• 융합신호처리학회논문지
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• 제16권3호
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• pp.90-95
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• 2015

본 연구에서는 인쇄회로 기판(PCB)의 홀 가공에 사용되는 초소형 및 경량의 마이크로 드릴비트를 검사하기 위한 방법을 제안하고 있다. 고배율의 현미경을 통해 마이크로 드릴 비트의 영상을 획득한 후 드릴비트의 주요 지점들을 검출하는 영상처리 알고리즘을 개발하였고 주요지점을 근거로 하여 드릴비트의 다양한 요소들을 측정하였다. 또한, 드릴비트의 정상 및 비정상 상태를 자동으로 분별할 수 있는 윈도우 기반 검사 시스템을 개발하였다. 본 연구에서 개발한 시스템의 상대적인 성능비교를 위해 시험영상들을 사용하여 기존 검사장비와 비교하였다. 실험결과에 의하면 제안된 시스템은 기존 검사기보다 성능을 조금 향상시켰으며 기존 시스템에서 발생된 오판단된 일부 에러를 정확하게 분류하였다.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1997년도 한국자동제어학술회의논문집; 한국전력공사 서울연수원; 17-18 Oct. 1997
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• pp.1742-1745
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• 1997

We have developed a highly responsible probing system for inspection of electrical properties of assemble PCB$_{s}$ (printed circuit boards). However, as the duration of the impact occurring between a probe and a solder joint on PCB is very short, it is very difficult to control the harmful peak impact force and the slip motion of the probe to sufficient level only by its vorce feedback control with high gains. To overcome these disadvantages of the prototype, it needs ot obtain some information of the solder joint in advance before the contact. In addition, to guarantee the reliability of the probing task, the probing system is required to measure several points around the probale target point at high speed. There fore, to meet such requirements, we propose a new noncontaet sensor capable of detecting simultaneously position and normal vectors of the multiple points around the probable target point in real time. By using this information, we can prepare a control strategy for stable contact motion on impact. In this paper, we described measuring priniciple, design, and development of the sensor. The effectiveness of the proposed sensor is verified through a series of experiments.s.

• 제어로봇시스템학회논문지
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• 제21권3호
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• pp.276-282
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• 2015

This paper proposes a SMD (surface mounting device) classification method for the PCB assembly inspection machines. The package types of SMD components should be classified to create the job program of the inspection machine. In order to reduce the creation time of job program, we developed the automatic classification algorithm for the SMD packages. We identified the chip-type packages by color and edge distribution of the images. The input images are transformed into the HSI color model, and the binarized histroms are extracted for H and S spaces. Also the edges are extracted from the binarized image, and quantized histograms are obtained for horizontal and vertical direction. The neural network is then applied to classify the package types from the histogram inputs. The experimental results are presented to verify the usefulness of the proposed method.

• 한국산학기술학회논문지
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• 제13권11호
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• pp.5471-5478
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• 2012

본 논문에서는 SURF 알고리즘을 이용하여 PCB에 발생하는 불량 중 한 형태인 쇼트-서킷 불량을 탐지하는 기술을 제안한다. 제안하는 방법의 기본적인 절차는 SURF를 이용하여 샘플 영상과 입력된 영상에서 특징점 추출, 특징점 매칭 및 매칭 결과를 이용한 원근변환 수행, 검사 위치 관심영역 추출, 이진화 및 쇼트-서킷 추출, 결과 검증 순이다. 본 논문에서 제안하는 방식은 수작업으로 진행되는 후 공정의 특징 상, 검사하고자 하는 PCB의 놓여진 위치와 각도가 균일하지 않고 제각각으로 놓여 있는 경우에도 강건하게 쇼트-서킷 불량을 탐지하는 것에 중점을 두고 있다. 이 방법은 PCB가 놓여진 위치와 각도가 다양한 경우에도 불량을 탐지할 수 있음을 보이며, 탐지율 및 탐지시간 관점에서 기존의 수작업으로 검사하는 경우보다 우수함을 실험을 통하여 보인다.

• 공업화학
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• 제24권6호
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• pp.593-598
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• 2013

