• Title/Summary/Keyword: Nickel coating

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Microstructure and Thermal Fatigue Properties of Flame-Sprayed Nickel-Based Coatings (니켈계 용사층의 조직 및 열피로 특성)

  • 김형준;권영각
    • Journal of the Korean institute of surface engineering
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    • v.29 no.3
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    • pp.163-175
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    • 1996
  • Flame-sprayed Ni-based coatings are investigated in order to improve the thermal fatigue properties of gray cast iron in the presence of water spraying. The results of thermal cycling tests from room temperature to $1100^{\circ}C$ indicate that thermal fatigue endurance is increased in the order of Ni-20%Cr, NiCr-6%Al, and Ni-5%Al. The thermal fatigue failure is caused by the formation of iron oxides between the coating and the substrate and then the thermal fatigue cracks have propagated either along the brittle iron oxide layer resulting in the spatting of the coatings in case of Ni-5%Al and NiCr-6%Al coatings or to the substrate resulting in the whole specimen fracture in case of Ni-20%Cr coating. It seems that the most governing factor for thermal fatigue resistance is the thermal expansion coefficient difference between the coating and the substrate. Microstructural variations before and after the tests are also discussed.

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Galvanic Corrosion Behavior of Copper Canister

  • Minsoo Lee;Junhyuk Jang;Jin Seop Kim
    • Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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    • v.22 no.1
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    • pp.55-66
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    • 2024
  • In this study, we investigated the suppression of the corrosion of cast iron in a copper-cast iron double-layered canister under local corrosion of the copper layer. The cold spray coating technique was used to insert metals with lower galvanic activity than that of copper, such as silver, nickel, and titanium, between the copper and cast iron layers. Electrochemically accelerated corrosion tests were performed on the galvanic specimens in KURT groundwater at a voltage of 1.0 V for a week. The results revealed that copper corrosion was evident in all galvanic specimens of Cu-Ag, Cu-Ni, and Cu-Ti. By contrast, the copper was barely corroded in the Cu-Fe specimens. Therefore, it was concluded that if an inactive galvanic metal is applied to the areas where local corrosion is concerned, such as welding parts, the disposal canister can overcome local or non-uniform corrosion of the copper canister for long periods.

Finite Element Simulation of Interface Bonding in Kinetic Sprayed Coatings (유한요소 시뮬레이션을 통한 저온 분사 코팅의 계면 접합에 대한 연구)

  • Bae, Gyu-Yeol;Kang, Ki-Cheol;Yoon, Sang-Hoon;Lee, Chang-Hee
    • Journal of Welding and Joining
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    • v.26 no.6
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    • pp.74-80
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    • 2008
  • A finite element modeling approach has been described for the simulation and analysis of the micron-scaled solid particle impact behavior in kinetic spraying process, using an explicit code (ABAQUS 6.7-2). High-strain-rate plastic deformation and interface bonding features of the copper, nickel, aluminum, and titanium were investigated via FEM in conjunction with the Johnson-Cook plasticity model. Different aspects of adiabatic shear instabilities of the materials were characterized as a concept of thermal boost-up zone (TBZ), and also discussed based upon energy balance concept with respect to relative recovery energy (RRE) for the purpose of optimizing the bonding process.

Fabrication of $100{\mu}m$ High Metallic Structure Using Negative Thick Photoresist and Electroplating (Negative Thick Photoresist를 이용한 $100{\mu}m$ 높이의 금속 구조물의 제작에 관한 연구)

  • Chang, Hyun-Kee;Kim, Yong-Kweon
    • Proceedings of the KIEE Conference
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    • 1998.07g
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    • pp.2541-2543
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    • 1998
  • This paper describes the fabrication process to fabricate metallic structure of high aspect ratio using LlGA-like process. SU-8 is used as an electroplating mold. SU-8 is an epoxy-based photoresist, designed for ultrathick PR structure with single layer coating [1,2]. We can get more than $100{\mu}m$ thick layer by single coating with conventional spin coater, and applying multiple coating can make thicker layers. In the experiments, we used different kinds of SU-8, having different viscosity. To optimize the conditions for mold fabrication process, experiments are performed varying spinning time and speed, soft-bake, develop and PEB (Post Expose Bake) condition. With the optimized condition, minimum line and space of $3{\mu}m$ pattern with a thickness of $40{\mu}m$ and $4{\mu}m$ pattern with a thickness of $130{\mu}m$ were obtained. Using the patterned PR as a plating mold, metallic structure was fabricated by electroplating. We have fabricated a electroplated nickel comb actuator using SU-8 as plating mold. The thickness of PR mold is $45{\mu}m$ and that of plated nickel is$40{\mu}m$. Minimum line of the mold is $5{\mu}m$. Patterned metallic layer or polymer layer, which has selectivity with the structural plated metallic layer, can be used as sacrificial layer for fabrication of free-standing structure.

