• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.229.2-229.2
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• 2013

Yttrium oxide (Y2O3)는 band gap이 5.5 eV 정도로 상대적으로 넓고, 굴절상수가 1.8, 유전율이 10~15, Silicon 과의 격자 불일치가 작은 특성을 가지고 있다. 또한 녹는점이 높아 열적으로 안정하기 때문에 전자소자 및 광학소자에 다양하게 응용되는 물질이다. Y2O3 박막은 다양한 방법으로 증착할 수 있는데, 그 방법에는 e-beam evaporation, laser ablation, sputtering, thermal oxidation, metal-organic chemical vapor deposition, and atomic layer deposition (ALD) 등이 있다. ALD는 기판 표면에 흡착된 원자들의 자기 제한적 반응에 의하여 박막이 증착되기 때문에 박막 두께조절이 용이하고 step coverage와 uniformity 측면에서 큰 장점이 있다. 이전에는 Y(thd)3 and Y(CH3Cp)3 와 같은 금속 전구체를 이용하여 ALD를 진행하여, 증착 속도가 낮고 defect이 많아 non-stoichiometric한 조성의 박막이 증착되는 문제점이 있었다. 이번 연구에서는, (iPrCp)2Y(iPr-amd)와 탈이온수를 사용하여 Y2O3 박막을 증착하였다. Y2O3 박막 증착에 사용한 Y 전구체는 상온에서 액체이고 $192^{\circ}C$ 에서 1 Torr의 높은 증기압을 갖는다. Y2O3 박막 증착을 위하여 Y 전구체는 $150^{\circ}C$ 로 가열하여 N2 gas를 이용하여 bubbling 방식으로 공정 챔버 내로 공급하였다. Y2O3 박막의 ALD window는 $250{\sim}350^{\circ}C$ 였으며, Y 전구체의 공급시간이 5초에 다다르자 더 이상 증착 두께가 증가하지 않는 자기 제한적 반응을 확인할 수 있었다. 그리고 증착된 Y2O3 박막의 특성 분석을 위해 Atomic force microscopy (AFM)과 X-ray photoelectron spectroscopy (XPS), Auger electron spectroscopy (AES) 를 진행하였다. 박막의 Surface morphology 는 매끄럽고 uniform 하였으며, 특히 고체 금속 전구체를 사용했을 때와 비교하여 수산화물이 거의 없는 박막을 얻을 수 있었다. 그리고 조성 분석을 통해 증착된 Y2O3 박막이 stoichiometric하다는 것을 알수 있었다. 또한 metal-insulator-metal (MIM) 구조 (Ru/Y2O3/Ru) 의 resistor 소자를 형성하여 저항 스위칭 특성을 확인하였다.

• Steel and Composite Structures
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• 제42권6호
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• pp.805-826
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• 2022

The free and live load-forced vibration behaviour of porous functionally graded (PFG) higher order nanobeams in the thermal and magnetic fields is investigated comprehensively through this work in the framework of nonlocal strain gradient theory (NLSGT). The porosity effects on the dynamic behaviour of FG nanobeams is investigated using four different porosity distribution models. These models are exploited; uniform, symmetrical, condensed upward, and condensed downward distributions. The material characteristics gradation in the thickness direction is estimated using the power-law. The magnetic field effect is incorporated using Maxwell's equations. The third order shear deformation beam theory is adopted to incorporate the shear deformation effect. The Hamilton principle is adopted to derive the coupled thermomagnetic dynamic equations of motion of the whole system and the associated boundary conditions. Navier method is used to derive the analytical solution of the governing equations. The developed methodology is verified and compared with the available results in the literature and good agreement is observed. Parametric studies are conducted to show effects of porosity parameter; porosity distribution, temperature rise, magnetic field intensity, material gradation index, non-classical parameters, and the applied moving load velocity on the vibration behavior of nanobeams. It has been showed that all the analyzed conditions have significant effects on the dynamic behavior of the nanobeams. Additionally, it has been observed that the negative effects of moving load, porosity and thermal load on the nanobeam dynamics can be reduced by the effect of the force induced from the directed magnetic field or can be kept within certain desired design limits by controlling the intensity of the magnetic field.

• 한국터널지하공간학회 논문집
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• 제12권1호
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• pp.31-41
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• 2010

본 연구에서는 실험 및 수치해석적인 접근방법을 통하여 대심도 과지압 구간에서 발생하는 암반의 스폴링(spalling) 및 팽창모드에 대한 모델링 기법을 연구하였다. 이에 대한 실험적 접근 방법으로서 축 방향 압축을 받는 직사각형 인공암석보(beam)에 4점 휨 시험을 결합한 축방향 압축 휨 시험을 수행하여 대심도 지하공간의 응력모드와 유사한 조건 하에서의 암석의 균열 팽창 및 스폴링 과정을 고찰하였다. 또한, 수치해석적 접근방법으로서 기존의 연속체 해석으로는 모사하기 힘든 암석의 균열과정 및 팽창특성을 개별 입자해석 프로그램인 PFC2D를 이용하여 모델링 하였다. 본 연구 결과 휨 실험에서 구한 팽창시점은 스폴링에 요구되는 응력수준을 평가하는데 중요한 지표가 됨을 알 수 있었으며, 또한 수치해석 결과도 유사한 결과를 모사할 수 있음을 보여주었다.

