• Korean Journal of Materials Research
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• v.28 no.2
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• pp.113-117
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• 2018

Effects of annealing temperature on the microstructure and mechanical properties through thickness of a cold-rolled Cu-3.0Ni-0.7Si alloy were investigated in detail. The copper alloy with thickness of 3 mm was rolled to 50 % reduction at ambient temperature without lubricant and subsequently annealed for 0.5h at $200{\sim}900^{\circ}C$. The microstructure of the copper alloy after annealing was different in thickness direction depending on an amount of the shear and compressive strain introduced by rolling; the recrystallization occurred first in surface regions shear-deformed largely. The hardness distribution of the specimens annealed at $500{\sim}700^{\circ}C$ was not uniform in thickness direction due to partial recrystallization. This ununiformity of hardness corresponded well with an amount of shear strain in thickness direction. The average hardness and ultimate tensile strength showed the maximum values of 250Hv and 450MPa in specimen annealed at $400^{\circ}C$, respectively. It is considered that the complex mode of strain introduced by rolling effected directly on the microstructure and the mechanical properties of the annealed specimens.

• Journal of Korea Foundry Society
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• v.28 no.1
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• pp.31-36
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• 2008

Ti-Ni-Cu alloys are very attractive shape memory alloys for applications as actuators because of a large transformation elongation and a small transformation hysteresis. Rapidly solidified Ti-Ni alloy ribbons have been known to have the shape memory effect and superelasticity superior to the alloy ingots fabricated by conventional casting. In this study, solidification structures and shape memory characteristics of $Ti-Ni_{30}-Cu_{20}$ alloy ribbons prepared by melt spinning were investigated by means of DSC and XRD. Operating parameters to fabricate the amorphous ribbons were the wheel velocity of 55 m/s and the melt spinning temperature of $1500^{\circ}C$. The crystallization temperature was measured to be $440^{\circ}C$. The crystallized ribbons exhibited very fine microstructure after annealing at $440^{\circ}C$ for 10 minutes and $460^{\circ}C$ for 5 minutes and was deformed up to about 6.8% and 6.23% in ductile manner, respectively. Stress-strain curve of the ribbon exhibited a flat stress-plateau at 64 MPa and this is associated with the stress-induced a B2-B19 martensitic transformation. During cycle deformation with the applied stress of 220 MPa, transformation hysteresis and elongation associated with the B2-B19 transformation were observed to be $4.3^{\circ}C$ and 3.6%.

• Korean Journal of Materials Research
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• v.15 no.11
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• pp.697-704
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• 2005

The deformation behavior of a bulk amorphous and crystallized amorphous $Zr_{22.5}Ti_{14}Cu_{12.5}Ni_{10}Be_{22.5}$ alloy extracted from a commercial golf club head was characterized at room temperature ana $300^{\circ}C$. At room temperature, amorphous specimens revealed higher yield stress and ductility than partially crystallized alloy specimens. Amorphous alloy displayed some plasticity before fracture, which resulted from strain hardening and repeated crack initiation and propagation. The fracture is mainly localized on one major shear band, and the compressive fracture angle of the amorphous specimen between the stress axis and the fracture plane was about $40^{\circ}$ Scanning electron microscope observations revealed mainly a vein-like structure in the amorphous alloy But the fracture surface of partially crystallized amorphous alloy consisted of vein-like and featureless fracture structure. The partially crystallized alloy extracted from the thick part of the club fractured in the elastic region, at a much lower stress level than the amorphous, suggesting that relatively coarse crystal particles formed during cooling cause the brittle fracture.

• Progress in Superconductivity
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• v.1 no.2
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• pp.120-124
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• 2000

Ni-13%Cr and Ni-70%Cu alloy tapes were prepared by using high purity metal powders as starting materials. The Ni-13%Cr and the Ni-70%Cu mixtures were isostatically pressed, sintered, rolled and texture-annealed. SEM EDS analysis showed that copper and nickel atoms were completely mixed, while the alloying between the chromium powders and the nickel powders was incomplete. In spite of incomplete alloying between nickel and chromium powders, sharp cube-texture was developed for the Ni-13%Cr tape as well as the Ni-70%Cu tape.

