• Proceedings of the Korean Information Science Society Conference
• /
• 2011.06a
• /
• pp.320-323
• /
• 2011

최근 전자기술의 발달로 인해 인쇄 회로 기판(Printed Circuit Board)이 정밀화되고 세분화됨에 따라 고도로 집약되어 육안에 의한 시각검사 방법이 어려워지고 있다. 이에 따라 컴퓨터 시각 기술을 이용한 자동시각검사가 점차 늘어가는 추세다. 이러한 PCB의 설계 또는 검사 시 참조할 이미지를 만드는 방법 중 하나로 Gerber Interface로 표현된 PCB용 CAD파일인 거버파일을 이용하여 디지털 이미지를 생성하는 법이 널리 이용되고 있다. 반면 이러한 파일 및 이미지는 상호간에 인과관계(causality)를 가지며, 이미지 유출시 그 피해가 크다. 따라서 생성된 이미지를 효과적으로 보호하고 관리해야할 필요가 있다. 본 논문에서 상기의 인과관계를 이용하여 이를 관리하고 보호하는 이미지 권한관리 기법을 제안한다.

• Journal of the Korean Society for Precision Engineering
• /
• v.15 no.5
• /
• pp.9-18
• /
• 1998

The components with J-lead. which are more integrated and smaller than ones with Gull-wing. are rapidly being used in electronic board such as the PCB, for they have the advantage of occupying a small space compared to the other components. However, the development of inspection system for these new components is not so rapid as component development. Component-inspection with J-lead using vision system is difficult because they are hidden from camera optical axis. X-ray inspection, which has the advantage of inspecting the inside of solder state, is used to J-lead inspection. However. it is high cost and dangerous by leaking out X-ray compared to vision system. Therefore, in this paper, we design vision system suited to J-lead inspection and then propose algorithm which have flexibility in mount and rand error.

• Proceedings of the Korean Information Science Society Conference
• /
• 2006.06b
• /
• pp.340-342
• /
• 2006

기존의 PCB 자동시각검사 시스템은 창조 비교 방법을 위한 참조 영상(골든 영상) 획득에 많은 어려움을 겪고 있다. 이러한 문제를 해결하기 위하여 본 연구에서는 PCB 제작에 사용되는 CAD 파일을 이용하여 참조 영상을 생성함으로써 학습을 좀 더 쉽고 간??하게 할 수 있는 시스템을 구현하였다.

• Journal of Korea Multimedia Society
• /
• v.24 no.8
• /
• pp.988-999
• /
• 2021

AOI (Automatic Optical Inspection) of PCB (Printed Circuit Board) is a very important step to guarantee the product performance. The process of registering components called teaching mode is first perform, and AOI is then carried out in a testing mode that checks defects, such as recognizing and comparing the component mounted on the PCB to the stored components. Since most of registration of the components on the PCB is done manually, it takes a lot of time and there are many problems caused by mistakes or misjudgement. In this paper, A components classifier is proposed using YOLO (You Only Look Once) v2's object detection model that can automatically register components in teaching modes to reduce dramatically time and mistakes. The network of YOLO is modified to classify small objects, and the number of anchor boxes was increased from 9 to 15 to classify various types and sizes. Experimental results show that the proposed method has a good performance with 99.86% accuracy.

• Proceedings of the Optical Society of Korea Conference
• /
• 2006.07a
• /
• pp.469-471
• /
• 2006

This paper describes a efficient insepction method of PCB PADs for AFVI. The methods for PCB inspection have been tried to detect the defects in PCB PADs, but their low detection rate results from pattern variations that are originating from etching, printing and handling processes. The adaptive inspection method has been newly proposed to extract minute defects based on dynamic segments and filters. The vertexes are extracted from CAM master images of PCB and then a lot of segments are constructed in master data. The proposed method moves these segments to optimal directions of a PAD contour and so adaptively matches segments to PAD contours of inspected images, irrespectively of various pattern variations. It makes a fast, accurate and reliable inspection of PCB patterns. Experimental results show that proposed methods are found to be effective for flexible defects detection.

