• 제목/요약/키워드: On-chip

검색결과 4,680건 처리시간 0.033초

Easily Adaptable On-Chip Debug Architecture for Multicore Processors

  • Xu, Jing-Zhe;Park, Hyeongbae;Jung, Seungpyo;Park, Ju Sung
    • ETRI Journal
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    • 제35권2호
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    • pp.301-310
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    • 2013
  • Nowadays, the multicore processor is watched with interest by people all over the world. As the design technology of system on chip has developed, observing and controlling the processor core's internal state has not been easy. Therefore, multicore processor debugging is very difficult and time-consuming. Thus, we need a reliable and efficient debugger to find the bugs. In this paper, we propose an on-chip debug architecture for multicore processors that is easily adaptable and flexible. It is based on the JTAG standard and supports monitoring mode debugging, which is different from run-stop mode debugging. Compared with the debug architecture that supports the run-stop mode debugging, the proposed architecture is easily applied to a debugger and has the advantage of having a desirable gate count and execution cycle. To verify the on-chip debug architecture, it is applied to the debugger of the prototype multicore processor and is tested by interconnecting it with a software debugger based on GDB and configured for the target processor.

Nanoscale Fabrication of Biomolecular Layer and Its Application to Biodevices

  • Park, Jeong-Woo;Nam, Yun-Suk;Masamichi Fujihira
    • Biotechnology and Bioprocess Engineering:BBE
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    • 제9권2호
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    • pp.76-85
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    • 2004
  • Biodevices composed of biomolecular layer have been developed in various fields such as medical diagnosis, pharmaceutical screening, electronic device, photonic device, environmental pollution detection device, and etc. The biomolecules such as protein, DNA and pigment, and cells have been used to construct the biodevices such as biomolecular diode, biostorage device, bioelectroluminescence device, protein chip, DNA chip, and cell chip. Substantial interest has focused upon thin film fabrication or the formation of biomaterials mono- or multi-layers on the solid surfaces to construct the biodevices. Based on the development of nanotechnology, nanoscale fabrication technology for biofilm has been emerged and applied to biodevices due to the various advantages such as high density immobilization and orientation control of immoblized biomolecules. This review described the nanoscale fabrication of biomolecular film and its application to bioelectronic devices and biochips.

플립 칩의 기하학적 형상과 구성재료의 변화에 따른 효과 (Effect by Change of Geometries and Material Properties for Flip-Chip)

  • 권용수;최성렬
    • 한국산업융합학회 논문집
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    • 제3권1호
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    • pp.69-75
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    • 2000
  • Multichip packages are comprised of dissimilar materials which expand at different rates on heating. The differential expansion must be accommodated by the various structural elements of the package. A types of heat exposures occur operation cycles. This study presents a finite element analysis simulation of flip-chip among multichip. The effects of geometries and material properties on the reliability were estimated during the analysis of temperature and thermal stress of flip-chip. From the results, it could be obtained that the more significant parameters to the reliability of flip-chip arc chip power cycle, heat convection and height of solder bump.

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디지털 방송 수신용 System in Package 설계 및 제작 (Design and Fabrication of the System in Package for the Digital Broadcasting Receiver)

  • 김지균;이헌용
    • 전기학회논문지
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    • 제58권1호
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    • pp.107-112
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    • 2009
  • This paper describes design and fabrication issues of the SiP(System in Package) one-chip for a portable digital broadcasting receiver. It includes RF tuner chip, demodulator chip and passive components for the receiver system. When we apply the SiP one-chip technology to the broadcasting receiver, the system board size can be reduced from $776mm^2$ to $144mm^2$. SiP one-chip has an advantage that the area reduces more 81% than separated chips. Also the sensitivity performance advances -1dBm about 36 channels in the RF weak electric field, the power consumption reduces about 2mW and the C/N keeps on the same level.

밀링용 칩 브레이커 인서트의 절삭력 예측 (Prediction of Cutting Forces for the Chip Breaker Insert in Milling)

  • 김국원;이우영;신효철
    • 대한기계학회논문집
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    • 제17권11호
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    • pp.2664-2675
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    • 1993
  • In this paper, the effects of chip breaker configuration on cutting forces for various cutting conditions are investigated and a method for predicting cutting forces effectively for chip breaker insert in milling is described. Based on the shear plane model and the relevant equations already existing for the relation among the parameters, the method makes use of the analytic geometric approach considering the configuration of cutting too by a 3-dimensional coordinate transformation matrix. The groove type chip breaker insert is modeled to be a double rake insert, represented by the first radial rake angle, the second radial rake angle and the length of land, and the program analyzing the cutting forces is developed. The program capability is verified by comparing the results with the experimental ones for a single cutter; and in case of primary cutting forces, the results of simulation and experiments agree very well showing 2%~16.7% difference within the feed rate range investigated.

