• Journal of the Korean Ceramic Society
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• v.37 no.4
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• pp.381-387
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• 2000

Si3N4/stainless steel 316 joints with Ni buffer layer were fabricated by direct active brazing method (DIB) using Ag-Cu-Ti brazing alloy only and double brazing method (DOB) using Ag-Cu brazing alloy with Si3N4 pretreated with Ag-Cu-Ti brazing alloy. For the joint brazed by DIB method, Ti was segregated at the Si3N4/brazing alloy interface, but was not enough to form a stable joint interface. In addition, large amounts of Ni-Ti inter-metallic compounds were formed in tehbrazing alloy near the joint interface, which could deplete the contents of Ti involved in the interfacial reaction. However, for the joint brazed by DOB method, segregation of Ti at the joint interface were enough to enhance the formation of stable interfacial reaction products such as TiN and Ti-Si-Ni-N-(Cu) multicompounds, which restricted the formation of Ni-Tio inter-metallic compounds in the brazing alloy during brazing with Ni buffer layer. Fracture strength of Si3N4/S.S 316 joints with Ni buffer layer was much improved by using DOB method rather than DIB method. It could be deduced that the differences of fracture strength of the joint with Ni buffer layer depending on brazing process adapted were directly affected by the formation of stable joint interface and the change in microstructure of the brazing alloy near the joint interface. It was found that fracture strength of Si3N4/S.S 316 joints with Ni buffer layer was gradually reduced as the thickness of interface. It was found that fracture strength of Si3N4/S.S 316 joints with Ni buffer layer was gradually reduced as the thickness of Ni buffer layer in the joint was increased from 0.1 mm to 10 mm. It seems to due to the increased residual stress in the joint as the thickness of Ni buffer layer is increased. The maximum fracture strength of Si3N4/S.S 316 joints with Ni buffer layer was 386 MPa, and the fracture of joint was originated at Si3N4/brazing alloy joint interface and propagated into Si3N4 matrix.

• The Sea:JOURNAL OF THE KOREAN SOCIETY OF OCEANOGRAPHY
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• v.2 no.2
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• pp.117-124
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• 1997

Vertical profiles of dissolved Cu and Ni at the upper 400 m water layer have been determined at two stations in the central East Sea in October 1995. This is the first report on the vertical distribution of trace metals in Korea. Copper concentrations are in the range of 2.1~5.8 nmol/kg and 1.6~2.4 nmol/kg for stations S and N, respectively. The vertical profile of Cu at S is found a scavenging type (i.e., drastic decrease with increasing depth). Concentrations of Ni range from 4.3 to 7.1 nmol/kg and from 3.4 to 5.4 nmol/kg for stations Sand N, respectively. At station S, Ni is best correlated with phosphate, but not at stations N. Such difference between two stations are probably due to their different vertical distribution of water masses. Station S has a strongly stratified water column with 6 distinct water masses, but station N with a well-mixed subsurface water layer extending from 50 to 300 m depth. Extremely low salinity (31.87~31.96 psu) found at the surface water of station S was interpreted as a result of the Yangtze River effluents which were probably fed into the East Sea through the Korea Strait during the late summer. Such seasonal appearance of low salinity in southern part of the East Sea was reported previously. The concentrations of Cu and Ni at two sites are comparable to those reported in the North Pacific. It was found that Ni mostly exist as dissolved phase.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.2
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• pp.1-9
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• 2002

The intermetallic formation between Sn-Ag-(Cu) solders and metal pads in a real BGA package was characterized using SEM, EDS, and XRD. The intermetallic phase formed in the interface between Sn-Ag-Cu and Au/Ni/Cu pad is likely to be ternary compound of $(Cu,Ni)_6Sn_5$ from EDS analysis High concentration of Cu was observed in the solder/Ni interface. XRD analysis confirmed that $\eta -Cu_6 Sn_5$ type was intermetallic phase formed in the interface between Cu containing solders and Ni substrates and $Ni_3$Sn_4$ intermetallic was formed in the Sn-Ag solder/Ni interface. The thickness of intermetallic phase increased with the reflow times and Cu concentration in solder.

