• 제목/요약/키워드: Nonequilibrium heat treatment

검색결과 5건 처리시간 0.019초

비평형 열처리에 의한 주조용 Al-Si-Cu합금 조직의 개량 효과 (Effects of the Non-equilibrium Heat-treatment on Modification of Microstructures of Al-Si-Cu Cast Alloy)

  • 김헌주
    • 열처리공학회지
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    • 제13권6호
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    • pp.391-397
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    • 2000
  • Addition of Ca element and nonequilibrium heat treatment which promotes shape modification of eutectic Si and ${\beta}$ intermetallic compound were conducted to improve the mechanical properties of Al-Si-Cu alloy. Modification of eutectic Si and dissolution of needle-shape ${\beta}$ intermetallic compounds were possible by nonequilibrium heat treatment in which specimens were held at $505^{\circ}C$ for 2 hours in Al-Si-Cu alloy with Fe. Owing to the decrease in aspect ratio of eutectic Si by the heat treatment of the alloy with 0.33wt.% Fe, the increase in elongation was prominent to be more than double that in the as-cast specimen. Dissolution of needle-shape ${\beta}$ intermetallic compounds in the alloy with 0.85wt.% Fe led to the improvement of tensile strength as the length of ${\beta}$ compounds decreased to 50%.

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듀얼 소스 증착장치를 이용한 Ni-C 박막의 특성에 관한 연구 (A Study on the Characterization of Ni-C Thin Films Utilizing a Dual-Source Deposition System)

  • 한창석;전창환;한승오
    • 열처리공학회지
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    • 제21권5호
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    • pp.235-243
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    • 2008
  • Ni-C composite films were prepared using a combination of microwave plasma CVD and ion beam sputtering deposition working in a codeposition way. The structure of these films was characterized by energy-dispersive X-ray diffraction (EDXRD), transmission electron microscopy (TEM) and Raman spectroscopy. It was found that a nickel carbide phase, $Ni_3C$ (hcp), formed as very fine crystallites over a wide temperature range when Ni-C films were deposited at low $CH_4$ flow rates. The thermal stability of this nonequilibrium carbide $Ni_3C$ was also studied. As a result, the $Ni_3C$ carbide was found to decompose into nickel and graphite at around $400^{\circ}C$. With high $CH_4$ flow rates (> 0.2 sccm), the structure of the Ni-C films became amorphous. The formation behavior of the carbide and amorphous Ni-C phases are discussed in relation to the electrical resistivity of the films.

7XXX계 단조재의 피로 및 파괴인성에 미치는 제조공정의 영향 (Effect of Fabrication Processes on the Fatigue and Fracture Toughness of 7XXX Series Aluminum Forgings)

  • 이오연;임재규;송기홍;손영일;은일상;신돈수
    • 열처리공학회지
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    • 제9권3호
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    • pp.161-168
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    • 1996
  • The purpose of this study is to investigate the effect of impurity level and fabrication processes on the strength, fracture toughness and fatigue resistance of 7075, 7050 and 7175 high strength aluminum forgings. It has been verified that plane strain fracture toughness and fatigue characteristics of a specially processed 7175S-T74 alloy is superior to a conventionally processed 7075-T6/T73, 7050-T74 and 7175-T74 alloys. These beneficial effects primarily arise from two view points, i.e., the effect of reducing the impurity level of iron and silicon has significantly diminished the size and volume fraction of second phase particles such as $Al_7Cu_2Fe$ and $Mg_2Si$. Futher reduction of the amount of nonequilibrium second phase particles has been observed by applying a special fabrication process.

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용탕단조 Al-Cu-Si-Mg합금의 열처리시 제2응고상의 분해거동 (Decomposition Behavior of Secondary Solidification Phase During Heat Treatment of Squeeze Cast Al-Cu-Si-Mg)

  • 김유찬;김도향;한요섭;이호인
    • 한국주조공학회지
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    • 제17권6호
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    • pp.560-568
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    • 1997
  • The dissolution behavior of secondary solidification phases in squeeze cast Al-3.9wt%Cu-1.5wt%Si-1.0wt%Mg has been studied using a combination of optical microscope, image analyzer, scanning electron microscope(SEM), energy dispersive spectrometer(EDS), X-ray diffractometer(XRD) and differential thermal analyzer (DTA). Special emphasis was placed on the investigation of the effects of the nonequilibrium heat treatment on the dissolution of the second solidification phases. Ascast microstructure consisted of primary solidification product of ${\alpha}-Al$ and secondary solidification products of $Al_2Cu$, $Mg_2Si$ and $Al_2CuMg$. Equilibrium and non-equilibrium solution treatments were carried out at the temperatures of $495^{\circ}C$, $502^{\circ}C$ and $515^{\circ}C$ for 3 to 5 hours. The amount of the dissolved secondary phases increased with increasing solution treatment temperature, for example, area fractions of $Al_2Cu$, $Mg_2Si$ and $Al_2CuMg$ were approximately 0%, 1.6% and 4.2% after solution treatment at $495^{\circ}C$ for 5hours, and were approximately 0%, 0.36% and 2% after solution treatment at $515^{\circ}C$ for 5hours. The best combination of tensile properties was obtained when the as-cast alloy was solution treated at $515^{\circ}C$ for 3hours followed by aging at $180^{\circ}C$ for 10 hours. Detailed DTA and TEM study showed that the strengthening behavior during aging was due to enhanced precipitation of the platelet type fine ${\theta}'$ phase.

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Pb-Sn 합금도금의 이론 및 실제적 경향 (Theoretical and Practical Aspects of Pb-Sn Alloy Plating)

  • 백영남
    • 한국표면공학회지
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    • 제12권3호
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    • pp.161-166
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    • 1979
  • Theoretical and practical aspects are investigated for electrochemical behavious, plating processes and the structures of electrodeposit of Pb-Sn binary alloy plating through numerous literatures in this report. The anodic and cathodic electrode reaction mechanisms of Pb and Sn could co-deposit and make Pb-Sn alloy deposit from the results of cathode current density-cathode potential curves of Pb, Sn and Pb-Sn alloys in fluoborate solutions. The compositions of the best alloy plating solutions are obtained for the purpose of bearing, anticorrosion and solder plating. In general, the casting anodes of Pb-Sn alloys are used, but separated anodes of Pb and Sn pure metal are used in order to obtain the fine compositions of Pb-Sn alloy deposits. The electrodeposits of Pb-Sn alloy are in nonequilibrium state and saturated solid solutions. Thus, ${\beta}$-phase (Sn-phase) is precipitated by heat treatment. The texture and structure of the electrodeposit are associated with the surface energies of deposit lattice planes and with the cathode polarization. The electrodeposit of Pb-Sn alloy is shown as lamellar structure.

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