• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.10
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• pp.5906-5911
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• 2014

Currently, there are many processes of package assembly and inspections of real fields that examine whether a manufactured semiconductor can be operated regularly and can endure low humidity or high temperatures. As the inspection equipment of a semiconductor test handler picker has been used at the inspection process, these inspection equipment frames were modelled in 3D and these models were analyzed using 3 kinds of fatigue loadings. As the analysis result, maximum deformation occurred at the midparts of the frames at cases 1 and 2. Among the cases of nonuniform fatigue loads, the 'SAE bracket history' with the severest change in load became the most unstable but the 'Sample history' became the most stable. Fatigue analysis result can be used effectively with the design of an inspecting equipment frame of a semiconductor test handler picker to examine the prevention and durability against damage.

• Transactions of the Korean Society of Automotive Engineers
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• v.23 no.2
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• pp.208-213
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• 2015

In this study, two models due to the configuration of caliper cylinder among the parts of automotive brake system are studied by structural and fatigue analysis. As the maximum equivalent stress at model 2 becomes 1.5 times lower than model 1, model 2 can endure load higher than model 1. In case of fatigue damage analysis on model 1 and 2, model 1 has the damage area more than model 2. Fatigue damage at model 1 happen more than model 2. These study results can be effectively utilized with the design on caliper cylinder by anticipating prevention against its damage and investigating durability.