• 한국전기전자재료학회논문지
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• 제20권4호
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• pp.308-317
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• 2007

We fabricated thermally-evaporated 10 nm-Ni/(poly)Si and 10 nm-$Ni_{0.5}Co_{0.5}$/(Poly)Si structures to investigate the microstructure of nickel silicides at the elevated temperatures required lot annealing. Silicides underwent rapid annealing at the temperatures of $600{\sim}1100^{\circ}C$ for 40 seconds. Silicides suitable for the salicide process formed on top of both the single crystal silicon actives and the polycrystalline silicon gates. A four-point tester was used to investigate the sheet resistances. A transmission electron microscope and an Auger depth profilescope were employed for the determination of vortical microstructure and thickness. Nickel silicides with cobalt on single crystal silicon actives and polycrystalline silicon gates showed low resistance up to $1100^{\circ}C$ and $900^{\circ}C$, respectively, while the conventional nickle monosilicide showed low resistance below $700^{\circ}C$. Through TEM analysis, we confirmed that a uniform, $10{\sim}15 nm$-thick silicide layer formed on the single-crystal silicon substrate for the Co-alloyed case while a non-uniform, agglomerated layer was observed for the conventional nickel silicide. On the polycrystalline silicon substrate, we confirmed that the conventional nickel silicide showed a unique silicon-silicide mixing at the high silicidation temperature of $1000^{\circ}C$. Auger depth profile analysis also supports the presence of this mixed microstructure. Our result implies that our newly proposed NiCo-alloy composite silicide process may widen the thermal process window for the salicide process and be suitable for nano-thick silicides.

• Corrosion Science and Technology
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• 제7권2호
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• pp.92-98
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• 2008

This paper describes the experiments of the corrosion and the sliding tests of the nickel-based alloys for the gate valve seating materials used at high pressure and temperature. The general corrosion rates and IGC susceptibility are tested in pressurized water at 533 K and 575 K and in Strauss test solution. The sliding tests have been done in pressurized water at 293 k, 473 K and 573 k. The alloys containing above 10% chromium may have the anti-corrosion properties that could be applied to the valve seats for the power plants. The good sliding performance and the good pressure tightness are obtained when the disc specimens that have hardness 500 to 600 Hv combined with the seat specimens that have hardness 250 to 410 Hv containing about 40 percent of iron. The large size gate valves sliding tests have certified the test results. The anti-wear properties of the seat alloy and the anti-IGC susceptibility of the disc alloy could be improved by the addition of silicon and niobium, respectively.

• 한국표면공학회지
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• 제22권3호
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• pp.118-127
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• 1989

The rate of electrodeposition Zinc-nickel alloy on to electrolytic ione in sulface solution both under an inter and air atmospherss has studied by use of a rotating disc geometry. The kinetics shows 1st order reaction, and the rate constants are proportional to the square root of rpm, however, they are less than the valuse suggested by Levich. The rate constants of zinc deposition approach the total mass transfer rate constants with increasing potential and deviate with increasing rotaing speed, but those of nickel deposition are constant. Below $40^{\circ}C$ the activation engrgies of zinc deposition and nikel deposition were 4.4Kcal/mol and 6.3Kcal/mol respectively. There results show that overall reaction rate of zinc-nickel plaeting is controlled by mixed reaction and zinc deposotion is more affected by mass transfer reaction than nickel. The current density for the zinc-nickel plating was less in an air atmosphere than in a nitrogen atmosphere. The cathode efficiency increased with decreasing cathode rotating speeds, potentials, and increasing temperatures. Zzinc-nickel platings are more improved in microhardnss than zinc platings.

