• 대한전기학회:학술대회논문집
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• 대한전기학회 2009년도 제40회 하계학술대회
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• pp.1605_1606
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• 2009

본 논문은 LED조명기구 방열설계의 열해석에 관한 것으로서 메탈 PCB에 Chip LED를 배치하여 COMSOL Multiphysics로 시뮬레이션한 결과 LED와 PCB의 경계면 온도는 약 $80^{\circ}C$이며, PCB의 바닥면까지는 약 $50^{\circ}C$까지 변화함을 검증 하였으며, 결과적으로 실 제작의 근사치에 가까운 방열설계가 가능함이 확인되었다.

• JSTS:Journal of Semiconductor Technology and Science
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• 제11권4호
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• pp.295-301
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• 2011

A triple-band transceiver module for 2.3/2.5/3.5 GHz mobile WiMAX, IEEE 802.16e, applications is introduced. The suggested transceiver module consists of RFIC, reconfigurable/multi-resonance MIMO antenna, embedded PCB, mobile WiMAX base band, memory and channel selection front-end module. The RFIC is fabricated in $0.13{\mu}m$ RF CMOS process and has 3.5 dB noise figure(NF) of receiver and 1 dBm maximum power of transmitter with 68-pin QFN package, $8{\times}8\;mm^2$ area. The area reduction of transceiver module is achieved by using embedded PCB which decreases area by 9% of the area of transceiver module with normal PCB. The developed triple-band mobile WiMAX transceiver module is tested by performing radio conformance test(RCT) and measuring carrier to interference plus noise ratio (CINR) and received signal strength indication (RSSI) in each 2.3/2.5/3.5 GHz frequency.

• 한국전자파학회논문지
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• 제30권6호
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• pp.518-521
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• 2019

본 논문에서는 상용 트랜스미터 칩과 패치 어레이 안테나를 결합하여 60 GHz 대역에서 동작하는 능동 안테나 모듈을 설계, 제작하였다. 설계된 모듈은 안테나 PCB와 트랜스미터 칩이 장착된 송신 모듈 PCB가 결합되는 구조로 하였다. 주파수 제어신호 및 바이어스 제어신호는 아두이노 키트를 사용하여 인가하였으며, 기저대역의 I/Q 신호가 트랜스미터 칩으로 인가될 수 있도록 하였다. 송신 모듈의 출력은 단일 출력으로 안테나에 연결되므로 차동 출력을 내는 트랜스미터 칩의 출력을 링 하이브리드 발룬에 전달하고, 이를 초소형 상용 커넥터로 $2{\times}4$ 마이크로스트립 패치 어레이 안테나 PCB로 전달되도록 하였다. 최종 출력되는 밀리미터파 신호의 방사패턴 측정을 통하여 시뮬레이션 결과와 비교하는 방식으로 확인하였다. 제작된 능동 안테나 모듈의 방사패턴 측정 결과, 3 dB 빔폭과 null 포인트의 위치가 시뮬레이션 결과와 잘 일치함을 확인하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.270-270
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• 2007

전자 산업의 발달로 인해 전자기기에 소형화, 경량화 및 다기능화가 요구되면서 민쇄회로기판(PCB)에도 고밀도화, 고집적회가 필요하게 되었다. 이에 따라 embedded passive 기술을 이용하여 기판 내부에 가능한 많은 수동소자들을 실장시키려는 노력이 진행되어지고 있다. 가장 수요가 많은 capacitor의 경우 부피와 전기적 특성 측면에서 내장 효과가 가장 큰 passive 소자에 해당한다. 본 연구에서는 내장형 capacitor의 유전재료로서 중요한 $BaTiO_3$ powder를 filler로 사용하여 epoxy/BT 복합체에서 filler의 분율에 따른 유전상수률 측정하고, filler의 열처리에 따른 유전상수의 변화를 관찰하였다. 그러고 이들 복합체의 mixing rule과 미세구조 관찰을 통하여 기판용 RCC 소재로서의 적용성을 평가하고자 하였다.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2009년도 추계학술대회 논문집
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• pp.421-426
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• 2009

This paper presents vibration analysis of maskless exposure module in Printed Circuit Board (PCB) manufacturing system. In order to complete exposure process in PCB, masking type module has been widely used in electronics industries. However, masking process confronts some limitations of application due to higher production cost for masking as well as lower printing resolution. Therefore, maskless exposure module is started to be in the spotlight for flexible production system to meet the needs of fabrication in variable patterns at low cost. Since maskless exposure process adopts direct patterning to PCB, vibration problems become more critical compared to conventional masking type process. Moreover, movements of exposure engine as well as stage generate vibration sources in the system. Thus, it is imperative to analyze the vibration characteristics for the maskless exposure module to improve the quality and accuracy of PCB. In this study, vibration analysis using the Finite Element Analysis is conducted to identify the critical structural parts deteriorating vibration performance. Also, Experimental investigations are conducted by single/dual encoder measurement process under the operating module speed. Measurement points of vibration are selected by three places, which are base of stage, exposure engine and top of stage, to check the effect of vibration from the exposure engine. Comparisons between analysis results and experimental measurement are conducted to confirm the accuracy of analysis results including the developed FE model. Finally, this studies show feasibility of optimal design using the developed FE analysis model.