• Archives of Metallurgy and Materials
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• v.65 no.4
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• pp.1303-1306
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• 2020

TiNi alloys have excellent shape memory properties and corrosion resistance as well as high biocompatibility. This study investigated the effects of copper addition on the phase transitions and electrochemical corrosion behaviors of Ti₅₀Ni_50-xCu_x alloys. TiNi, Ti₅₀Ni₄₇Cu₃, Ti₅₀Ni₄₄Cu₆, and Ti₅₀Ni₄₁Cu₉ alloys were prepared using vacuum arc remelting followed by 4 h homogenization at 950℃. Differential scanning calorimetry and X-ray diffraction analyses were conducted. The corrosion behaviors of the alloys were evaluated using potentiodynamic polarization test in Hank's balanced salt solution at a temperature of 36.5 ± 1℃. The TiNi alloy showed phase transitions from the cubic B2 phase to the monoclinic B19' phase when the alloy was thermally cycled. The addition of copper to the TiNi alloy played a major role in stabilizing the orthorhombic B19 phases during the phase transitions of Ti₅₀Ni_50-xCu_x alloys. The shifts in the corrosion potential toward the positive zone and the low corrosion current density were affected by the amount of Cu added. The corrosion resistance of the TiNi alloy increased with increasing copper content.

• Membrane and Water Treatment
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• v.10 no.3
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• pp.201-206
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• 2019

In this study, we performed an electrowinning process for effective removal of metals (Cu and Ni) in solution and their recovery as solid forms. A complete removal of Cu and Ni (1,000 mg/L) was observed during four times recycling test, indicating that our electrowinning system can ensure the efficient metal removal with high stability and durability. In addition, we investigated effect of operation parameters (i.e., concentration of boric acid only for Ni, variation of pH, concentration of electrolyte ($H_2SO_4$), and cell voltage) on the efficiency of metal removal (Cu and Ni) during the electrowinning. The addition of boric acid significantly enhanced removal efficiency of Ni as the concentration of boric acid increased up to 10 g/L. Compared to negligible pH effect (pH 1, 2, and 4) on the Cu removal, we observed the increase in removal efficiency of Ni as the pH increased from 1 to 4. The electrolyte concentration did not significantly influence the removal of Cu and Ni in this study. We also obtained great removal rates of Cu and Ni at 2.5 V and 4.0 V, which were much faster than those at lower voltages. Finally, almost 99% of each Cu and Ni (1,000 mg/L) was selectively removed from the mixture of metals by adjusting pH and addition of boric acid after the completion of Cu removal. The findings in this study can provide a fundamental knowledge about effect of important parameters on the efficiency of metal recovery during the electrowinning.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2001.11a
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• pp.10-10
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• 2001

In this paper, initial depositing process of electroless Ni-Cu-P alloy was investigated by means of SEM, TEM and AES. The results show that the initial deposition is inhomogeneous and there exist different transition layers between different coatings and substrates, which are decided by the structures and compositions of the bath. For Ni-P binary alloy, its deposition takes place superiorly at grain boundary and on some grains with beneficial texture, the thickness of transition layer composed of Ni-Fe-P reaches 2000 angstrom. But during initiation of Ni-Cu-P trinary alloy, only at grain boundary is prIor to be deposited electrolessly, transited layer contains Ni-Fe-Cu-P and is decreased to about 500 angstrom. The structures of the films of Ni-P and Ni-Cu-P are crystalline at the initial depositing stage. The mechanisms of the process are put forward in this paper.

• Journal of the Korean Ceramic Society
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• v.39 no.12
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• pp.1119-1123
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• 2002

Nanostructured spinel NiZn ferrites were prepared by the sol-gel method from metal nitrate raw materials. Analyses by X-ray diffraction and scanning electron microscopy showed the average particle size of NiZn ferrite was under 50 nm. The single phase of NiZn ferrites was obtained by firing at 250${\circ}C$, resulting in nanoparticles exhibiting normal ferrimagnetic behavior. The nanostructured $Ni_{1-X}Zn_XFe_2O_4$ (x=0.0∼1.0) were found to have the cubic spinel structure of which the lattice constants ${\alpha}_2$ increases linearly from 8.339 to 8.427 ${\AA}$ with increasing Zn content x, following Vegard's law, approximately. The saturation magnetization $M_s$ was 48 emu/g for x=0.4 and decreased to 8.0 emu/g for higher Zn contents suggesting the typical ferrimagnetism in mixed spinel ferrites. Pure NiZn ferrite phase substituted by Cu was observed before using the additive but hematite phase was partially appeared at $Ni_{0.2}Zn_{0.2}Cu_{0.6}Fe_2O_4$. On the other hand, the hematite phase in this NiZn Cu ferrite was disappeared after using the additive of acethyl aceton with small amount. The saturation magnetization Ms of $Ni_{0.2}Zn_{0.8-y}Cu_yFe_2O_4$(y=0.2∼0.6) as measured was about 51 emu/g at 77K and 19 emu/g at room temperature, respectively.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.32 no.2
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• pp.134-140
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• 2019