• 헤리티지:역사와 과학
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• 제52권3호
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• pp.38-55
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• 2019

백동(白銅)은 구리에 다른 금속을 섞어 녹여 만든 합금으로, 현재 구리와 니켈의 합금으로 정의되고 있다. 그러나 학자들의 연구 대상과 시기에 따라 백동은 구리에 일정 비율 이상의 주석을 더한 금속으로 정의되기도 하고, 구리에 주석과 아연과 납을 합금한 것으로 말하기도 한다. 이렇듯 백동은 그 정의에 차이가 있어 용어의 해석과 표기에 혼란이 있어 왔다. 본 연구는 문헌 기록을 토대로 시론적으로나마 백동의 구성 재료를 정리하고 그 흐름을 살피는 데 목적을 두었다. 이를 위해 먼저 백동 합금의 바탕 재료가 되는 구리의 이용과 구리 합금의 종류를 개괄적으로 살펴보고, 문헌의 백동 기록을 통해 그 사용과 인식을 정리해 보았다. 삼국시대 문헌에서부터 등장하기 시작하는 백동은 고려와 조선시대를 거쳐 근대기까지 꾸준히 보이는데 관직의 상징물부터 교역품, 생활기물, 화폐에 이르기까지 각 시대와 문화에 따라 다양하게 쓰였다. 문헌 기록을 살펴보면 백동의 합금 재료는 현재 합금의 재료로 정의되고 있는 구리와 니켈뿐이 아닌데, 시대에 따라 조금씩 차이가 있으나 구리를 합금의 바탕 금속으로 이용한다는 점은 동일하다. 구리 외의 합금 재료로는 주석, 비석 및 비상, 아연, 납 등이 등장하며, 그 과정에서 합금을 의미하는 백동과, 백색의 금속을 의미하는 백동이 혼용되었음을 알 수 있었다. 현재 정의되고 있는 백동의 합금 재료인 니켈은 비교적 발견 시기가 정확한 금속으로 현대 공업과 산업 분야의 소재로 폭넓게 쓰이고 있다. 니켈이 우리나라에 도입된 시기는 조선 말기에서 근대기로 추정되고 있으나 그 이용과 사용에 대해서는 구체적으로 알려진 바가 없다. 이에 본 연구에서는 근대기 신문기사와 통계자료를 바탕으로 니켈의 수용과 그 이용을 함께 살피고, 장인들의 증험을 토대로 니켈을 이용한 백동 합금이 공예품에 사용된 시기를 추정해 보았다. 재료는 기술의 발전과 퇴보에 직접적인 요인이 되며, 기술의 발달은 문명과 문화를 변화시키는 토대가 된다. 이러한 맥락에서 본 연구는 시론적으로나마 합금의 재료를 중심으로 백동을 살펴보고자 하였으며 니켈이라는 재료의 이용에 대해 고찰해 보았다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 추계학술대회 논문집
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• pp.343-344
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• 2008

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 춘계학술대회 논문집
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• pp.341-342
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• 2008

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2007년도 춘계학술대회
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• pp.250-253
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• 2007

An evaporated Ti/Pd/Ag contact system is most widely used to make high-efficiency silicon solar cells, however, the system is not cost effective due to expensive materials and vacuum techniques. Commercial solar cells with screen-printed contacts formed by using Ag paste suffer from a low fill factor and a high shading loss because of high contact resistance and low aspect ratio. Low-cost Ni and Cu metal contacts have been formed by using electroless plating and electroplating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Ni/Cu alloy is plated on a silicon substrate by electro-deposition of the alloy from an acetate electrolyte solution, and nickel-silicide formation at the interface between the silicon and the nickel enhances stability and reduces the contact resistance. It was, therefore, found that nickel-silicide was suitable for high-efficiency solar cell applications. The Ni contact was formed on the front grid pattern by electroless plating followed by anneal ing at $380{\sim}400^{\circ}C$ for $15{\sim}30$ min at $N_{2}$ gas to allow formation of a nickel-silicide in a tube furnace or a rapid thermal processing(RTP) chamber because nickel is transformed to NiSi at $380{\sim}400^{\circ}C$. The Ni plating solution is composed of a mixture of $NiCl_{2}$ as a main nickel source. Cu was electroplated on the Ni layer by using a light induced plating method. The Cu electroplating solution was made up of a commercially available acid sulfate bath and additives to reduce the stress of the copper layer. The Ni/Cu contact was found to be well suited for high-efficiency solar cells and was successfully formed by using electroless plating and electroplating, which are more cost effective than vacuum evaporation. In this paper, we investigated low-cost Ni/Cu contact formation by electroless and electroplating for crystalline silicon solar cells.

