• Korean Chemical Engineering Research
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• v.49 no.5
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• pp.611-616
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• 2011

In the study, annealing temperature was optimized by comparing with avrami crystallization rate and constant (k) using non-oriented PLA film as a base film. Crystallization rate constant of PLA film was 1.64, 1.68, and 1.26 at $120^{\circ}C$, $130^{\circ}C$, and $140^{\circ}C$, respectively. Annealing temperature was mainly affected on the surface properties such as rougnness (Ra) and kinetic friction coefficient (${\mu}_k$). Roughness of PLA film was 0.006 ${\mu}m$ at $80^{\circ}C$ and increased to 0.009 ${\mu}m$ 0.015 ${\mu}m$, 0.027 ${\mu}m$, and 0.029 ${\mu}m$ at $110^{\circ}C$, $120^{\circ}C$, $130^{\circ}C$ and $140^{\circ}C$, respectively. Kinetic friction coefficient decreased 0.45 to 0.43, 0.33, 0.31, 0.27 as annealing temperature was at $80^{\circ}C$, $110^{\circ}C$, $120^{\circ}C$, $130^{\circ}C$, and $140^{\circ}C$, respectivly. In addition, rate constant (k) was 0.58, 0.46, and 0.39 with adding 1 wt%, 3 wt%, and 5 wt% talc, respectively.