• Composites Research
• /
• v.20 no.5
• /
• pp.43-48
• /
• 2007

The absorption and the interference shielding of electromagnetic wave have been very important issues for commercial and military purposes. The stealth technique is one of the most typical applications of electromagnetic wave absorption technology. This study has started for the development of composite fillers containing dielectric and magnetic lossy materials. To improve the electromagnetic characteristics of conductive nano fillers, carbon nanofibers (CNFs) with nickel-phosphorous (Ni-P) or nickel-iron (Ni-Fe) have been fabricated by the electroless plating process. Observations by the electron microscopy (SEM/TEM) and element analyzer (EDS/ELLS) showed the uniform Ni-P and Ni-Fe coated CNFs. The compositions of the plating layers were about Ni-6wt%P and Ni-70wt%Fe, respectively. The average thicknesses of the plating layers were about $50\;{\sim}\;100\;nm$.

• Journal of the Korean institute of surface engineering
• /
• v.48 no.3
• /
• pp.100-104
• /
• 2015

The nickel alloys gets a great deal of attention due to their good mechanical, chemical and magnetic properties. Especially Ni-P alloy systems are very attractive due to their good corrosion resistance and the wear resistance in important technological applications. In this study, the effects of phosphorus acid concentration in plating solution on composition of Ni-P alloy coatings were studied. The Ni-P electrodeposits of the various P contents were investigated in order to understand effect of the composition on mechanical properties of Ni-P electrodeposits. The mechanical properties of electrodeposits increased as the P content in electrodeposits increase. The results of mechanical properties were explained by grain size and P solid solution effect. The effects of heat treatment on mechanical properties of Ni-P alloy coatings were also studied.

• Journal of the Microelectronics and Packaging Society
• /
• v.8 no.3
• /
• pp.55-62
• /
• 2001

With a spread of BGA, CSP and fine pitch devices, the need of flatter surface finish in bare board is becoming more critical in solderability. The electroless Ni/Au plating has a solution of these needs and also has being spread to apply to surface finish for bare board in many electronic goods. But, the electroless Ni/Au plating had several issues such as Ni oxidation and phosphorous contents. Before this study, we studied on the effect of BGA solderability in electroless Ni/Au plating and chose some major factors such as the oxidation property of NiP plating and warpage of board. Firstly, we made test board with various plating conditions and improved the plating property through the improvement of NiP oxidation reducing P content. Also, we minimized the warpage of board with the improvement of inner layer structure and the analysis of warpage. For the evaluation of solderability, we analyzed the warpage of board and the plating property after mounting BGA on the board with optimizing conditions. The solder joint of BGA is investigated by SEM(Scanning Electronic Microscope) and OM(Optical Microscope). The composition of joint is used by EDS(Energy Dispersive Spectroscopy). We analyzed the fracture strength and mode by ball shear teser.