• Progress in Superconductivity
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• 제7권2호
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• pp.145-151
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• 2006

Nickel and nickel-tungsten alloy were electroplated on a cold rolled and heat treated copper(Cu) substrate. 4 mm-thick high purity commercial grade Cu was rolled to various thicknesses of 50, 70, 100 and 150 micron. High reduction ratio of 30% was applied down to 150 micron. Rolled texture was converted into cube texture via high temperature heat treatment at $400-800^{\circ}C$. Grain size of Cu was about 50 micron which is much smaller compared to >300 micron for the Cu prepared using smaller reduction pass of 5%. 1.5 km-long 150 micron Cu was fabricated with a rolling speed of 33 m/min and texture of Cu was uniform along length. Abnormal grain growth and non-cube texture appeared for the specimen anneal above $900^{\circ}C$. 1-10 micron thick Ni and Ni-W film was electroplated onto an annealed cube-textured Cu or directly on a cold rolled Cu. Both specimens were annealed and the degree of texture was measured. For electroplating of Ni on annealed Cu, Ni layer duplicated the cube-texture of Cu substrate and the FWHM of in plane XRD measurement for annealed Cu layer and electroplated layer was $9.9^{\circ}\;and\;13.4^{\irc}$, respectively. But the FWHM of in plane XRD measurement of the specimen which electroplated Ni directly on cold rolled Cu was $8.6^{\circ}$, which is better texture than that of nickel electroplated on annealed Cu and it might be caused by the suppression of secondary recrystallization and abnormal grain growth of Cu at high temperature above $900^{\circ}C$ by electroplated nickel.

• 한국주조공학회지
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• 제3권4호
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• pp.256-261
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• 1983

In this study, the variations of tensile strength and yield strength of Al-20% Si alloy were studied. Copper, magnesium and nickel as alloying elements added from 1% to 3% respectively. The temperature range was from room temperature to $350^{\circ}C$. The refinement of primary silicon crystal was treated with phosphorous addition. The results obtained are as follows: 1. Tensile strnegth and yield strength showed more increased strength in refining treated alloy than that of in nonrefining alloy at elevated temperature. 2. Tensile strength and yield strength were increased with the contents of copper. Tensile strength showed the maximum at $150^{\circ}C$, but yield strength was decreased with increasing temperature. 3. The effect of magnesium addition on tensile strength and yield strength showed the maximum at 1% addition and $150^{\circ}C$. 4. Tensile strength and yield strength showed a slight increase with the content changes of nickel and they were decreased with increasing temperature.

• Journal of Welding and Joining
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• 제17권5호
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• pp.89-96
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• 1999

The base metal and weld metal of alloy designed austenitic stainless steels were electrochemically tested in artificial sea water. Pitting resistance of 14 different stainless steels was evaluated by measuring pitting potential. The effect of alloy element to pitting potential was evaluated by changing chromium, nickel, sulfur content. The site of pitting initiation was observed by optical microscope. As a result of electrochemical test, pitting resistance of weld metal was higher than base metal, and rapidly cooled weld metal has higher pitting potential than slowly cooled weld metal. In case of primary δ-ferrite solidification, pitting potential was increased, but residual δ-ferrite was detrimental to pitting resistance. Chromium was more effective to pitting resistance than nickel, and sulfur was very detrimental element to pitting resistance.