• Title/Summary/Keyword: Optimum Process Condition

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Treatment Efficiency of Complex Wastewater by Fenton's Oxidation Condition (펜톤산화에 따른 복합폐수의 처리효율연구)

  • Sung, Il-Wha
    • Journal of Environmental Health Sciences
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    • v.32 no.5 s.92
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    • pp.446-450
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    • 2006
  • In order to treat the wastewater containing organic compound, pre-treatment system connected with MSP(molecular separation process) was investigated. With the aim of selecting an optimum process of Fenton's oxidation, removal efficiency of each process in the optimum reaction condition was recommended. The $Fe/H_{2}O_{2}$(ferric sulfate to hydrogen peroxide)reagent is referred to as the Fenton's regent, which produces hydroxyl radicals by the interaction of Fe with $H_{2}O_{2}$. The powerful oxidizing ability and extreme kinetic reactively of the hydroxyl radical was well established. Increasing dosage of $Fe/H_{2}O_{2}$ increased removal efficiency as molar ratio of $Fe/H_{2}O_{2}$ between 0.2 and 2.5. Optimum dosage of molar ratio was 1. The removal efficiency for reaction condition was increased as pH decreased when the molar ratio of $Fe/H_{2}O_{2}$ was 1.7. Fenton's oxidation was most efficient in the reaction time 35 min for complex wastewater. Also, coagulation aid experiments using kaolin resulted in 3% of kaolin dosage.

The Optimization of Offset Printing Process for High Quality Color Reproduction(II);Platemaking and Presswork (고품질 색재현을 위한 오프셋인쇄 공정의 최적화에 관한 연구(II);제판과 인쇄공정을 중심으로)

  • Kim, Sung-Su;Kang, Sang-Hoon
    • Proceedings of the Korean Printing Society Conference
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    • 2007.11a
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    • pp.13-28
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    • 2007
  • Producing printing plate is essential progress to do offset printing. In this Film-less period, the more PS plate becomes extinct, the more the age of the Plate-Making of Exposure declines the place to stand. To do offset printing, the CTP (Computer to Plate) is taking a place of PS plate that covers speed, quality and economical problems. The biggest advantage of using CTP is that laser directly goes to the plate, thus there are no dust from the Plate-Making of Exposure. It is also theoretically able to print 200lpi${\sim}$300lpi as well as print 1751pi, because it has over 2400dpi resolution. The high quality printing could be available inside of the country, if printing machine keeps the optimum condition in offset printing. The CTP has many advantages, however there is a difficulty for the operators to preserve the equipment. The actual circumstance is that they cannot make a decision about how many dots need to be generated, and also it is necessary to know how to establish the setup at RIP on CTP to make the optimum condition output. If offset printing machine keeps the optimum condition, it would be able to print up to high quality printing however it is hard to comment what is the optimum condition for the printing machine. Anyone could say easy subjectively that machine is in the optimum condition, however it is objectively hard to estimate by number. In this research GATF / Plate Test target used to analyze the image and to make numerical value of the optimum condition of the CTP. It also used GATF / The sheep fed test printing 5.0 to know the density of the color representation, dot gain and gray balance for the optimum condition of the print machine. The purpose of this research is to represent the ISO 12647-2 which is the international standard with domestic printing equipments.

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The Optimization of Offset Printing Process for High Quality Color Reproduction (II) - Platemaking and Presswork - (고품질 색재현을 위한 오프셋 인쇄공정의 최적화에 관한 연구(II) - 제판과 인쇄공정을 중심으로 -)