• 한국소음진동공학회논문집
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• 제19권12호
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• pp.1322-1328
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• 2009

This paper presents vibration analysis of maskless exposure module in printed circuit board(PCB) manufacturing system. In order to complete exposure process in PCB, masking type module has been widely used in electronics industries. However, masking process confronts some limitations of application due to higher production cost for masking as well as lower printing resolution. Therefore, maskless exposure module is started to be in the spotlight for flexible production system to meet the needs of fabrication in variable patterns at low cost. Since maskless exposure process adopts direct patterning to PCB, vibration problems become more critical compared to conventional masking type process. Moreover, movements of exposure engine as well as stage generate vibration sources in the system. Thus, it is imperative to analyze the vibration characteristics for the maskless exposure module to improve the quality and accuracy of PCB. In this study, vibration analysis using the finite element analysis is conducted to identify the critical structural parts deteriorating vibration performance. Also, Experimental investigations are conducted by single/dual encoder measurement process under the operating module speed. Measurement points of vibration are selected by three places, which are base of stage, exposure engine and top of stage, to check the effect of vibration from the exposure engine. Comparisons between analysis results and experimental measurement are conducted to confirm the accuracy of analysis results including the developed FE model. Finally, this studies show feasibility of optimal design using the developed FE analysis model.

• 대한기계학회논문집
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• 제18권10호
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• pp.2751-2761
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• 1994

A numerical investigation on the three-dimensional laminar natural convection heat transfer in the periodically fully developed PCB channel has been performed. When heat generating blocks mounted on the adiabatic wall make a channel with their facing shrouding wall, the flow inside the channel becomes periodically fully developed. A single module in the periodically fully developed region is chosen for computational domain in order to save computer storage and computational time. The periodic boundary condition is applied in the anlaysis. The effects of the parameters such as the Rayleigh number, the number of the modules, and the height of channel are examined to obtain the optimum condition for the enhancement of the cooling effectiveness. The result shows that the cooling effect is improved with increasing Rayleigh number and channel height, and decreasing the number of the module. The result also indicates that increasing the height of the channel and number of the module is recommended for a limited space.

• 한국태양에너지학회 논문집
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• 제31권4호
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• pp.95-102
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• 2011

In this paper, the thermal performance of a heat spreader module for CPV(Concentrating Photovoltaic) cooling is experimentally investigated. In order to evaluate the thermal performance of the heat spreader module which consists of a Metal PCB and an aluminum alloy heat spreader, experiments are conducted with varying the type of the metal PCB, the thickness of the heat spreader, the inclination angle, and the applied heat flux. To validate the experimental data, three dimensional numerical simulations are performed using the commercial simulation tool in the present work. The experimental results are compared with the corresponding numerical results and are in close agreement with the numerical results. From the experimental results, the temperature difference between the maximum temperature and the ambient temperature increases with decreasing the thickness of the heat spreader and with increasing the applied heat flux. Also, it is found that the inclination angle significantly affects the thermal performance of the heat spreader. the maximum temperature difference of the heat spreader with the horizontal orientation is much larger than that with the vertical orientation.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2006년도 SMT/PCB 기술세미나
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• pp.1-14
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• 2006

[ $\blacklozenge$ ] PCB에 있어서 Embedded passive 는chip을 직접 내장하는 방법과 특별한 특성을 갖는 재료 및 공법을 사용하여 chip 응 대치하는 방법이 있다. $\blacklozenge$ Embedded passive PCB가 적용될 수 있는 유력한 적용 분야는 소형화가가 요구되는 분야와 고속 특성이 요구되는 분야를 들 수 있고, 따라서, Module, SOP/SIP, Package substrate 등이 우선적으로 적용될 수 있는 분야다. $\blacklozenge$ Embedded capacitor를 적용한 경우, 일반적인 chip capacitor를 적용한 경우보다 더 좋은 전기적인 특성(SRF, Q)을 얻을 수 있으며, solder joint 등의 영향을 포함하면 더욱 좋은 특성이 얻어질 수 있다. $\blacklozenge$ Embedded passive 의 상용화를 위해서, 공차를 관리하는 방법의 개발과 공차에 대한 합리적인 규격을 설정하는 것이 우선 과제이다. $\blacklozenge$ Embedded resistor 의 경우, Laser trim을 적용하여 ${\pm}\;5\%$ 또는 그 이하의 공차를 실현할 수 있고, $30\;K\Omega/sq$. 의 고저항의 적용까지 가능하다. $\blacklozenge$ 고속 신호에서의 noise 감소, module, SIP/SOP 의 소형화를 실현하는데 Embedded passive(혹은 active)PCB 가 기여 할 수 있을 것이고, 이를 위하여 Set 업체, PCB 업체, 재료 업체간의 지속적인 협조가 필요할 것이다.

• 한국태양에너지학회:학술대회논문집
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• 한국태양에너지학회 2012년도 춘계학술발표대회 논문집
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• pp.102-107
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• 2012

The purpose of thesis is to improve output of solar cell module by enhancing transmission efficiency. To improve transmission efficiency, transmission interconnection ribbon which is used to connect solar cells and busbar which contacts with it has been improved. To secure reliability, comparison research on output of solar cell modules has been conducted by manufacturing PCB module formed by laminated metal with the same output. The result of this research is based on a output efficiency test of modules by comparing electric conductivity of soldering busbar and laminated PCV type of busbar.