Oxide ($SnO_2$)/metal alloy (Cu(Ni))/oxide ($SnO_2$) multilayer films were fabricated using the magnetron sputtering technique. The oxide and metal alloy were $SnO_2$ and Ni-doped Cu, respectively. The structural, optical, and electrical properties of the multilayer films were investigated using X-ray diffraction (XRD), ultraviolet-visible (UV-vis) spectrophotometry, and 4-point probe measurements, respectively. The properties of the $SnO_2/Cu(Ni)/SnO_2$ multilayer films were dependent on the thickness and Ni doping of the mid-layer film. Since Ni atoms inhibit the diffusion and aggregation of Cu atoms, the grain growth of Cu is delayed upon Ni addition. For $250^{\circ}C$, the Haccke's figure of merit (FOM) of the $SnO_2$ (30 nm)/Cu(Ni) (8 nm)/$SnO_2$ (30 nm) multilayer film was evaluated to be $0.17{\times}10^{-3}{\Omega}^{-1}$.

• Journal of Korea Foundry Society
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• v.31 no.1
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• pp.26-30
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• 2011

For the fabrication of bulk near-net-shape Ti-Ni-Cu shape memory alloys, consolidation of Ti-Ni-Cu alloy powders are useful because of their brittle property. In the present study, $Ti_{50}Ni_{30}Cu_{20}$ shape memory alloy powders were prepared by gas atomization and martensitic transformation temperatures and microstructures of those powders were investigated as a function of powder size. The size distribution of the powders was measured by conventional sieving, and sieved powders with the specific size range of 25 to $150\;{\mu}m$ were chosen for this examination. XRD analysis showed that the B2-B19 martensitic transformation occurred in the powders. In DSC curves of the as-atomized $Ti_{50}Ni_{30}Cu_{20}$ powders as a function of powder size, only one clear peak was found on each cooling and heating curve. The martensitic transformation start temperature($M_s$) of the $25-50\;{\mu}m$ powders was $31.5^{\circ}C$. The $M_s$ increased with increasing powder size and the difference of $M_s$ between $25-50\;{\mu}m$ powders and $100-150\;{\mu}m$ powders is only $1^{\circ}C$. The typical microstructure of the rapidly solidified powders showed cellular morphology and very small pores were observed in intercellular regions.

• Journal of the Korean Society for Heat Treatment
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• v.5 no.3
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• pp.149-156
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• 1992

Transformation behavior and reversible shape memory effct of Ti-Ni-Cu alloys with various Cu content has been investigated by means of electrical resistivity measurement, differential scanning calorimetry. X-ray diffraction and strain gage sensor. The transformation sequence in Ti-Ni-Cu alloys substituted by Cu for Ni up to 5at.% occurs to $B2{\leftrightarrow}B19^{\prime}$ and it proceeds in two stages by addition of 10 at.%Cu. i.e. $B2{\leftrightarrow}B19{\leftrightarrow}B19^{\prime}$. But the content of Cu increases up to 20at.%, it has been transformed in one stage ; $B2{\leftrightarrow}B19$. The shape change of Ti-40Ni-10Cu alloy which was constrain aged in circular form bended in $B2{\leftrightarrow}B19$ transformation but it spreaded out in $B19{\leftrightarrow}B19^{\prime}$ transformation. The amount of reversible shape change (${\Delta}{\varepsilon}$) of Ti-47Ni-3Cu alloy constrain aged at $400^{\circ}C$ after solution treatment has a maximum value of about $5.6{\times}10^{-3}$, but that of cold rolled and constrain aged specimens exhibits a little value independent of Cu concentrations.