• Journal of the Korean Chemical Society
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• v.40 no.5
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• pp.333-340
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• 1996

• International Journal of Highway Engineering
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• v.16 no.5
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• pp.1-8
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• 2014

PURPOSES : The objective of this study is to evaluate the bond strength of asphalt emulsions including polymer-modified emulsions for chip seals and fog seals using the bitumen bond strength (BBS) test. METHODS : For the laboratory testing, the Pneumatic Adhesion tensile Testing Instrument(PATTI) device is used to measure the bond strength between the asphalt emulsion and aggregate substrate based on the AASHTO TP-91. In order to conduct all the tests in controled condition, all test procedures are performed in the environmental chamber. The CRS-2L and the SBS CRS-2P emulsions are used as a polymer-modified emulsion, and then unmodified emulsion, the CRS-2, is compared for the evaluation of chip seal performance. For the fog seal performance evaluation, two types of polymer-modified emulsions and one of unmodified emulsion, the CSS-1H, are employed. For chip seal study, the BBS tests are performed at 30, 60, 120, and 240 minutes of curing times with curing and testing temperatures of $15^{\circ}C$, $25^{\circ}C$, and $35^{\circ}C$. The fog seal tests are conducted at 30, 60, 90, 120, 180 minutes, and 24 hours with curing and testing temperatures of $25^{\circ}C$, $30^{\circ}C$, and $35^{\circ}C$. RESULTS AND CONCLUSIONS : Overall, chip seal emulsions and fog seal emulsions show the similar bond strength trend. At the same testing condition, polymer-modified emulsions show better bond strength than unmodified emulsions. Also, there is no significant difference between polymer-modified emulsions. One of important findings is that the most bond strength reaches their final bond strength within one hour of curing time. Therefore, the early curing time plays a vital role in the performance of chip seals and fog seals.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.16 no.11 s.102
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• pp.1114-1122
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• 2005

In this paper, the study of a design, fabrication and measurement of the receiver MMIC LNA, mixer for S-band application is described. The LNA is designed by 2-stage common source. The mixer is composed of active LO and RF balun to integrate on a chip and applied a newly proposed bias circuit to compensate the process variations of active devices. The LNA has 15.51 dB-gain and 1.02dB-Noise Figure at 2.1 GHz. The conversion gain of the mixer is -12 dB, IIP3 is approximately 4.25 dBm and port-to-port isolation is over 25 dB. The newly proposed bias circuit is composed of a few FETs and resistors, and can compensate the variation of the threshold voltage by the process variations, temperature changes and etc. The designed chip size is $1.2[mm]\times1.4[mm]$.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.9
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• pp.1408-1414
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• 2004

The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF (anisotropic conductive film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue lift of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear hi-thermal analysis was conducted and the result was compared with Moire interferometer experiment. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. DOE (Design of Experiment) technique was used to find important design factors. The results show that PCB CTE (Coefficient of Thermal Expansion) and elastic modulus of ACF material are important material parameters. And as important design parameters, chip width, bump pitch and bump width were chose. 2$^{nd}$ DOE was conducted to obtain RSM equation far the choose 3 design parameter. The coefficient of determination ($R^2$) for the calculated RSM equation is 0.99934. Optimum design is conducted using the RSM equation. MMFD (Modified Method for feasible Direction) algorithm is used to optimum design. The optimum value for chip width, bump pitch and bump width were 7.87mm, 430$\mu$m, and 78$\mu$m, respectively. Approximately, 1400 cycles have been expected under optimum conditions. Reliability analysis was conducted to find out guideline for control range of design parameter. Sigma value was calculated with changing standard deviation of design variable. To acquire 6 sigma level thermal fatigue reliability, the Std. Deviation of design parameter should be controlled within 3% of average value.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.58 no.2
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• pp.142-147
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• 2009

Conventional HP(high pressure) sodium or Metal-halide lamps have a life span of around one year requiring at least annual replacement and maintenance. High Power LED lights require no regular maintenance further increasing savings on replacement bulbs, access equipment and labour costs. New installations benefit from a substantial reduction in the cost of expensive heavy duty cable required for sodium lighting. Especially, LED light can achieve variable color temperature, high functional performance in the field of street light. There are two main method to achieve variable color temperature function of the street light. one method is using RGB multi-chip LED, the other is using Orange-White LED method. In this paper, it was compare RGB Multi-chip LED with white-orange LED for there characteristics performance.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1551_1552
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• 2009