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Nickel Silicide Nanowire Growth and Applications

  • Kim, Joondong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.215-216
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    • 2013
  • The silicide is a compound of Si with an electropositive component. Silicides are commonly used in silicon-based microelectronics to reduce resistivity of gate and local interconnect metallization. The popular silicide candidates, CoSi2 and TiSi2, have some limitations. TiSi2 showed line width dependent sheet resistance and has difficulty in transformation of the C49 phase to the low resistive C54. CoSi2 consumes more Si than TiSi2. Nickel silicide is a promising material to substitute for those silicide materials providing several advantages; low resistivity, lower Si consumption and lower formation temperature. Nickel silicide (NiSi) nanowire (NW) has features of a geometrically tiny size in terms of diameter and significantly long directional length, with an excellent electrical conductivity. According to these advantages, NiSi NWs have been applied to various nanoscale applications, such as interconnects [1,2], field emitters [3], and functional microscopy tips [4]. Beside its tiny geometric feature, NW can provide a large surface area at a fixed volume. This makes the material viable for photovoltaic architecture, allowing it to be used to enhance the light-active region [5]. Additionally, a recent report has suggested that an effective antireflection coating-layer can be made with by NiSi NW arrays [6]. A unique growth mechanism of nickel silicide (NiSi) nanowires (NWs) was thermodynamically investigated. The reaction between Ni and Si primarily determines NiSi phases according to the deposition condition. Optimum growth conditions were found at $375^{\circ}C$ leading long and high-density NiSi NWs. The ignition of NiSi NWs is determined by the grain size due to the nucleation limited silicide reaction. A successive Ni diffusion through a silicide layer was traced from a NW grown sample. Otherwise Ni-rich or Si-rich phase induces a film type growth. This work demonstrates specific existence of NiSi NW growth [7].

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A Study of Micro Freestanding Structure Fabrication using Nickel Electroless Plating And Silicon Anisotropic Etching (무전해 니켈 도금과 실리콘의 이방성 식각을 이용한 미세 가동 구조물의 제작방법에 관한 연구)

  • Kim, Seong-Hyok;Kim, Yong-Kweon;Lee, Jae-Ho;Huh, Jin
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.49 no.6
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    • pp.367-374
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    • 2000
  • This paper presents a method to fabricate freestanding structures by (100) silicon anisotropic etching and nickel electroless plating. The electroless plating process is simpler than the electroplating, and provides good coating uniformity and improved mechanical properties. Furthermore, the (100) silicon anisotropic etching in KOH solution with being aligned to <100> direction provides vertical (100) sidewalls on etched (100) surface. In this paper, the effects of the nickel electroless plating condition on the properties of electroless plated metal structures are investigated to apply fabrication of micro structures and then various micro structures are fabricated by nickel electroless plating. And then, the structures are released by silicon anisotropic etching in KOH solution with a large gap between the structure and the substrate. The fabricated cantilever structures are $210\mum$. wide, $5\mum$. thick and $15\mum$. over the silicon substrate, and the comb structure has the comb electrodes which are $4\mum$. wide and $4.3\mum$. thick separated by$1\mum$. It is released by silicon anisotropic etching in KOH solution. The gap between the structure and the substrate is $2.5\mum$.