  • Kim, Sung-Su;Kang, Sang-Hoon
    • Journal of the Korean Graphic Arts Communication Society
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    • v.25 no.2
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    • pp.69-84
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    • 2007
  • Producing printing plate is essential progress to do offset printing. In this Film-less period, the more PS plate becomes extinct, the more the age of the Plate-Making of Exposure declines the place to stand. To do offset printing, the CTP (Computer to Plate) is taking a place of PS plate that covers speed, quality and economical problems. The biggest advantage of using CTP is that laser directly goes to the plate, thus there are no dust from the Plate-Making of Exposure. It is also theoretically able to print $200lpi{\sim}300lpi$ as well as print 1751pi, because it has over 2400dpi resolution. The high quality printing could be available inside of the country, if printing machine keeps the optimum condition in offset printing. The CTP has many advantages, however there is a difficulty for the operators to preserve the equipment. The actual circumstance is that they cannot make a decision about how many dots need to be generated, and also it is necessary to know how to establish the setup at RIP on CTP to make the optimum condition output. If offset printing machine keeps the optimum condition, it would be able to print up to high quality printing however it is hard to comment what is the optimum condition for the printing machine. Anyone could say easy subjectively that machine is in the optimum condition, however it is objectively hard to estimate by number. In this research GATF / Plate Test target used to analyze the image and to make numerical value of the optimum condition of the CTP. It also used GATF / The sheep fed test printing 5.0 to know the density of the color representation, dot gain and gray balance for the optimum condition of the print machine. The purpose of this research is to represent the ISO 12647-2 which is the international standard with domestic printing equipments.

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A Study on the Nitride Residue and Pad Oxide Damage of Shallow Trench Isolation(STI)-Chemical Mechanical Polishing(CMP) Process (STI-CMP 공정의 질화막 잔존물 및 패드 산화막 손상에 대한 연구)

  • Lee, U-Seon;Seo, Yong-Jin;Kim, Sang-Yong;Jang, Ui-Gu
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.50 no.9
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    • pp.438-443
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    • 2001
  • In the shallow trench isolation(STI)-chemical mechanical polishing(CMP) process, the key issues are the optimized thickness control, within-wafer-non-uniformity, and the possible defects such as pad oxide damage and nitride residue. The defect like nitride residue and silicon (or pad oxide) damage after STI-CMP process were discussed to accomplish its optimum process condition. To understand its optimum process condition, overall STI related processes including reverse moat etch, trench etch, STI fill and STI-CMP were discussed. Consequently, we could conclude that law trench depth and high CMP thickness can cause nitride residue, and high trench depth and over-polishing can cause silicon damage.

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A dynamic simulation study on SCR (Stream Carbon dioxide Reforming) process for pilot plant operation (파일럿 플랜트 최적운전을 위한 SCR공정 동적 모사)

  • Kim, Yong Heon;Bae, Ji Han;Park, Myoung Ho
    • 한국신재생에너지학회:학술대회논문집
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    • 2011.11a
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    • pp.136.2-136.2
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    • 2011
  • A dynamic simulation study on SCR process in GTL process was carried out in order to find optimum operation conditions for pilot plant operation. Optimum operating conditions for SCR synthesis gas process were determined by changing operation variables such as feed temperature and pressure. It was also assumed that physical properties of reaction medium were governed by RKS (Redlich-Kwong-Soave) equation. The effect of temperature and pressure on synthesis gas process $H_2$/CO ratio were mainly examined. Dynamic simulation results were fed back to feed operation condition for optimizing productivity, especially for appropriate condition to FT (Fischer-Tropsch) synthesis unit.

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A Study on the Optimum Shot Peening Condition for Al7075-T6 (AL7075-T6의 최적 쇼트피닝 조건에 관한 연구)

  • Jeong,Seong-Gyun;Kim,Tae-Hyeong
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.31 no.7
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    • pp.63-68
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    • 2003
  • Shot peening process is most often used to improve the fatigue properties of metal parts, In order to achieve an optimum, repeatable, and reliable fatigue enhancement from the shot peening process, the important shot peening parameters must be optimized, In this paper, the optimum peening intensity(Almen intensity) condition is investigated by experiment. Rotary bending fatigue test has been adopted to investigate the effects of optimum peening on the fatigue characteristics, Experimental results show that the fatigue strength and fatigue life has been tremendously increased by optimum-peening treatment. However, the fatigue strength and fatigue life has been decreased by under or over peening.

