• Korean Journal of Materials Research
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• v.30 no.2
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• pp.93-98
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• 2020

Effective control of the heat generated from electronics and semiconductor devices requires a high thermal conductivity and a low thermal expansion coefficient appropriate for devices or modules. A method of reducing the thermal expansion coefficient of Cu has been suggested wherein a ceramic filler having a low thermal expansion coefficient is applied to Cu, which has high thermal conductivity. In this study, using pressureless sintering rather than costly pressure sintering, a polymer solution synthesis method was used to make nano-sized Cu powder for application to Cu matrix with an AlN filler. Due to the low sinterability, the sintered Cu prepared from commercial Cu powder included large pores inside the sintered bodies. A sintered Cu body with Zn, as a liquid phase sintering agent, was prepared by the polymer solution synthesis method for exclusion of pores, which affect thermal conductivity and thermal expansion. The pressureless sintered Cu bodies including Zn showed higher thermal conductivity (180 W/m·K) and lower thermal expansion coefficient (15.8×10^-6/℃) than did the monolithic synthesized Cu sintered body.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.464-465
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• 2006

Monodispersed and nano-sized Cu powders were synthesized from copper sulfate pentahydrate $(CuSO_4{\cdot}5H_2O)$ inside a nonionic polymer matrix by using wet chemical reduction process. The sucrose was used as a nonionic polymer network source. The influences of a nonionic polymer matrix on the particle size of the prepared Cu powders were characterized by means of X-ray diffraction), scanning electron microscopy), and particle size analysis). The smallen Cu powders with size of approximately 100 nm was obtained with adding of 0.04M sucrose at reaction temperature of $60\;^{\circ}C$. The particle size of the Cu powders prepared by the reduction inside polymer network was strongly dependent of the sucrose content and reaction temperature.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.722-723
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• 2006

A new method has been developed to fabricate microcomponents by a combination of photolithography and sintering of metallic powder mixtures, without the need for compression and the addition of Mg. This involves (1) the fabrication of a micromould, (2) mould filling of the powder/binder mixture, (3) debinding and (3) sintering. The starting powdered materials consisted of a mixture of aluminium powder(average size of 2.5 um) and alloying elemental powder of Cu and Sn(less than 70nm), at appropriate proportions to achieve nominal compositions of Al-6wt%Cu, Al-6wt%Cu-3wt%Sn. This paper presents detailed investigation of debinding behaviour and microstructural development.

• Journal of Powder Materials
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• v.14 no.5
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• pp.320-326
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• 2007

Ag-Cu alloy nano powders were fabricated by the electrical explosion of Cu-plated Ag wires. Ag wires of 0.2mm diameter was electroplated to final diameter of 0.220 mm and 0.307 mm which correspond to Ag-27Cu and Ag-68Cu alloy. The explosion product consisted of equilibrium phases of ${\alpha}-Ag$ and ${\beta}$-Cu. The particle size of Ag-Cu nano powders were 44 nm and 70 nm for 0.220 mm and 0.307 mm wires, respectively. The Ag-Cu nano powders contained less Cu than average value due to higher sublimation energy compared to that of Ag. As a result, micron-sized spherical particles formed from liquid droplets contained higher Cu content.

• Proceedings of the Materials Research Society of Korea Conference
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• 2001.05a
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• pp.147-147
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• 2001

• Journal of Powder Materials
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• v.19 no.5
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• pp.367-372
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• 2012

Single crystalline Cu nanowires with controlled diameters and aspect ratios have been synthesized using electrochemical deposition within confined nanochannels of a porous anodic aluminium oxide(AAO) template. The diameters of nano-sized cylindrical pores in AAO template were adjusted by controlling the anodization conditions. Cu nanowires with diameters of approximately 38, 99, 274 nm were synthesized by the electrodeposition using the AAO templates. The crystal structure, morphology and microstructure of the Cu nanowires were systematically investigated using XRD, FE-SEM, TEM and SAED. Investigation results revealed that the Cu nanowires had the controlled diameter, high aspect ratio and single crystalline nature.

• 한국초전도학회:학술대회논문집
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• 2008.08a
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• pp.86-86
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• 2008

• Journal of Powder Materials
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• v.13 no.1 s.54
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• pp.33-38
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• 2006

The effect of Cu content on microstructure and mechanical properties of nano-sized Cu dispersed $Al_2O_3(Al_2O_3/Cu)$ nanocomposites was investigated. The nanocomposites with Cu content of 2.5 to 10 vol% were prepared by reduction and hot-pressing of $Al_2O_3/CuO$ powder mixtures. The nanocomposites with Cu content of 2.5 and 5vol% exhibited the maximum fracture strength of 820MPa and enhanced toughness compared with monolithic $Al_2O_3$. The strengthening was mainly attributed to the refinement of $Al_2O_3$ matrix grains. The toughening mechanism was discussed by the observed microstructural feature based on crack bridging.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 1997.04a
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• pp.8-8
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• 1997

• Korean Journal of Materials Research
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• v.14 no.10
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• pp.696-700
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• 2004

The reduction behavior of $Al_{2}O_3/CuO$ powder mixtures, prepared from $Al_{2}O_3/CuO$ or $Al_{2}O_3/Cu-nitrate$, was investigated by using thermogravimetry and hygrometry. The powder characteristics were examined by BET, XRD and TEM. Also, the influence of powder characteristics on the microstructure and properties of hot-pressed composites was analyzed. The formation mechanism of nano-sized Cu dispersions was explained based on the powder characteristics and reduction kinetics of oxide powders. In addition, the dependence of the microstructure and mechanical properties of hot-pressed composites on powder characteristics is discussed in terms of the initial size and distribution of Cu particles. The practical implication of these results is that an optimum processing condition for the design of homogeneous microstructure and required properties can be established.