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The High Temperature Oxidation Behavior of Diffusion Aluminized MarM247 Superalloy

  • Matsunaga, Yasuo;Matsuoka, Akira;Nakagawa, Kiyokazu
    • Corrosion Science and Technology
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    • v.2 no.1
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    • pp.53-57
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    • 2003
  • The MarM247 based superalloy (8wt.%Cr- 9wt.%Co- 3wt.%Ta- 1.5wt.%Hf- 5.6%wt.Al- 9.5wt.%W- Bal. Ni) specimens were diffusion aluminized by for types of pack cementation methods, and their coating structure and their high temperature oxidation resistance were investigated. The coated specimens treated at 973K in high aluminum concentration pack had a coating layer containing large hafunium rich precipitates, which were originally included in substrate alloy. After the high temperature oxidation test in air containing 30 vol.% $H_2O$ at 1273K ~ 323K, the deep localized corrosion which reached to the substrate were observed along with these hafnium rich precipitates. On the other hand, the coated specimens treated at 1323K using low aluminum concentration pack showed the coating layer without the large hafunium rich precipitates, and after the high temperature oxidation test at 1273K for 1800 ksec, it did not show the deep localized corrosion. The nickel electroplating before the aluminizing forms thick hafnium free area, and its high temperature oxidation resistance were comparable to platinum modified aluminizing coatings at 1273K.

Properties of Ni-P-SiC Composite Coating Layers Prepared by Electroless Plating Method (무전해도금법으로 형성한 Ni-P-SiC 복합도금막의 특성)

  • Lee, Hong-Kee;Lee, Ho-Young;Jeon, Jun-Mi
    • Journal of the Korean institute of surface engineering
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    • v.40 no.2
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    • pp.70-76
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    • 2007
  • Ni-P-SiC composite coating layers were prepared by electroless plating method and their deposition rate, codeposition of SiC, morphology, surface roughness, hardness, wear and friction properties were investigated. The deposition rate was kept almost constant independent of the concentration of SiC in the plating solution and the codeposition of SiC in the composite coating layer increased with increased concentration of SiC in the plating solution except the early stage. Vickers microhardness increased with respect to the increased codeposition of SiC and the heat treatment at $300^{\circ}C$ in air for 1 hour. It was found that the wear volume decreased with increased up to 50 wt.% of SiC codeposition, and that friction coefficient increased gradually with increased codeposition of SiC. Considering the wear and the friction behaviors, the composite coating layer obtained by using 50 wt.% of SiC codeposition is desirable for the practical application for anti-wear and anti-friction coatings.

Effect of Annealing Temperature on the Structural and Optical Properties of ZrO2 Thin Films

  • Kumar, Davinder;Singh, Avtar;Kaur, Navneet;Katoch, Apoorva;Kaur, Raminder
    • Korean Journal of Materials Research
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    • v.32 no.5
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    • pp.249-257
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    • 2022
  • Transparent thin films of pure and nickel-doped ZrO2 are grown successfully by sol-gel dip-coating technique. The structural and optical properties according to the different annealing temperatures (300 ℃, 400 ℃ and 500 ℃) are investigated. Analysis of crystallographic properties through X-ray diffraction pattern reveals an increase in crystallite size due to increase in crystallinity with temperature. All fabricated thin films are highly-oriented along (101) planes, which enhances the increase in nickel doping. Scanning electron microscopy and energy dispersive spectroscopy are employed to confirm the homogeneity in surface morphology as well as the doping configuration of films. The extinction coefficient is found to be on the order of 10-2, showing the surface smoothness of deposited thin films. UV-visible spectroscopy reveals a decrease in the optical band gap with the increase in annealing temperature due to the increase in crystallite size. The variation in Urbach energy and defect density with doping and the change in annealing temperature are also studied.

Annealing Temperature of Nickel Oxide Hole Transport Layer for p-i-n Inverted Perovskite Solar Cells (P-I-N 역구조 페로브스카이트 태양전지 응용을 위한 Nickel oxide 홀전달층의 열처리 온도 연구)

  • Gisung Kim;Mijoung Kim;Hyojung Kim;JungYup Yang
    • Current Photovoltaic Research
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    • v.11 no.4
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    • pp.103-107
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    • 2023
  • A Nickel oxide (NiOx) thin films were prepared via sol-gel process on a transparent conductive oxide glass substrate. The NiOx thin films were spin-coated in ambient air and subsequently annealed for 30 minutes at temperatures ranging from 150℃ to 450℃. The structural and optical characteristics of the NiOx thin films annealed at various temperatures were measured using X-ray diffraction, field emission scanning electron microscopy, and ultraviolet-visible spectroscopy. After optimizing the NiOx coating conditions, perovskite solar cells were fabricated with p-i-n inverted structure, and its photovoltaic performance was evaluated. NiOx thin films annealed at 350℃ exhibited the most favorable characteristics as a hole transport layer, resulting in the highest power conversion efficiency of 17.88 % when fabricating inverted perovskite solar cells using this film.