• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.50 no.11
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• pp.801-807
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• 2022

In this paper, we propose an ultra compact S-Band PCM/FM telemetry transmitter. The equipment is compact, so it can be applied to a limited space and capable of stable data transmission was designed and manufactured even with specifications set differently for each operating environment and system. RF direct conversion structure is used for the miniaturization of equipment, an RF transmission board, Power distribution board, and a signal processing board were implemented on a single PCB, so that the function of the transmitter could be performed with a minimum device. According to the target specification, variable output of 1~10W and variable data rate of 390kbps~12.5Mbps is possible in S-Band(2,200~2,400MHz) without degradation of performance. To verify the performance of the equipment, the RF performance test and BER measurement test were performed after the equipment was manufactured. It was confirmed that the OBW, null-to-null bandwidth, 1st IMD, Spurious emission, Phase noise specification of the PCM/FM modulated signal which is presented by the IRIG standard were satisfied, and we can confirm the data received using the transmitter inspection equipment were transmitted normally without distortion.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.3
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• pp.13-19
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• 2018

The soldering property of Pb-containing solder(Sn-Pb) and Pb-free solders(Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.7Cu-1.6Bi-0.2In) for solar combiner box module was compared. The solar combiner box module was composed of voltage and current detecting modules, diode modules, and other modules. In this study, solder paste printability, printing shape inspection, solder joint property, X-ray inspection, and shear force measurements were conducted. For optimization of Pb-free soldering process, step 1 and 2 were divided. In the step 1 process, the printability of Pb-containing and Pb-free solder alloys were estimated by using printing inspector. Then, the relationship between void percentages and shear force has been estimated. Overall, the property of Pb-containing solder was better than two Pb-free solders. In the step 2 process, the property of reflow soldering for the Pb-free solders was evaluated with different reflow peak temperatures. As the peak temperature of the reflow process gradually increased, the void percentage decreased by 2 to 4%, but the shear force did not significantly depend on the reflow peak temperature by a deviation of about 0.5 kgf. Among different surface finishes on PCB, ENIG surface finish was better than OSP and Pb-free solder surface finishes in terms of shear force. In the thermal shock reliability test of the solar combiner box module with a Pb-free solder and OSP surface finish, the change rate of electrical property of the module was almost unchanged within a 0.3% range and the module had a relatively good electrical property after 500 thermal shock cycles.