• Title/Summary/Keyword: OPCB

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Optical PCB and Packaging Technology (광 PCB 및 패키징 기술)

  • Ryu, Jin-Hwa;Kim, Dong-Min;Kim, Eung-Soo;Jeong, Myung-Yung
    • Journal of the Microelectronics and Packaging Society
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    • v.18 no.1
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    • pp.7-13
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    • 2011
  • According to increasing of data transfer rate, printed circuit board (PCB) is required improvement of transmission speed. Optical PCB and its packaging technology can be one of the solutions that overcome the limitations of conventional electrical PCB. The data transmission capacity will be increased 10 Tbps at 2015. To this end, studies on various OPCB technologies are being conducted. For cost-effective and high- performance OPCB, studies of optical coupling by polymer replication process are conducted. In this work, optical waveguide and optical fiber array block were sequentially fabricated by polymer pattern replication method. Using this method we successfully demonstrate low loss optical fiber coupling between optical waveguide and optical fiber arrays. And researches on flip chip bonding process and using electro-optic connectors for packaging are conducted.

A CMOS Optical Receiver Design for Optical Printed Circuit Board (광PCB용 CMOS 광수신기 설계)

  • Kim Young;Kang Jin-Ku
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.43 no.7 s.349
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    • pp.13-19
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    • 2006
  • A 5Gb/s cross coupled transimpedance amplifier (TIA) & limiting amp(LA), regulated cascode(RGC) is realized in a 0.18$\mu$m CMOS technology for optical printed circuit board applications. The optical receiver demonstrates $92.8db{\Omega}$ transimpedance and limiting amplifier gain, 5Gb/s bandwidth for 0.5pF photodiode capacitance, and 9.74mW power dissipation from 1.8V, 2.4V supply. Input stage impedance is $50{\Omega}$. The circuit was implemented on an optical PCB, and the 5Gb/s data output signal was measured with a good data eye opening.

Propagation Characteristics and Tolerance Analysis of Optical Wires in Flexible Optical PCB by Ray Tracing (연성 광 PCB용 광 배선의 손실특성 및 제작 공차 분석)

  • Yeom, Jun-Cheol;Park, Dae-Seo;Kim, Young-Seok;Kim, Dae-Chan;Park, Se-Geun;O, Beom-Hoan;Lee, El-Hang;Lee, Seung-Gol;Jeon, Keum-Soo
    • Korean Journal of Optics and Photonics
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    • v.19 no.4
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    • pp.255-261
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    • 2008
  • In this study, the propagation characteristics and the fabrication tolerance of an optical wire in a flexible optical PCB were analyzed by using a ray-tracing method. It is found from the analysis that the sidewall angle of a core should be controlled within $1^{\circ}$ in order to maintain the propagation loss to less than -1 dB/mm, and that the bending radius of the optical wire should be larger than 5 mm in order to suppress the bending loss below -1 dB. In addition, it is confirmed that the lateral misalignment of ${\pm}15\;{\mu}m$, and the angular tilting of VCSEL of $6^{\circ}$ are allowable for the coupling loss of -1 dB.