• 제목/요약/키워드: Nanoimprint Lithography

검색결과 169건 처리시간 0.036초

극대면적 UV-NIL 공정에서의 균일 가압 시스템 개발 (The Development of Uniform Pressurizing System for Extremely Large Area UV-NIL)

  • 최원호;신윤혁;여민구;임홍재;신동훈;장시열;정재일;이기성;임시형
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2008년도 추계학술대회A
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    • pp.1917-1921
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    • 2008
  • Ultraviolet-nanoimprint lithography (UV-NIL) is promising technology for cost effectively defining micro/nano scale structure at room temperature and low pressure. In addition, this technology is fascinating because of it's possibility for high-throughput patterning without complex processes. However, to acquire good micro/nano patterns using this technology, there are some challenges such as uniformity and fidelity of patterns, etc. In this paper, we have focused on uniform contact mechanism and performed contact mechanics analysis. The dimension of the flexible sheet to get adequate uniform contact area has been obtained from contact mechanics simulation. Based on this analysis, we have made a uniform pressurizing device and confirmed its uniform pressurized zone using a pressure sensing paper.

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유한요소 해석을 이용한 나노임프린트 가압 공정에서 발생하는 결함 원인에 대한 연구 (A Study on Cause of Defects in NIL Molding Process using FEM)

  • 송남호;손지원;김동언;오수익
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2007년도 추계학술대회 논문집
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    • pp.364-367
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    • 2007
  • In nano-imprint lithography (NIL) process, which has shown to be a good method to fabricate polymeric patterns, several kinds of pattern defects due to thermal effects during polymer flow and mold release operation have been reported. A typical defect in NIL process with high aspect ratio and low resist thickness pattern is a resist fracture during the mold release operation. It seems due to interfacial adhesion between polymer and mold. However, in the present investigation, FEM simulation of NIL molding process was carried out to predict the defects of the polymer pattern and to optimize the process by FEA. The embossing operation in NIL process was investigated in detail by FEM. From the analytical results, it was found that the lateral flow of polymer resin and the applied pressure in the embossing operation induce the weld line and the drastic lateral strain at the edge of pattern. It was also shown that the low polymer-thickness result in the delamination of polymer from the substrate. It seems that the above phenomena cause the defects of the final polymer pattern. To reduce the defect, it is important to check the initial resin thickness.

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Fabrication of an All-Layer-Printed TFT-LCD Device via Large-Area UV Imprinting Lithography

  • Lee, Seung-Jun;Park, Dae-Jin;Bae, Joo-Han;Lee, Sung-Hee;Kim, Jang-Kyum;Kim, Kyu-Young;Bae, Jung-Mok;Kim, Bo-Sung;Kim, Soon-Kwon;Lee, Su-Kwon;Kwon, Sin;Seo, Jung-Woo;Kim, Ki-Hyun;Cho, Jung-Wok;Chang, Jae-Hyuk
    • Journal of Information Display
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    • 제11권2호
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    • pp.49-51
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    • 2010
  • Nanoimprint lithography (NIL) using ultraviolet (UV) rays is a technique in which unconventional lithographic patterns are formed on a substrate by curing a suitable liquid resist in contact with a transparent patterned mold, then releasing the freshly patterned material. Here, various solutions are introduced to achieve sufficient overlay accuracy and to overcome the technical challenges in resist patterning via UV imprinting. Moreover, resist patterning of all the layers in TFT and of the BM layer in CF was carried out using UV imprinting lithography to come up with a 12.1-inch TFT-LCD panel with a resolution of $1280{\times}800$ lines (125 ppi).

Enhancement of outcoupling efficiency of OLEDs by using nanoimprinted polymer nanostructures

  • Jeon, So-Hee;Kang, Jae-Wook;Park, Hyung-Dol;Shim, Jong-Youp;Jeong, Jun-Ho;Kim, Se-Heon;Youn, Jae-R.;Kim, Jang-Joo
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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    • pp.521-522
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    • 2008
  • An etch-less simple method was developed to fabricate two-dimensional nanostructures on glass substrate directly by using UV curable polymer resin and UV nanoimprint lithography in order to improve output coupling efficiency of OLEDs. OLEDs integrated on nanoimprinted substrates enhanced electro-luminance intensity by up to 50% compared with the conventional device.

