• Journal of the Institute of Convergence Signal Processing
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• v.16 no.3
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• pp.90-95
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• 2015

This study presents a method to test quite small-sized and light-weighted micro-drill bits which are used to make holes in printed circuit boards(PCB). After getting images of micro-drill bits through the high resolution microscope, we developed image processing algorithms to detect fiducial points, and then measured diverse factors of the drill-bit based on these points. We also developed the window-based inspection system to automatically discriminate normal and abnormal status. For the relative comparison of its performance, the system was compared with an existing inspection system using test images. Experimental results showed that the proposed system slightly improved performance, and also classified correctly some misjudged errors which were occurred in the existing system.

• 제어로봇시스템학회:학술대회논문집
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• 1997.10a
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• pp.1742-1745
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• 1997

We have developed a highly responsible probing system for inspection of electrical properties of assemble PCB$_{s}$ (printed circuit boards). However, as the duration of the impact occurring between a probe and a solder joint on PCB is very short, it is very difficult to control the harmful peak impact force and the slip motion of the probe to sufficient level only by its vorce feedback control with high gains. To overcome these disadvantages of the prototype, it needs ot obtain some information of the solder joint in advance before the contact. In addition, to guarantee the reliability of the probing task, the probing system is required to measure several points around the probale target point at high speed. There fore, to meet such requirements, we propose a new noncontaet sensor capable of detecting simultaneously position and normal vectors of the multiple points around the probable target point in real time. By using this information, we can prepare a control strategy for stable contact motion on impact. In this paper, we described measuring priniciple, design, and development of the sensor. The effectiveness of the proposed sensor is verified through a series of experiments.s.

• Journal of Institute of Control, Robotics and Systems
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• v.21 no.3
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• pp.276-282
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• 2015

This paper proposes a SMD (surface mounting device) classification method for the PCB assembly inspection machines. The package types of SMD components should be classified to create the job program of the inspection machine. In order to reduce the creation time of job program, we developed the automatic classification algorithm for the SMD packages. We identified the chip-type packages by color and edge distribution of the images. The input images are transformed into the HSI color model, and the binarized histroms are extracted for H and S spaces. Also the edges are extracted from the binarized image, and quantized histograms are obtained for horizontal and vertical direction. The neural network is then applied to classify the package types from the histogram inputs. The experimental results are presented to verify the usefulness of the proposed method.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.11
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• pp.5471-5478
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• 2012

In this paper, we propose a new short-circuit detecting method which can detect bad short-circuits, one of bad types occurring in PCB(Printed Circuit Board), by using SURF(Speeded-Up Robust Features) algorithm. The basic procedure in the proposed method sequentially consists of extracting features from both sample and inputted images by SURF, performing perspective transform by feature matching and matching results, extracting check areas of interest, binary coding and extracting short-circuits, and verifying results. The proposed method focuses on the robustness which can detect bad short-circuits even though the position and angle of PCB are not uniform and arbitrarily placed. Experimental results show that our method enables to detect bad short-circuits regardless of the location and angle of PCB placed variously and validate that the proposed method outperforms the conventional methods detecting bad short-circuits manually on the aspect of both the detection rate and time.

• Applied Chemistry for Engineering
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• v.24 no.6
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• pp.593-598
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• 2013

In this study, we have evaluated the water absorption phenomenon of photoresist dry film, which is commonly used to build circuits on PCB (Printed Circuit Board) by photolithography, by using ATR-FTIR (Attenuated Total Reflectance-Fourier Transform Infrared). We have firstly observed significant change in fracture mode of dry film with respect to temperature and humidity, which we assumed the material transition from ductile to brittle. Secondly, we have established the process of absorption test for determining the diffusion coefficients of water into the dry film both with gravimeter and ATR-FTIR. We have successfully calculated the diffusion coefficients for each environmental conditions from the results which we achieved by gravimeter and ATR-FTIR. Compared to the gravimeter which is a conventional method for absorption test, the ATR-FTIR method in this study has been found to be very easy to use and have the same accuracy as gravimeter. Moreover, we are expecting to use the ATR-FTIR as an appropriate method to study the absorption phenomena related to any kinds of solvent and polymer system.

