• 대한전기학회:학술대회논문집
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• 대한전기학회 1996년도 추계학술대회 논문집 학회본부
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• pp.77-79
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• 1996

This paper presents an integrated stability analysis by the direct energy function method based on Equivalent Mechanical Model(EMM) which reflects the system behavior related to both angle and voltage stabilities. Actually, angle and voltage stability are intimately related in power system, so complete decoupling of these stability analysis is not possible in general, particularly in stressed power systems. In this paper, it is shown that a identical energy function can be used for angle and voltage stability analysis. The proposed energy function reflects the line resistances and reactive powers under the constraints of the same R/X ratio. The energy margin between UEP and SEP presents a good collapse proximity index in both types of stability analysis.

• Corrosion Science and Technology
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• 제16권6호
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• pp.298-304
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• 2017

Coil spring steels from the automobile suspension part after field exposure for 10 years and those after anti-corrosion validation test in proving ground of 5,000 ~ 10,000 km were examined for corrosion damages. Partial loss of paint, accumulation of corrosion product, and cracking of paint and superficial material were observed. The surface and subsurface region of spring steels had compressive residual stress and high hardness by shot peening. The surface hardness values of the specimens were 620 ~ 670 Hv. They were 60 ~ 80 Hv higher than those of the samples taken from the middle part of the spring. The maximum compressive stress was -916 ~ -1208 MPa measured at depth of about $100{\mu}m$. Electrochemical impedance spectroscopy showed that the resistances of charge transfer and the paint layer of the spring steels ranged from several tens to millions ${\Omega}{\cdot}cm^2$. The resistance of the field samples was much higher than that of the proving ground samples used in this study, implying that the proving ground test condition would be more corrosive than the field environment.

• 센서학회지
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• 제30권6호
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• pp.441-445
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• 2021

The components affecting the extrinsic transconductance (g_{m_ext}) in In_0.7Ga_0.3As quantum-well (QW) high-electron-mobility transistors (HEMTs) on an InP substrate were investigated. First, comprehensive modeling, which only requires physical parameters, was used to explain both the intrinsic transconductance (g_{m_int}) and the g_{m_ext} of the devices. Two types of In_0.7Ga_0.3As QW HEMT were fabricated with gate lengths ranging from 10 ㎛ to sub-100 nm. These measured results were correlated with the modeling to describe the device behavior using analytical expressions. To study the effects of the components affecting g_{m_int}, the proposed approach was extended to projection by changing the values of physical parameters, such as series resistances (R_S and R_D), apparent mobility (𝜇_{n_app}), and saturation velocity (𝜈_sat).

• Current Research on Agriculture and Life Sciences
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• 제11권
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• pp.81-89
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• 1993

xylA 유전자의 발현에 관한 xylR 유전자의 조절 메카니즘을 밝히기 위한 연구의 일환으로 xylA 프로모터 하류에 cat 유전자를 삽입시켜 Pxyl-cat-xylA 융합 플라스미드인 pEXC131을 제작하였고 이 플라스미드를 xylA 변이주인DH77로 형질전환시킨 결과 xylose의 유도시에만 Cm 내성과 xylose isomerase활성이 나타났다. pEXC1131/DH77에 NTG를 처리하여 xylose 유도없이도 Cm 내성과 xylose isomerase의 활성을 나타내는 xylA 유전자의 구성적 변이주인 pEXC131-39를 xylR 변이주인 DH60으로 형질전환시킨 균주가 xylose에 의한 유도와 무관하게 Cm 내성 및 xylose isomerase 활성을 가지는 것으로 보아 xylA 유전자의 프로모터부위의 변이에 의한 구성적 변이주임을 확인하였다.

• 마이크로전자및패키징학회지
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• 제15권2호
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• pp.37-45
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• 2008

본 논문에서는 유기 기판 위에 $100{\mu}m$ 피치를 갖는 플립칩 구조인 Cu(60 um)/SnAg(20 um) 더블 범프 플립칩 어셈블리를 구현하여 이의 리플로우, 고온 유지 신뢰성, 열주기 신뢰성, Electromigration 신뢰성을 평가하였다. 먼저, 리플로우의 경우 횟수와 온도에 상관없이 범프 접속 저항의 변화는 거의 나타나지 않음을 알 수 있었다. 125도 고온 유지 시험에서는 2000시간까지 접속 저항 변화가 관찰되지 않았던 반면, 150도에서는 Kirkendall void의 형성으로 인한 접속 저항의 증가가 관찰되었다 또한 Electromigration 시험에서는 600시간까지 불량이 발생하지 않았는데 이는 Al금속 배선에서 유발되는 높은 전류 밀도가 Cu 칼럼의 높은 두께로 인해 솔더 영역에서는 낮아지기 때문으로 해석되었다. 열주기 시험의 경우, 400 cycle 이후부터 접속 저항의 증가가 발견되었으며, 이는 열주기 시험 동안 실리콘 칩과 Cu 칼럼 사이에 작용하는 압축 변형에 의해 그 사이에 있는 Al 및 Ti 층이 바깥쪽으로 밀려나감으로 인해 발생하는 것으로 확인되었다.