본 연구에서는 ATR-FTIR (Attenuated Total Reflectance-Fourier Transfer Infrared)기법을 이용하여 PCB 회로형성에 사용하는 아크릴레이트 계열의 포토레지스트 드라이필름(Dry film)의 흡습 특성을 평가하였다. 또한 습도 변화에 따른 드라이필름의 파단면을 관찰하여 습도에 따라 고분자의 파단특성이 달라지는 것으로 확인하였으며, 정량적인 분석방법으로써 흡습에 따른 무게 변화 및 ATR-FTIR을 이용한 흡광도 변화를 통하여 확산계수를 계산하였다. 실험 결과 주변환경의 온도와 습도가 높아질수록 상온에서 취성과 연성의 중간 정도의 특성을 나타내던 드라이필름이 연성으로 전이되는 사실을 확인할 수 있었고, 온도와 습도가 낮을 경우엔 취성의 특성을 나타냄을 알 수 있었다. 이를 통해 PCB 회로형성 공정의 온 습도 환경 조건을 항상 일정하게 유지해야 일정한 품질을 유지할 수 있다는 사실을 알 수 있었다. 본 연구에서 사용된 흡습특성 평가법인 ATR-FTIR방법의 타당성을 확보하기 위해, 기존에 많이 사용하는 무게 변화법을 통한 고분자-물 확산계수와 ATR-FTIR을 이용한 값을 상호 비교하였다. ATR-FTIR을 이용한 방법은 무게변화법과 동일한 수준의 정확도를 가질 뿐만 아니라 흡습 및 탈습 과정에서 고분자 구조가 어떻게 변화하는지를 평가할 수 있어 가장 적합한 방법으로 판단된다.

• 한국멀티미디어학회논문지
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• 제21권6호
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• pp.649-658
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• 2018

In this paper, we propose a mechanical contact inner tap inspection system that can inspect the defect of the inner tap immediately after inner tap is processed within the machining center. The inspection module has the collet chuck structure, so it can mounted on the main spindle of the machining center during inspection. It was developed with a focus on inspection for tap having 20 mm depth which is primarily fabricated in automotive parts and has a double sided PCB-type control system including sensing function based on Zigbee module, micom and IR sensor for wireless transmission of measured data with low power operation, and also a battery for supplying electric power. The current consumption is 46.8mA in the inspection operation mode and 0.0268mA in the power saving mode for 3.7V of the applied power source, so that 30,000 times or more inspection can be performed with assumed 5 seconds inspection time for one tap. Experiments in test jig system and actual machining center confirm that the proposed inner tap inspection system can be applied to the batch process of simultaneous inspection after tapping in the machining center.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1992년도 춘계학술대회 논문집
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• pp.343-348
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• 1992

Using the real-time image processing technique, we have developed an automatic visual inspection system which detects the defects of the surface muonted components in PCB( missing components, mislocation, mismounts, and reverse polarity, etc ) and collects the quality control and production management data. An image processing system based on a commercial parallel processor, TRANSPUTER by which the image processing time can be largely reduced was designed. Analyzing the collected data, the proposed inspection system contributes to the productivity improvement throughthe reduction of defective rate.

• 품질경영학회지
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• 제23권3호
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• pp.69-83
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• 1995

In a large number of literature on of inspection tasks, one of the most consistent findings is the existence of large and consistent differences among inspectors. It is possible that the individual difference is described by the difference of cognitive skills, because cognitive skills are required more than manual skills in inspection tasks. Therefore, a set of cognitive factors in human information processing may underly human performance in inspection tasks. In this study, a cognitive skill was described as the relative importance of the cognitive factors involved. A hierarchical task analysis and a fuzzy hierarchical analysis were used to represent how the importance of cognitive factors contribute to inspection performance. An experiment was conducted using the computer simulations of PCB inspection tasks. The results revealed that the subject group with better performance showed the importance weights of cognitive factors in the following rank; (attention, perception, judgement, classification, recognition)<(detection)$\ll$(memory). The results of the experiment can serve as a selection criterion for efficient inspection performance and the information of skilled learning for an inspection training program. The usefullness of a hierarchical task analysis and a fuzzy hierarchical task analysis for the analysis of cognitive tasks are also confirmed.

• 제어로봇시스템학회논문지
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• 제4권3호
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• pp.378-383
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• 1998

A FOV, that stands for "Field Of View", refers to the maximum area where a camera could be wholly seen. If a FOV of CCD camera cannot the cover overall inspection area, the overall inspection area should be divided into sub-areas of size FOV. In this paper, we propose a new neural network-based FOV generation method by using a newly modified self-organizing map(SOM) which has multiple structure based on a self-organizing map, and uses new training rule that is composed of the movement, creation and deletion terms. Then, experiment results using real PCB indicate the superiority of the method developed in this study to the existing sequential method.al method.

• 제어로봇시스템학회논문지
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• 제15권2호
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• pp.225-230
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• 2009

We propose a template matching method for component inspection of SMD assembly system. To discriminate wrong assembled components, the input image of component is matched with its standard image by template matching algorithm. For a fast inspection system, the calculation time of matching algorithm should be reduced. Since the standard images of all components located in a PCB are stored in computer, it is desirable to reduce the memory size of standard image. We apply the discrete wavelet transformation to reduce the image size as well as the calculation time. Only 7% memory of the BMP image is used to discriminate goodness or badness of components assembly. Comparative results are presented to verify the usefulness of the proposed method.