• Journal of Korea Multimedia Society
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• v.21 no.6
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• pp.649-658
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• 2018

In this paper, we propose a mechanical contact inner tap inspection system that can inspect the defect of the inner tap immediately after inner tap is processed within the machining center. The inspection module has the collet chuck structure, so it can mounted on the main spindle of the machining center during inspection. It was developed with a focus on inspection for tap having 20 mm depth which is primarily fabricated in automotive parts and has a double sided PCB-type control system including sensing function based on Zigbee module, micom and IR sensor for wireless transmission of measured data with low power operation, and also a battery for supplying electric power. The current consumption is 46.8mA in the inspection operation mode and 0.0268mA in the power saving mode for 3.7V of the applied power source, so that 30,000 times or more inspection can be performed with assumed 5 seconds inspection time for one tap. Experiments in test jig system and actual machining center confirm that the proposed inner tap inspection system can be applied to the batch process of simultaneous inspection after tapping in the machining center.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1992.04a
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• pp.343-348
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• 1992

Using the real-time image processing technique, we have developed an automatic visual inspection system which detects the defects of the surface muonted components in PCB( missing components, mislocation, mismounts, and reverse polarity, etc ) and collects the quality control and production management data. An image processing system based on a commercial parallel processor, TRANSPUTER by which the image processing time can be largely reduced was designed. Analyzing the collected data, the proposed inspection system contributes to the productivity improvement throughthe reduction of defective rate.

• Journal of Korean Society for Quality Management
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• v.23 no.3
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• pp.69-83
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• 1995

In a large number of literature on of inspection tasks, one of the most consistent findings is the existence of large and consistent differences among inspectors. It is possible that the individual difference is described by the difference of cognitive skills, because cognitive skills are required more than manual skills in inspection tasks. Therefore, a set of cognitive factors in human information processing may underly human performance in inspection tasks. In this study, a cognitive skill was described as the relative importance of the cognitive factors involved. A hierarchical task analysis and a fuzzy hierarchical analysis were used to represent how the importance of cognitive factors contribute to inspection performance. An experiment was conducted using the computer simulations of PCB inspection tasks. The results revealed that the subject group with better performance showed the importance weights of cognitive factors in the following rank; (attention, perception, judgement, classification, recognition)<(detection)$\ll$(memory). The results of the experiment can serve as a selection criterion for efficient inspection performance and the information of skilled learning for an inspection training program. The usefullness of a hierarchical task analysis and a fuzzy hierarchical task analysis for the analysis of cognitive tasks are also confirmed.

• Journal of Institute of Control, Robotics and Systems
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• v.4 no.3
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• pp.378-383
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• 1998

A FOV, that stands for "Field Of View", refers to the maximum area where a camera could be wholly seen. If a FOV of CCD camera cannot the cover overall inspection area, the overall inspection area should be divided into sub-areas of size FOV. In this paper, we propose a new neural network-based FOV generation method by using a newly modified self-organizing map(SOM) which has multiple structure based on a self-organizing map, and uses new training rule that is composed of the movement, creation and deletion terms. Then, experiment results using real PCB indicate the superiority of the method developed in this study to the existing sequential method.al method.

• Journal of Institute of Control, Robotics and Systems
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• v.15 no.2
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• pp.225-230
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• 2009

We propose a template matching method for component inspection of SMD assembly system. To discriminate wrong assembled components, the input image of component is matched with its standard image by template matching algorithm. For a fast inspection system, the calculation time of matching algorithm should be reduced. Since the standard images of all components located in a PCB are stored in computer, it is desirable to reduce the memory size of standard image. We apply the discrete wavelet transformation to reduce the image size as well as the calculation time. Only 7% memory of the BMP image is used to discriminate goodness or badness of components assembly. Comparative results are presented to verify the usefulness of the proposed method.