• 열처리공학회지
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• 제35권4호
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• pp.193-202
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• 2022

Manholes and underground spaces are installed to manage the buried heat transport pipes of the district heating system, and the corrosion damage of the equipment placed in this space often occurs. The purpose of this work is to identify locations with a high risk of corrosion damage in the air vent and to establish preventive measures based on precise analysis via sampling of heat transport pipes and air vents that have been used for about 30 years. The residual thickness of the air vent decreased significantly by reaching ~1.1 mm in thickness, and locations of 60~70 mm away from a transport pipe were the most vulnerable to corrosion. The energy dispersive X-ray spectroscopy (EDS) analysis was performed in the corroded oxides, and it was found that chloride ion was contained in the corrosion products. Anodic polarization tests were carried out on the air vent materials (SPPS250, SS304) with varying the amounts of chloride ions at two different temperatures (RT, 80℃). The higher concentration of chloride ions and temperature are, the lower corrosion resistances of both alloys are.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2005년도 ICCAS
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• pp.320-323
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• 2005

This paper discusses heat problem of IC, which composes the electronic instruments, to guarantee reliability of electronic instruments. And also proposes the unified equivalent model for various electronic instrument products to guarantee reliability and life of its parts. Because electronic instruments are down sizing and operated with high frequency, the internal temperature of electronic instruments is rising steadily. The internal temperature of the electronic instruments gives a big effect to electronic instrument's reliability and life. The semiconductor parts are the representative heat generation parts because of its complicated function, high frequency and high density. Consequently, guaranteeing reliability and life of electronic semiconductor is the important start point in securing the reliability and life of the electronic instrument product. Unfortunately, there are many factors, which affect heat dissipation efficiency. The heat dissipation efficiency follows the environment where the electronic instrument products are used. Therefore it is very difficult to define reliability and life of the electronic manufactures. Electronic instrument products are composed of printed circuit board (PCB), integrated circuit (IC), resistance, and capacitor and so on. And there are superposed thermal resistances, because the parts are arrayed on the printed circuit board (PCB), Therefore the total thermal resistance is variable. Consequently it cannot have same thermal model for each electronic instrument products. In the next part, we propose the unified equivalent model for various electronic instruments. And using the proposed equivalent model proofs the method for analysis reliability of electronic parts.

• 대한토목학회논문집
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• 제32권3D호
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• pp.223-229
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• 2012

도로 포장면과 타이어 사이의 마찰 저항을 미끄럼 저항이라고 한다. 미끄럼 저항은 도로 안전에 매우 중요한 요소이며, 다양한 요인이 복합적으로 작용한다. 미끄럼 저항 측정법의 한계를 극복하기 위해 컴퓨터 모델링을 이용한 해석 수행 결과, 속도가 증가하거나 수막두께가 두꺼울수록 미끄럼 저항은 감소하였다. 해석 결과를 이용해 수막두께와 속도에 따라 수막 위를 주행하는 타이어에 발생하는 양력을 계산할 수 있으며, IFI(International Friction Index) 미끄럼 저항 예측모델과 실측 미끄럼 저항과의 차이를 줄이기 위해 양력을 반영한 수정 IFI 미끄럼 저항 예측모델을 개발하였다. 예측모델과 실측 데이터의 상관관계 분석 결과, 기존 IFI 예측모델의 $R^2$는 0.49로, 수정 IFI 예측모델의 $R^2$는 0.64로 나타나 수정 IFI 예측모델이 기존모델에 비해 예측 효과가 우수하였다. 포장면의 상태에 따른 수막두께를 수정 예측모델에 반영할 경우 더욱 정확한 예측모델을 얻을 수 있을 것이다.

• 한국태양에너지학회 논문집
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• 제30권4호
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• pp.71-78
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• 2010

Investigation of the effective soil thermal conductivity(k) is the first step in designing the ground loop heat exchanger(borehole) of a geothermal heat pump system. The line source method is required by New and Renewable Energy Center of Korea Energy Management Corporation in analyzing data obtained from thermal response tests. Another important factor in designing the ground loop heat exchanger is the borehole thermal resistance($R_b$). There are two methods to evaluate $R_b$ : one is to use a line source method, and the other is to use a shape factor of the borehole. In this study, we demonstrated that the line source method produces better results than the shape factor method in evaluating $R_b$. This is because the borehole thermal resistance evaluated with the line source method characteristically reduces the temperature differences between an actual and a theoretical thermal behaviors of the borehole. Evaluation of $R_b$ requires soil volumetric heat capacity. However, the effect of the soil volumetric heat capacity on the borehole thermal resistance is very small. Therefore, it is possible to use a generally accepted average value of soil volumetric heat capacity($=2MJ/m^3{\cdot}K$) in the analysis. In this work, it is also shown that an acceptable range of the initial ignoring time should be in the range of 8~16hrs. Thus, a mean value of 12 hrs is recommended.

• 상하수도학회지
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• 제30권6호
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• pp.645-652
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• 2016

A membrane module including grid was designed and introduced to MBR (membrane bio-reactor) for the purpose of better control of membrane fouling. It could be anticipated that the grid enhances the shear force of fluid-air mixture into the membrane surface by even-distributing the fluid-air to the membrane module. As MLSS concentration, packing density which is expressed in the ratio of the housing and the cross-sectional area of membrane fibers ($A_m/A_t$) and air-flow rate were changed, membrane foulings were checked by monitoring fouling resistances. The total fouling resistance ($R_c+R_f$) without grid installation (i.e., control) was $2.13{\times}10^{12}m^{-1}$, whereas it was reduced to $1.69{\times}10^{12}m^{-1}$ after the grid was installed. Regardless of the grid installation, the $R_c+R_f$ increased as the packing density increased from 0.09 to 0.28, however, the increment of resistance for the grid installation was less than that of the control. Increase in the air flow rate did not always guarantee the reduction of fouling resistance, indicating that the higher air flow rate can partially de-flocculate the activated sludge flocs, which led to severer membrane fouling. Consequently, installation of grids inside the housing have brought a beneficial effect on membrane fouling and optimum air flow rate is important to keep the membrane lowering fouling.