In this paper, we presented the packaging technologies of CMOS ISFET(Ion Sensitive Field Effect Transistor) pH sensor using post-CMOS process and MCP(Multi Chip Packaging). We have proposed and developed two types of packaging technology. one is one chip, which sensing layer is deposited on the gate metal of standard CMOS ISFET, the other is two chip type, which sensing layer is separated from CMOS ISFET and connected by bonding wire. These proposed packaging technologies would make it easy to fabricate CMOS ISFET pH sensor and to make variety types of pH sensor.

• Proceedings of the KIEE Conference
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• 1998.07f
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• pp.1987-1989
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• 1998

A single phase induction motor is predominant in fractional horsepower rating and is widely used in home and industrial equipment. For example, these motors provide the motive power to washing machines, fans, refrigerators, etc. In this paper has presented the design and implementation of a microcontroller software - based self - starting SPIM. The control algorithm used in the experimentation employed simple control strategies which enabled a single chip programmable microcontroller to execute both the self - starting and self - detecting control of SPIM with relatively simplified hardware.

• Proceedings of the IEEK Conference
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• 2002.07c
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• pp.1428-1431
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• 2002

It is general opinion that the future mobile multimedia networks will use different standards and a prospective solution to this problem will be software defined radio (SDR) techniques. SDR provides the flexibility to support multiple air interfaces and signal processing functions at the same time. Especially, digital signal processors and FPGAs are widely used for implementation of these adaptive and flexible functions of a baseband modem for SDR applications. Also, it is known that the modulation schemes of OCQPSK (Orthogonal Complex QPSK) and HPSK (Hybrid PSK) are used for IMT-2000 services of cdma2000 and WCDMA, respectively. Thus, in this paper, we design and implement an OCQPSK / HPSK modem using a DSP chip of Texas Instrument's TMS320C6701. One modulation scheme is operated by adaptive selection between the two schemes and 5 physical traffic channels differentiated by orthogonal codes are implemented in one DSP chip and each channel has 1Mbps data rates and 8Mcps chip rates.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.8
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• pp.1424-1429
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• 2007

This paper presents a simple and reliable one-touch type multi-immunosensing lab-on-a-chip (LOC) detecting antibodies as multi-disease markers using electrochemical method suitable for a portable point-of-care system (POCS). The multi-stacked LOC consists of a PDMS space layer for liquids loading, a PDMS valve layer with 50 im in height for the membrane, a PDMS channel layer for the fluid paths, and a glass layer for multi electrodes. For the disposable immunoassay which needs sequential flow control of sample and buffer liquids according to the designed strategies, reliable and easy-controlled on-chip operation mechanisms without any electric power are necessary. The driving forces of sequential liquids transfer are the capillary attraction force and the pneumatic pressure generated by air bladder push. These passive fluid transport mechanisms are suitable for single-use LOC module. Prior to the application of detection of the antibody as a disease marker, the model experiments were performed with anti-DNP antibody and anti-biotin antibody as target analytes. The flow test results demonstrate that we can control the fluid flow easily by using the capillary stop valve and the PDMS check valves. By the model tests, we confirmed that the proposed LOC is easily applicable to the bioanalytic immunosensors using bioelectrocatalysis.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.10a
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• pp.39-45
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• 2000

A small camera module fabricated by including bare chip bonding methods is utilized to realize advanced mobile devices. One of the driving forces is the TOG (Tape On Glass) bonding method which reduces the packaging size of the image sensor clip. The TOG module is a new thinner and smaller image sensor module, using flip chip interconnection method with the ACP (Anisotropic Conductive Paste). The TOG production process was established by determining the optimum bonding conditions for both optical glass bonding and image sensor clip bonding lo the flexible PCB. The bonding conditions, including sufficient bonding margins, were studied. Another bonding method is the flip chip bonding method for DSP (Digital Signal Processor) chip. A new AC\ulcorner was developed to enable the short resin curing time of 10 sec. The bonding mechanism of the resin curing method was evaluated using FEM analysis. By using these flip chip bonding techniques, small camera module was realized.