• 한국신재생에너지학회:학술대회논문집
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• 2007.06a
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• pp.250-253
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• 2007

An evaporated Ti/Pd/Ag contact system is most widely used to make high-efficiency silicon solar cells, however, the system is not cost effective due to expensive materials and vacuum techniques. Commercial solar cells with screen-printed contacts formed by using Ag paste suffer from a low fill factor and a high shading loss because of high contact resistance and low aspect ratio. Low-cost Ni and Cu metal contacts have been formed by using electroless plating and electroplating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Ni/Cu alloy is plated on a silicon substrate by electro-deposition of the alloy from an acetate electrolyte solution, and nickel-silicide formation at the interface between the silicon and the nickel enhances stability and reduces the contact resistance. It was, therefore, found that nickel-silicide was suitable for high-efficiency solar cell applications. The Ni contact was formed on the front grid pattern by electroless plating followed by anneal ing at $380{\sim}400^{\circ}C$ for $15{\sim}30$ min at $N_{2}$ gas to allow formation of a nickel-silicide in a tube furnace or a rapid thermal processing(RTP) chamber because nickel is transformed to NiSi at $380{\sim}400^{\circ}C$. The Ni plating solution is composed of a mixture of $NiCl_{2}$ as a main nickel source. Cu was electroplated on the Ni layer by using a light induced plating method. The Cu electroplating solution was made up of a commercially available acid sulfate bath and additives to reduce the stress of the copper layer. The Ni/Cu contact was found to be well suited for high-efficiency solar cells and was successfully formed by using electroless plating and electroplating, which are more cost effective than vacuum evaporation. In this paper, we investigated low-cost Ni/Cu contact formation by electroless and electroplating for crystalline silicon solar cells.

• 연구논문집
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• s.22
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• pp.127-139
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• 1992

The mechnial properties such as fracture strength, ductility and fatigue strength of Cu shape memory alloy are lower than those of Ti-Ni SMA, because of their high elastic anisotropy and large grain size. And in order to improve the mechanical property of Cu SMA, some techniques such as casting method by addition of refining element, powder metallurgy and rapid solidification process have been studied on the refinement of the grain size of Cu SMA. This study was carried out to refine the grain size of CuAlNi SMA by applying the melt spinning method. According to this study, the conclusions are as follows; - grain size of the melt-spun ribbon was about $1\mum$ - there was not change in grain size, although increasing of hot pressing temperature -grain size of the hot-extruded specimen was about $30-40\mum$, it is more refiner than that of castings

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.05a
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• pp.389-393
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• 2007

The most demanded bimetals in home appliances are manufactured by mainly cladding process and these are mainly consist of Cu alloy and Ni alloy. But it is very difficult to clad these alloys, because the brittle ${Cu_3}{O_4}$ oxide film formed easily on Cu alloy surface during cladding process. Clad rolling and heat treatment processes were applied for the development of bimetals by using the Ni alloy and the 3 types of Cu alloys. Optical microstructure was observed and micro-hardness, specific resistance, deflection were measured from the manufactured new bimetals specimens.

• Transactions of Materials Processing
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• v.7 no.5
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• pp.481-488
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• 1998

The active metal brazing was applied to bond Alumina and Ni-Cr steel by Ag-Cu-Zr-Sn alloy and the interfacial microstructure and reaction mechanism were investigated. Polycrystalline monoclinic $ZrO_2$ with a very fine grain of 100-150 nm formed at the alumina grain boundary contacted with Zr segregation layer at the interface. The $ZrO_2$ layer containing the inclusions and cracks were developed at the boundary of inclusion/$ZrO_2$ due to the difference in specific volume. The development of $ZrO_2$ at the interface was successfully explained by the preferential penetration of $ZrO_2$ at the interface was successfully explained by the preferential penetration of Zr atoms a higher concentration of oxygen and a high diffusion rate of Al ions into molten brazing alloy.

• Journal of Powder Materials
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• v.17 no.6
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• pp.477-481
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• 2010

Cu-Sn based alloys were manufactured by gas atomization spray casting route in order to achieve a fine scale microstructure and a high tensile strength. The spray cast Cu-10Sn-2Ni-0.2Si alloy had an equiaxed grain microstructure, with no formation of brittle ${\delta}-Cu_{41}Sn_{11}$ phase. Aging treatment promoted the precipitation of finely distributed particles corresponding to ${\delta}-Ni_2Si$ intermetallic phase throughout the $\alpha$-(CuSn) matrix. The cold-rolled Cu-Sn-Ni-Si alloy had a very high tensile strength of 1200 MPa and an elongation of 5%. Subsequent aging treatment at $450^{\circ}C$ for 1h slightly reduced the tensile strength to 700 MPa and remarkably increased the elongation up to 30%. This result has been explained by coarsening the precipitates due to over aging and reducing the dislocation density due to annealing effects.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2000.11a
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• pp.46-46
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• 2000