• 한국강구조학회 논문집
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• 제22권5호
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• pp.399-409
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• 2010

강구조물은 부식에 의한 단면감소와 이로 인한 내하성능의 저하가 우려된다. 그러나 부식손상이 강부재의 내하성능에 미치는 영향과 잔존 내하성능 평가법은 명확하게 정립되어 있지 않은 실정이다. 본 연구에서는 부식 손상된 지하철 가시설 주형보의 웨브와 플랜지에서 절취한 부식시편의 인장실험을 실시하여, 부식손상이 인장 내하성능에 미치는 영향과 인장 잔존 내하성능 평가법에 대하여 검토하였다. 부식 가시설 주형보로부터 절취한 총 21개의 부식시편은 먼저 화학적 방법에 의해 부식생성물을 제거하고 1mm간격으로 표면형상을 측정한 후 인장실험을 실시하였다. 이러한 인장실험 결과는 주형보의 플랜지에서 절취하여 두께 13mm로 기계 가공한 무부식 기준시편의 인장실험 결과와 비교하여, 잔존두께와 표면형상이 부식강재의 항복하중, 인장하중 및 연신율에 미치는 영향을 정량화하였다. 그리고 부식의 유무에 상관없이 일정한 강재의 극한강도를 이용하여 무부식 등단면 강재와 동일하게 인장응력을 평가할 수 있는 불규칙 변단면 부식강재의 유효두께를 표면형상 측정결과로 산출한 평균잔존두께와 표준편차로 정식화하였다. 또한 이러한 결과를 실무에도 적용할 수 있도록 부식강재의 합리적인 잔존두께 측정간격도 제시하였다.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.250-254
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• 2002

Intergranular corrosion of austenitic stainless steels is a conventional and momentous problem during welding and high temperature use. One of the major reasons for such intergranular corrosion is so-called sensitization, i.e., chromium depletion due to chromium carbide precipitation at grain boundaries. Conventional methods for preventing sensitization of austenitic stainless steels include reduction of carbon content in the material, stabilization of carbon atoms as non-chromium carbides by the addition of titanium, niobium or zirconium, local solution-heat-treatment by laser beam, etc. These methods, however, are not without drawbacks. Recent grain boundary structure studies have demonstrated that grain boundary phenomena strongly depend on the crystallographic nature and atomic structure of the grain boundary, and that grain boundaries with coincidence site lattices are immune to intergranular corrosion. The concept of "grain boundary design and control", which involves a desirable grain boundary character distribution, has been developed as grain boundary engineering. The feasibility of grain boundary engineering has been demonstrated mainly by thermomechanical treatments. In the present study, a thermomechanical treatment was tried to improve the resistance to the sensitization by grain boundary engineering. A type 304 austenitic stainless steel was pre-strained and heat-treated, and then sensitized, varying the parameters (pre-strain, temperature, time, etc.) during the thermomechanical treatment. The grain boundary character distribution was examined by orientation imaging microscopy. The intergranular corrosion resistance was evaluated by electrochemical potentiokinetic reactivation and ferric sulfate-sulfuric acid tests. The sensitivity to intergranular corrosion was reduced by the thermomechanical treatment and indicated a minimum at a small roll-reduction. The frequency of coincidence-site-lattice boundaries indicated a maximum at a small strain. The ferric sulfate-sulfuric acid test showed much smaller corrosion rate in the thermomechanically-treated specimen than in the base material. An excellent intergranular corrosion resistance was obtained by a small strain annealing at a relatively low temperature for long time. The optimum parameters created a uniform distribution of a high frequency of coincidence site lattice boundaries in the specimen where corrosive random boundaries were isolated. The results suggest that the thermomechanical treatment can introduce low energy segments in the grain boundary network by annealing twins and can arrest the percolation of intergranular corrosion from the surface.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.1261-1262
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• 2008

Laser-based crystallization techniques are ideally-suited for forming high-quality crystalline Si films on active-matrix display backplanes, because the highly-localized energy deposition allows for transformation of the as-deposited a-Si without damaging high-temperature-intolerant glass and plastic substrates. However, certain significant and non-trivial attributes must be satisfied for a particular method and implementation to be considered manufacturing-worthy. The crystallization process step must yield a Si microstructure that permits fabrication of thin-film transistors with sufficient uniformity and performance for the intended application and, the realization and implementation of the method must meet specific requirements of viability, robustness and economy in order to be accepted in mass production environments. In recent years, Low Temperature Polycrystalline Silicon (LTPS) has demonstrated its advantages through successful implementation in the application spaces that include highly-integrated active-matrix liquid-crystal displays (AMLCDs), cost competitive AMLCDs, and most recently, active-matrix organic light-emitting diode displays (AMOLEDs). In the mobile display market segment, LTPS continues to gain market share, as consumers demand mobile devices with higher display performance, longer battery life and reduced form factor. LTPS-based mobile displays have clearly demonstrated significant advantages in this regard. While the benefits of LTPS for mobile phones are well recognized, other mobile electronic applications such as portable multimedia players, tablet computers, ultra-mobile personal computers and notebook computers also stand to benefit from the performance and potential cost advantages offered by LTPS. Recently, significant efforts have been made to enable robust and cost-effective LTPS backplane manufacturing for AMOLED displays. The majority of the technical focus has been placed on ensuring the formation of extremely uniform poly-Si films. Although current commercially available AMOLED displays are aimed primarily at mobile applications, it is expected that continued development of the technology will soon lead to larger display sizes. Since LTPS backplanes are essentially required for AMOLED displays, LTPS manufacturing technology must be ready to scale the high degree of uniformity beyond the small and medium displays sizes. It is imperative for the manufacturers of LTPS crystallization equipment to ensure that the widespread adoption of the technology is not hindered by limitations of performance, uniformity or display size. In our presentation, we plan to present the state of the art in light sources and beam delivery systems used in high-volume manufacturing laser crystallization equipment. We will show that excimer-laser-based crystallization technologies are currently meeting the stringent requirements of AMOLED display fabrication, and are well positioned to meet the future demands for manufacturing these displays as well.