• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.537-539
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• 2006

We developed an 4.5" $192{\times}64$ active matrix organic light-emitting diode display on a glass using organic thin-film transistor (OTFT) switching-arrays with two transistors and a capacitor in each sub-pixel. The OTFTs has bottom contact structure with a unique gate insulator and pentacene for the active layer. The width and length of the switching OTFT is $800{\mu}m$ and $10{\mu}m$ respectively and the driving OTFT has $1200{\mu}m$ channel width with the same channel length. On/off ratio, mobility, on-current of switching OTFT and on-current of driving OTFT were $10^6,0.3{\sim}0.5\;cm^2/V{\cdot}sec$, order of 10 ${\mu}A$ and over 100 ${\mu}A$, respectively. AMOLEDs composed of the OTFT switching arrays and OLEDs made using vacuum deposition method were fabricated and driven to make moving images, successfully.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.5
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• pp.12-18
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• 2008

Ag paste was employed for source and drain electrode of OTFTs and for the data metal lines of OTFT-OLED array on PC(polycarbonate) substrate. We tested two kinds of Ag-pastes such as pastes for 325 mesh and 500 mesh screen mask to examine the pattern ability and electrical performance for OTFTs. The minimum feature size was 60 ${\mu}m$ for 325 mesh screen mask and 40 ${\mu}m$ for 500 mesh screen mask. The conductivity was 60 $m{\Omega}/\square$ for 325 mesh and 133.1 $m{\Omega}/\square$ for 500 mesh. For the OTFT performance the mobility was 0.35 $cm^2/V{\cdot}sec$ and 0.12 $cm^2/V{\cdot}sec$, threshold voltage was -4.7 V and 0.9 V, respectively, and on/off current ratio was ${\sim}10^5$, for both screen masks. We applied the 500 mash Ag paste to OTFT-OLED array because of its good patterning property. The pixel was composed of two OTFTs and one capacitor and one OLED in the area of $2mm{\times}2mm$. The panel successfully worked in active mode operation even though there were a few bad pixels.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.9 no.4
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• pp.878-885
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• 2008

The FPDs(Flat Panel Displays) such as LCD(Liquid Crystal Display) and PDP(Plasma Display Panel) and OLED(Organic Light Emitting Diode), recently, have been substituted for CRT(Cathode Ray Tube) displays because they have a convex surface, small volume, light weight and lower electric power consumption. The productivity of FPDs is greatly dependent on the area of thin glass panel with 0.6 - 0.8mm thickness because FPDs are manufactured by cutting a large-scaled thin glass panel with patterns to the required product dimensions. So FPD's industries are trying to increase the area of thin glass panel. For example, the thin glass panel size of the 8th generation is 2,200mm in width, 2,600mm in length and 0.7mm in thickness. The air flows both in the thin glass panel and in the porous PE-plate surface were modeled and analyzed, from which a working condition was estimated. The thin glass panel on the porous PE-plate surface with self-lubricating characteristics was investigated and compared with that on the square duct floating bar surface with many holes of 1mm diameter when the thin glass panel contacts the floating bar surface due to malfunction of electric power supply.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.1261-1262
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• 2008

Laser-based crystallization techniques are ideally-suited for forming high-quality crystalline Si films on active-matrix display backplanes, because the highly-localized energy deposition allows for transformation of the as-deposited a-Si without damaging high-temperature-intolerant glass and plastic substrates. However, certain significant and non-trivial attributes must be satisfied for a particular method and implementation to be considered manufacturing-worthy. The crystallization process step must yield a Si microstructure that permits fabrication of thin-film transistors with sufficient uniformity and performance for the intended application and, the realization and implementation of the method must meet specific requirements of viability, robustness and economy in order to be accepted in mass production environments. In recent years, Low Temperature Polycrystalline Silicon (LTPS) has demonstrated its advantages through successful implementation in the application spaces that include highly-integrated active-matrix liquid-crystal displays (AMLCDs), cost competitive AMLCDs, and most recently, active-matrix organic light-emitting diode displays (AMOLEDs). In the mobile display market segment, LTPS continues to gain market share, as consumers demand mobile devices with higher display performance, longer battery life and reduced form factor. LTPS-based mobile displays have clearly demonstrated significant advantages in this regard. While the benefits of LTPS for mobile phones are well recognized, other mobile electronic applications such as portable multimedia players, tablet computers, ultra-mobile personal computers and notebook computers also stand to benefit from the performance and potential cost advantages offered by LTPS. Recently, significant efforts have been made to enable robust and cost-effective LTPS backplane manufacturing for AMOLED displays. The majority of the technical focus has been placed on ensuring the formation of extremely uniform poly-Si films. Although current commercially available AMOLED displays are aimed primarily at mobile applications, it is expected that continued development of the technology will soon lead to larger display sizes. Since LTPS backplanes are essentially required for AMOLED displays, LTPS manufacturing technology must be ready to scale the high degree of uniformity beyond the small and medium displays sizes. It is imperative for the manufacturers of LTPS crystallization equipment to ensure that the widespread adoption of the technology is not hindered by limitations of performance, uniformity or display size. In our presentation, we plan to present the state of the art in light sources and beam delivery systems used in high-volume manufacturing laser crystallization equipment. We will show that excimer-laser-based crystallization technologies are currently meeting the stringent requirements of AMOLED display fabrication, and are well positioned to meet the future demands for manufacturing these displays as well.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2016.11a
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• pp.140-140
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• 2016