Selecting the Optimum Process Condition Between the Factor Level Using Neural Network (신경망이론을 이용한 어인자의 수준사이를 고려한 최적조건 선정에 관한 연구)

  • 홍정의
    • Journal of Korean Society for Quality Management
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    • v.30 no.2
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    • pp.86-98
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    • 2002
  • Defining the relationship between the quality of injection molded parts and the process condition is very complicate because of lots of factor are involved and each factor has a non-linearity. With the development of CAE(Computer Aided Engineering) technology, the estimation of volumetric shrinkage of injection mold parts is possible by computer simulation even though restricted application. In this research, Neural Network applied for finding optimal processing condition. The percent of volumetric shrinkage compared on each case and show neural network can be successfully applied selecting optimum condition not only within factor level but also between factor level.

Selection of the Optimum Seaming Condition for Spin Drum Using Design of Experiment (실험계획법을 이용한 스핀드럼의 시밍 최적조건 선정)

  • Kim, Eui-Soo;Lee, Jung-Min;Kim, Byung-Min
    • Proceedings of the KSME Conference
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    • 2007.05a
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    • pp.1511-1516
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    • 2007
  • Because Seaming process of MPJ (Mechanical Press Joining) has various design factors such as thickness, bending radius, seaming width, caulking press width and the dynamic factor such as multistage plastic working, elastic recovery, residual stress, the optimum conditions can't be easily determined. Using a design of experiment based on the FEM, which has several advantages such as less computing, high accuracy performance and usefulness, this study was performed investigating the interaction effect between the various design factor as well as the main effect of the each design factor during drum MPJ and proposed optimum condition using center composition method among response surface derived from regression equation of simulation-based DOE.

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Optimum Design of Rubber Injection Molding Process for the Preparation of Anti-vibration Rubber (방진고무사출성형의 적정설계)

  • Lim, Kwang-Hee
    • Korean Chemical Engineering Research
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    • v.48 no.4
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    • pp.490-498
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    • 2010
  • The optimum mold design and the optimum process condition were constructed upon executing process simulation of rubber injection molding with the commercial CAE program of MOLDFLOW(Ver. 5.2) in order to solve the process-problems of K company relating to air-traps and short-shots. The former occurs at the cavity edge of torque-rod-bush and the latter takes place for the injection molding of dynamic dampers. As a result the process problem relating to air traps was solved by optimizing edge-angle and the number of gates to prevent the flow congestion of flow-front and to make the flow-front movement unaffected by congestion. For dynamic dampers of K company the unmolded flaw caused by their unfilled cavity was corrected by installing the air-vent at the confronting locations of both upstream and downstream of flow-front where air traps frequently occur. Besides the unmolded flaws were rectified by altering the position of gate from the upper to the middle or by increasing the number of gates. Thus the process problems of K company relating to air-traps and short-shots of torque-rod-bush and dynamic dampers, respectively, were solved by proper altering of mold design with process simulation of rubber injection molding.

A Study on the Fatigue Characteristics of Al 7075-T6 by Shot Peening (쇼트피닝 가공에 의한 Al 7075-T6의 피로특성에 관한 연구)

  • 김태형;정성균;신용승
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2002.10a
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    • pp.335-340
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    • 2002
  • The shot peening process is most often used to improve fatigue properties of metal parts. In order to achieve optimum, repeatable and reliable fatigue enhancement from the shot peening process, the important shot peening parameters must be controlled. In this paper, the optimum shot peening condition is investigated. Rotate bending fatigue test was accomplished to investigate the effects of shot peening on the fatigue strength. Experimental results show that the fatigue strength was tremendously increased by optimum peening condition. But the fatigue strength was decreased by under peening or over peening.

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