB소자 분리에 있어 개별적 레이저 커팅의 문제점을 개선하는 것으로, 다수개의 PCB소자가 결합된 PCB시트를 단시간에 커팅 할 수 있는 멀티지그 개발이 목적이다. 설계는 베이스프레임에 PCB서포터가 안착, 모델별 PCB서포터가 분리가능하게 설계 하였으며, 상부 레이저 투과공의 고정을 위하여 네오디움 자석을 양쪽에 각각 채택 지그를 완료 하였다. 개발성과는 하나의 베이스프레임으로 다양한 규격의 PCB소자 및 모듈의 고정과, PCB소자에 연결된 브릿지의 컷팅작업이 가능하도록 설계, 프레임제작과 교체에 소요되는 시간과 비용을 줄여 생산원가의 절감형 지그 개발로, 기존 타발식에 비해 정밀도 약 70% 상향 및 시설 투자비 약 400%를 절감하였다.

• 한국표면공학회지
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• 제49권2호
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• pp.218-224
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• 2016

Thermal radiation pastes were prepared by dispersing carbon materials as fillers with a content of 1 weight percent in an acrylic resin. The kind of fillers was as follows; $25{\mu}m$ graphite, $45{\mu}m$ graphite, $15{\mu}m$ carbon nanotube(CNT), a 1:1 mixture of $25{\mu}m$ graphite and $15{\mu}m$ CNT, and a 1:1 mixture of $45{\mu}m$ graphite and $15{\mu}m$ CNT. Thermal emissivity was measured as 0.890 for the samples with graphite only, 0.893 for that with CNT only, and 0.892 for those containing both. After coating prepared pastes on a side of 0.4 mm thick aluminium plate and placing the plate over an opening of a box maintained at $92^{\circ}C$ with the coated side out, the temperatures on the uncoated side of the plates were measured. The samples containing graphite and CNT showed the lowest temperatures. The paste with mixed fillers was coated on the back side of the PCB of an LED module and thermal analysis was carried out using Thermal Transient Tester (T3ster) in a still air box. The thermal resistance of the module with coated PCB was measured as 14.34 K/W whereas that with uncoated PCB was 15.02 K/W. The structure function analysis of T3ster data revealed that the difference between junction and ambient temperatures was $13.8^{\circ}C$ for the coated case and $18.0^{\circ}C$ for the uncoated. From the infrared images of heated LED modules, the hottest-spot temperature of the module with coated PCB was lower than that of the uncoated one for a given period of LED operation.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1991년도 한국자동제어학술회의논문집(국제학술편); KOEX, Seoul; 22-24 Oct. 1991
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• pp.1915-1919
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• 1991

The efficiency of automated assembly line is increased by realizing the automation of each assembly cell, monitoring the line information and developing the real-time line control system it. which production flow is controllable. In this paper, the several modules which are important factors when constructing automated real-time control system, such as, line control S/W module, real-time model change module, error handling module and line production management S/W module, are developed. For developing these important programming modules, real-time control and multi-tasking techniques are integrated. In this paper, operating method of real-time line control in PCB automated assembly line is proposed and for effective control of production line by using multi-tasking technique, proper operating method for relating real-time line control with multi-tasking is proposed by defining the levels of signals and tasks. CIM-Oriented modular programming method considering expandability and flexibility will be added for further research in the future.