• Journal of the Korean Wood Science and Technology
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• v.29 no.3
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• pp.68-72
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• 2001

In order to effectively use the waste wood, two types of woodceramics chip tile were made from woodceramics chip, gravel, zeolite and additions. The woodceramics chip was made from branch of apple tree (Malus pumila Mill.) Snow melting property, bending strength and compressive strength of woodceramics chip tile were tested according to the mixing rate of woodceramics chip. Snow melting properties of woodceramics chip tile increased after additions treatment but mechanical properties were reduced significantly after additions treatment. The results indicate that the additions are effective for snow melting property but negative effect on mechanical properties.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.04b
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• pp.477-480
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• 1995

Dccisions of optimal filling conditions for the chip encapsulation have been done primarily by an ad hoc use of expertise accumulated over the years because the chip encapsulation process is quite complicated. The current CAE systems do not provide mold designers with necessary knowledge of the chip encapsulation for the successful design of optimal filling except flow simulation capability. There have been no attempts to solve the optimal filling problem in the process of the chip encapsulation. In this paper, we have constructed an design system for optimal filling to avoid short shot in the chip encapsulation process which combines an optimization methodology with CAE software.

• Transactions of Materials Processing
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• v.15 no.9 s.90
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• pp.667-672
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• 2006

Agglutination is one of the most commonly employed reactions in clinical diagnosis. In this paper, we have designed and fabricated nickel mold insert for injection molding of a microfluidic lab-on-a-chip for the purpose of the efficient detection of agglutination. In the presented microfluidic lab-on-a-chip, two inlets for sample blood and reagent, flow guiding microchannels, improved serpentine laminating micromixer(ISLM) and reaction microwells are fully integrated. The ISLM, recently developed by our group, can highly improve mixing of the sample blood and reagent in the microchannel, thereby enhancing reaction of agglutinogens and agglutinins. The reaction microwell was designed to contain large volume of about $25{\mu}l$ of the mixture of sample blood and reagent. The result of agglutination in the reaction microwell could be determined by means of the level of the light transmission. To achieve the cost-effectiveness, the microfluidic lab-on-a-chip was realized by the injection molding of COC(cyclic olefin copolymer) and thermal bonding of two injection molded COC substrates. To define microfeatures in the microfluidic lab-on-a-chip precisely, the nickel mold inserts of lab-on-a-chip for the injection molding were fabricated by combining the UV photolithography with a negative photoresist SU-8 and the nickel electroplating process. The microfluidic lab-on-a-chip developed in this study could be applied to various clinical diagnosis based on agglutination.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.8 no.3
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• pp.437-443
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• 2007

In this paper, we propose the power-aware test framework for Network-on-Chip, which is based on embedded processor and on-chip network. First, the possibility of using embedded processor and on-chip network isintroduced and evaluated with benchmark system to test the other embeddedcores. And second, a new generation method of test pattern is presented to reduce the power consumption of on-chip network, which is called don't care mapping. The experimental results show that the embedded processor can be executed like the automatic test equipments, and the test time is reduced and the power consumption is reduced up to 8% at the communication components.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.6
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• pp.793-798
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• 2011

In this study, it was grasped to the flow characteristics of cutting fluid injected by nozzle installed in high pressure holder for avoiding chip curling occurred during machining process. And for avoiding chip curling, the possibility of elimination under various chip conditions was checked. Consequently, the highest discharging pressure and velocity was shown in 150 of nozzle inflow angle. Also as nozzle outlet diameter is small, the pressure and velocity of injected flow are high. Moreover, It could be confirmed that width and thickness of chip have no direct effect on chip elimination and it is achieved by torque generated by injected cutting fluid.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.6
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• pp.133-140
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• 1999

In this study, a monitoring method to detect chip disposal state in drilling system based on neural network was proposed and its performance was evaluated. If chip flow is bad during drilling, not only the static component but also the fluctuation of dynamic component of drilling. Drilling torque is indirectly measured by sensing spindle motor power through a AC spindle motor drive system. Spindle motor power being measured drilling, four quantities such as variance/mean, mean absolute deviation, gradient, event count were calculated as feature vectors and then presented to the neural network to make a decision on chip disposal state. The selected features are sensitive to the change of chip disposal state but comparatively insensitive to the change of drilling condition. The 3 layerd neural network with error back propagation algorithm has been used. Experimental results show that the proposed monitoring system can successfully recognize the chip disposal state over a wide range of drilling condition even though it is trained under a certain drilling condition.

• Journal of the Korean Society of Industry Convergence
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• v.2 no.2
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• pp.131-137
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• 1999

Package crack caused by the soldering process in the surface mounting plastic package is evaluated by applying the energy release rate criterion. The package crack formation depend on various parameters such as chip set, chip size, package thickness, package width, material properties and the moisture content etc. The effects of chip set and the other parameters were estimated during the analysis of package cracks which were located in the edge of the upper interface of the chip and the lower interlace of the die pad. From the results, it could be obtained that the more significant parameters to effect the chip set are chip width.

• 연구논문집
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• s.33
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• pp.17-25
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• 2003

In this work, thermal design of a PCR chip for LOC is systematically conducted. From the numerical simulation of a PCR chip based on the finite volume method, how to control the average temperature of a PCR chip and the temperature difference between the denaturation zone and the annealing zone is presented. The average temperature is shown to be controlled by adjusting heat input and a cooler as well as a heater is shown to be necessary to obtain three individual temperature zones for polymerase chain reaction. To reduce the time required, a heat sink for the cooler is not included in the calculation domain for the PCR chip and heat sink design is conducted separately by using a compact modeling method, the porous medium approach.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.146-150
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• 2001

Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. S-parameters of on-chip and substrate were separately measured in the frequency range of 200 MHz to 20 GHz using a microwave network analyzer HP8510 and cascade probe. And the cascade transmission matrix conversion was performed. The same measurements and conversion techniques were conducted on the assembled test chip and substrate at the same frequency range. Then impedance values in ACF flip-chip interconnection were extracted from cascade transmission matrix. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of SiO$_2$filler to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. High frequency behavior of metal Au stud bumps was investigated. The resonance frequency of the metal stud bump interconnects is higher than that of ACF flip-chip interconnects and is not observed at the microwave frequency band. The extracted model parameters of adhesive flip chip interconnects were analyzed with the considerations of the characteristics of material and the design guideline of ACA flip chip for high frequency applications was provided.

• Journal of the Korean Wood Science and Technology
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• v.26 no.1
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• pp.70-75
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• 1998

In this paper, the relationships between volumetric mixing ratio of rubber chip and physical and mechanical properties of wood/rubber composite panel was examined in order to investigate the mixture characteristics of wood and rubber chip. Because of the specific gravity of rubber differed from wood chip, physical properties of wood/rubber composite panel was shown very different values by mixing rate of chip element. Specific gravity in air-dry of composite panel was increased rapidly as volumetric percent of rubber chip was increased. Moisture content of composite panel was decreased as volumetric percent of rubber chip element was increased. This results was considered that wood weight is light and porosity material for moisture absorption. Compressive strength and modulus of rupture in bending test were decreased as volumetric percent of rubber chip increased. By mixing ratio control of chip elements, various wood/rubber composite panel can be applicable to every interior materials such as subfloor, playground, and exterior materials such as road blocks for recreational facilities in garden and forest and city parks.