• Journal of the Korean Institute of Telematics and Electronics D
• /
• v.35D no.9
• /
• pp.26-34
• /
• 1998

This paper presents a characterization method for faults of circuit patterns on MCM(Multichip Module) or PCB(Printed Circuit Board) substrates with electron beams of a SEM(Scanning Electron Microscope) by inducing voltage contrast on the signal line. The experimentation employes dual potential electron beams for the fault characterization of circuit patterns with a commercial SEM without modifying its structure. The testing procedure utilizes only one electron gun for the generation of dual potential electron beams by two different accelerating voltages, one for charging electron beam which introduces the yield of secondary electron $\delta$ < 1 and the other for reading beam which introduces $\delta$ > 1. Reading beam can read open's/short's of a specific net among many test nets, simultaneously discharging during the reading process for the next step, by removing its voltage contrast. The experimental results of testing the copper signal lines on glass-epoxy substrates showed that the state of open's/short's had generated the brightness contrast due to the voltage contrast on the surface of copper conductor line, when the net had charged with charging electron beams of 7KV accelerating voltages and then read with scanning reading electron beams of 2KV accelerating voltages in 10 seconds. The experimental results with Au pads of a IC die and Au plated Cu pads of BGA substrates provided the simple test method of circuit lines with 7KV charging electron beam and 2KV reading beam. Thus the characterization method showed that we can test open and short circuits of the net nondestructively by using dual potential electron beams with one SEM gun.

• Proceedings of the IEEK Conference
• /
• 2003.07e
• /
• pp.2335-2338
• /
• 2003

This paper presents a real-time PCB (Printed Circuit Board) vision inspection system. This system can detect the OPEN and SHORT of the PCB which of the line width is 150$\mu\textrm{m}$. Our PCB inspection system is based on the referential method. Since the size of the captured PCB image is very large, the image is divided into 512${\times}$512 images to apply the accurate alignment efficiently. To correct the misalignment between the reference image and the inspection image, pattern matching is performed. In order to implement the proposed algorithm in real-time, we use the SIMD instruction and the double buffering structures. Our experiential results show the effectiveness of the developed inspection algorithm.

• Proceedings of the IEEK Conference
• /
• 2002.06d
• /
• pp.81-84
• /
• 2002

This paper presents the real-time PCB(Printed circuit board) inspection system that can detect thin open/short error using the line scan camera. After a overall introduction of our system, the outline of our inspection methods are described. The goal of our inspection system is the real time and detailed inspection using the line scan camera. To perform inspection processing in real-time, we utilize double buffering structure. In order to solve the problem of unexpectable pixels of PCB, we propose melting process which eliminates unexpectable pixels of PCB. The design and development of our prototype of PCB ins- pection system is discussed and test results are presented to show the effectiveness of the developed inspection algorithm.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
• /
• 2016.05a
• /
• pp.674-675
• /
• 2016

In this paper, we propose a manufacturing process model of Internet of Things devices using a Printed Circuit Board (PCB)-mounted RFID tag chip for reducing electronic wastes. Electrical and electronic products require a PCB surface mount and many examination. Also, conventional barcode systems cannot provide traceability management in PCB manufacturing before finishing Surface Mount Technology (SMT) process. The proposed process model does not require workers' attaching and detaching process unlike barcode systems. Also, RFID tag chip can record all the data in manufacturing steps. Thus, the number of connections to a database management system (DBMS) can be reduced.

• Proceedings of the Korean Institute of Intelligent Systems Conference
• /
• 2004.04a
• /
• pp.571-575
• /
• 2004

인쇄회로기판(PCB)을 조립 또는 검사하는 장비의 작업 프로그램 작성을 위해서는, 납땜 패드의 위치와 크기에 대한 데이터가 필요하다. CAD 파일, 거버 파일 등을 사용하여 패드를 추출하는 방법이 많이 사용되고 있으나, 본 논문은 이미지 스캐너를 사용하여 추출하는 방법을 새로이 제안한다. 제안된 방법은 통계적 영상 처리를 적용하여, 기존의 일반적인 영상처리 방식보다 기판 별 패드 색상의 차이에 강인하다. 실제 PCB 에 대한 실험을 통하여 제안 방법의 성능을 검증한다. 제시된 방법은, CAD 파일과 거버 파일의 확보가 어려운 임가공 업체 등의 생산현장에서 사용될 수 있다.