유기전계발광소자 (Organic Light Emitting Diode : OLED)는 보조광원이 필요 없고 천연색 표현이 가능하며, 낮은 소비 전력 및 저전압 구동 등의 장점으로 이상적인 디스플레이 구현이 가능하여 차세대 디스플레이로써 많은 이목을 끌고 있으나 제한된 수명과 안정성의 문제점을 안고 있다. 따라서 OLED의 열화 원인을 분석하고 수명을 연장하기 위한 체계적인 방법과 기술 개발이 중요하다. Impedance Spectroscopy는 이온, 반도체, 절연체 등의 벌크 또는 계면 영역의 전하 이동을 조사하는데 사용될 수 있어, OLED에서도 Impedance Spectroscopy를 이용하여 전하수송과 전자주입 메커니즘 등 폭넓은 전기적 정보를 얻을 수 있다. 본 연구에서는 Impedance Spectroscopy를 이용하여 경과시간에 따른 OLED의 임피던스 특성을 측정하여 열화 메커니즘을 분석하였다. 본 연구에서 OLED는 ITO / 2-TNATA (4,4,4-tris2-naphthylphenyl-aminotriphenylamine) / NPB (N,N'-bis-(1-naphyl)-N, N'-diphenyl-1,1'- biphenyl-4,4'-diamine) / Alq3 (tris(quinolin-8-olato) aluminum) / Liq / Al으로 구성된 녹색 형광 OLED를 제작하였다. OLED의 전계 발광 특성을 측정하기 위한 전원 인가장치로 Keithley 2400을 사용하여 전압과 전류를 인가하였고, 소자에서 발광된 휘도 및 발광 스펙트럼은 Photo Research사의 PR-650 Spectrascan을 사용하여 암실 환경에서 측정하였다. 임피던스 스펙트럼은 컴퓨터 제어 프로그래밍이 가능한 KEYSIGHT사의 E4990A를 사용하여 측정하였다. 임피던스 측정 전압은 0 V부터 2 V 간격으로 8 V까지, 주파수는 20 Hz에서 2 kHz의 범위로 설정하여 측정하였다. I-V-L과 임피던스 특성은 24 시간의 간격을 두고 실온에서 측정하였다. 그림은 경과시간에 따른 녹색 형광 OLED의 인가전압 2 V, 6 V의 Cole-Cole plot을 나타낸 것이다. 문턱전압 미만인 인가전압 2 V에서는 소자를 통하여 전류가 흐르지 않아 큰 반원 형태를 나타내었고, 시간이 경과함에 따라 소자 제작 직후엔 실수 임피던스의 최댓값이 $8982.6{\Omega}$에서 480 시간 경과 후엔 $9840{\Omega}$으로 약간 증가하였다. 문턱전압 이상인 인가전압 6 V에서는 소자 제작 직후 실수 임피던스의 최댓값이 $108.2{\Omega}$으로 작은 반원 형태를 나타내나 시간이 경과함에 따라 방사형으로 증가하는 것을 확인 할 수 있었고, 672 시간 경과 후엔 실수 임피던스의 최댓값이 $9126.9{\Omega}$으로 문턱 전압 미만 일 때와 유사한 결과를 나타내었다. 이러한 임피던스의 증가 현상은 시간이 경과함에 따라 OLED의 열화에 의한 것으로 판단된다.

• Applied Chemistry for Engineering
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• v.19 no.3
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• pp.299-303
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• 2008

A thermally cross-linkable polymer, poly[(2,5-dimethoxy-1,4-phenylenevinylene)-alt-(1,4-phenylenevinylene)] (Cross-PPV), was synthesized by the Heck coupling reaction. In order for the polymer to be cross-linkable, 20 mol% excess divinylbenzene was added. The chemical structure of Cross-PPV and thermally crosslinked Cross-PPV were confirmed by FT-IR spectroscopy. From the FT-IR, UV-Vis, and PL spectral data, thermally crosslinked Cross-PPV was insoluble in common organic solvents. The HOMO and LUMO energy level of thermally cross-linked Cross-PPV were estimated -5.11 and -2.56 eV, respectively, which were determined by the cyclic voltammetry and UV-Vis spectroscopy. From the energy level data, one can easily notice that thermally crosslinked Cross-PPV can be used for hole injection layer effectively. Bilayer structured device (ITO/crosslinked Cross-PPV/PM-PPV/Al) was fabricated using poly(1,4-phenylenevinylene-(4-dicyanomethylene-4H-pyran)-2,6-vinylene-1,4-phenylenevinylene-2,5-bis(dodecyloxy)-1,4-phenylenevinylene (PM-PPV) as the emitting layer, which have HOMO and LUMO energy levels of -5.44 eV and -3.48 eV, respectively. The bilayered device had much enhanced the maximum efficiency (0.024 cd/A) and luminescence ($45cd/m^2$) than those of a single layer device (ITO/PM-PPV/Al, 0.003 cd/A, $3cd/m^2$). The enhanced performance originated from that fact that cross-linked Cross-PPV facilitatse the hole injection to the emissive layer and the injected hole and electron from ITO and Al are recombined in emitting layer (PM-PPV) effectively.