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접촉 역학적 접근에 의한 점탄성/탄성, 점탄성/점탄성 재료간의 접합 에너지 측정 (A Measurement of Adhesion Energy between Viscoelastic/Elastic, Viscoelastic/Viscoelastic Materials Using Contact Mechanics Approach)

  • 이찬;엄윤용
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2003년도 춘계학술대회
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    • pp.1030-1035
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    • 2003
  • The nanoimprint lithography technology makes higher density of semiconductor device and larger capacity of storage media. In this technology the induced damage while detaching polymer pattern from mold should be minimized. In order to analyze the problem, the basic knowledge of adhesion between the polymer and the mold is required. In this study a contact experiment of polyisobutylene specimen with spherical steel tip and polyisobutylene bead tip was conducted using nano indenter. During the contact experiment with various loading rate under load control the contact behavior of viscoelastic material was measured, i.e., the load and displacement between the tip and the specimen were measured. The data was analyzed by HBK model to obtain the stress intensity factor of contact edge and the contact radius as a function of time. Also the adhesion energies between steel/polyisobutylene and polyisobutylene/polyisobutylene were obtained employing the analysis of the crack of viscoelastic material by Schapery.

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나노 임프린트 공정을 이용한 결정형 실리콘 태양전지 효율 향상 기술 (Technology for Efficiency Enhancement of Crystalline Si Solar Cell using Nano Imprint Process)

  • 조영태;정윤교
    • 한국기계가공학회지
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    • 제12권5호
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    • pp.30-35
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    • 2013
  • In order to increase cell efficiency in crystalline silicon solar cell, reduction of light reflection is one of the essential problem. Until now silicon wafer was textured by wet etching process which has random patterns along crystal orientation. In this study, high aspect ratio patterns are manufactured by nano imprint process and reflectance could be minimized under 1%. After that, screen printed solar cell was fabricated on the textured wafer and I-V characteristics was measured by solar simulator. Consequently cell efficiency of solar cell fabricated using the wafer textured by nano imprint process increased 1.15% than reference solar cell textured by wet etching. Internal quantum efficiency was increased in the range of IR wave length but decreased in the UV wavelength. In spite of improved result, optimization between nano imprinted pattern and solar cell process should be followed.

레진의 경화 반응을 고려한 UV-NIL공정의 열특성에 관한 실험 및 수치해석 연구 (Experiment and Numerical Study on Thermal Characteristics of UV-NIL Process Considering the Cure Kinetics of Photo-polymer)

  • 김우송;박경서;남진현;임흥재;장시열;이기성;정재일;임시형;신동훈
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2008년도 추계학술대회A
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    • pp.1847-1850
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    • 2008
  • The process conditions during ultraviolet nanoimprint lithography (UV-NIL) process such as temperature, stamping pressure, UV irradiation, etc. are effective factors for successful imprinting of complex and fine patterns. In this study, the effects of aluminum mold on the thermal characteristics of UV-NIL process were investigated through imprinting experiments and numerical simulations. The temperature of polymer resin on mold was measured to study thermal characteristics during UV curing. From the experimental and numerical results, the importance of curing reaction control for UV-NIL process was discussed for deformation characteristics.

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SimMechanics를 이용한 4축 과구동 스테이지의 모델링 (Modeling of a 4-axis redundant stage by using SimMechanics)

  • 이진영;박원준;원종진;정재일
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2008년도 추계학술대회A
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    • pp.827-831
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    • 2008
  • In this paper, kinematic analysis for a planar 3-DOF redundant stage which has four actuators is presented by using SimMechanics software package. SimMechanics is a block sets of the Matlab/Simulink package. The SimMechanics enables a simplified model for a complex kinematic mechanism, since kinematic relationship between joints and linkages for the kinematic chains are expressed as line vectors and block diagrams. Here, positional error and limit values of movement ranges of the stage are evaluated by using the SimMechanics. The validity of the kinematic characteristics model was compared with theoretical kinematic analyses for the 3-DOF stage.

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