선삭가공에 있어서 선삭저항의 신호처리와 그 응용에 관한 연구(II) (A Study on the Signal Process of Cutting Forces in Turning and its Application (2nd Report) -Automatic Monitor of Chip Rorms using Cutting Forces-)

  • 김도영;윤을재;남궁석
    • 한국정밀공학회지
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    • 제7권2호
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    • pp.85-94
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    • 1990
  • In automatic metal cuttings, the chip control is one of the serious problems. So the automatic detection of chip forms is essential to the chip control in automatic metal cuttings. Cutting experiments were carried out under the variety of cutting conditions (cutting speed, feed, depth of cut and tool geometry) and with workpiece made of steel (S45C), and cutting forces were measured in-processing by using a piezoelectric type Tool Dynamometer. In this report, the frequency analysis of dynamic components, the upper frequency distributions, the ratio of RMS values, the numbers of null point and the probability density were calculated from the dynamic componeents of cutting forces filtered through various band pass filters. Experimental results showed that computer chip form monitoring system based on the cutting forces was designed and simulated and that 6 type of chip forms could be detected while in-process machining.

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목편을 이용한 돈분 퇴비화에 관한 연구 (Study on the Composting of Swine Manure using Wood Chip as a Bulking Agent)

  • 김형호;박치호;김태일;정광화;최희철;이덕수;한정대
    • 한국축산시설환경학회지
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    • 제3권1호
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    • pp.27-34
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    • 1997
  • This study was carried out to evaluate the feasibility of composting of swine manure with wood chips as a bulking agent. To evaluate the optimum blending ratio of wood chip to swine manure three levels of wood chip such as 100, 150, and 200% were blended on a volume basis with 100% of swine manure was used to determine the effect of wood chip compared with sawdust as a bulking agent on composting. The maximum temperature reached during composting was 70, 58, 48, 72$^{\circ}C$ at blending ratio of 100, 150, 200, and 50WC+50SD%, respectively. The bulk density of compost was increased extremely with increasing the blending level of wood chip. The C/N ratio of final compost ranged from 18.25 to 19.82 . Heavy metal contents in the final compost were in the range of 0.05∼0.16 mg/kg, 5,86∼10.95 $\mu\textrm{g}$/kg, and 295∼440 mg/kg for Cd, Hg, and Cu, respectively. It was concluded that the blending ratio of 200:100 of wood chip and manure by volume was satisfactory for swine manure composting.

DS/CDMA 통신 시스템의 비선형 성능 분석 (Non-Liner Performance Analysis on the DS/CDMA Communication System)

  • 홍현문
    • 조명전기설비학회논문지
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    • 제19권1호
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    • pp.64-69
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    • 2005
  • 본 논문에서는 DS/CDMA 통신 시스템의 비선형 성능 분석하였다. 또한, 선형일 때 기존의 칩 파형 중 성능이 가장 우수한 Raised cosine 칩 파형과 비교하면 $BER=10^{-4}$을 기준으로 균일 칩 파형은 거의 유사한 성능을 갖지만, 비균일 칩 파형은 0.5[dB] 전력 이득을 찾아서 제안한 칩 파형 중 MAI를 최소화하는 최적의 칩 파형임을 알 수 있었다. 그러나 비선형일 때는 비균일 칩 파형의 높은 PAPR로 인하여 균일 칩 파형에 비해 좋지 않은 성능을 보였다. 즉 비균일 칩 파형이 사용된 비선형 CDMA 시스템에서 약 15[dB]정도의 IBO를 해야 선형 증폭기를 통과한 시스템의 성능과 같아지게 됨을 알 수 있었다.

네오디뮴 영구자석을 이용한 컨베이어벨트 구동형 미세칩 포집장치의 성능 평가 (Performance Evaluation of Microchip Removal Device Rotating by Conveyor Belt with Neodymium Permanent Magnet)

  • 최성윤;왕준형;왕덕현
    • 한국기계가공학회지
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    • 제20권1호
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    • pp.103-109
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    • 2021
  • Fine chips generated by machining have an impact on machine failure and quality of machined products, it is necessary to remove the chips, so the microchip collection and removal device by rotating conveyor belt with neodymium permanent magnets was developed. In this research, to solve the problem for reducing the existing microchips in the tank, a micro-chip removal device by rotating conveyor belt with neodymium permanent magnets developed. In the development of micro-chip removal device, 3D CATIA modeling was used, and the flow analysis and the electromagnetic force analysis were performed with COMSOL Multiphysics program. To evaluate the performance of the prototypes produced, design of experiments (DOE) is used to obtain the effect of neodymium conveyor movement speed on chip removal for the ANOVA analysis of recovered powders. An experiment was conducted to investigate the effect of the conveyor feed rate on the chip removal performance in detail. As a result of the experiment, it was confirmed that the slower the feeding speed of the fine chip removing device, the more efficient the chip removal.