• Title/Summary/Keyword: Nano Device

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Drug Delivery System Using Electrospun Nanofiber Mats (전기방사된 나노파이버 매트를 이용한 약물전달시스템에 관한 연구)

  • Yoon, Hyeon;Park, Yoon-Kyung;Kim, Geun-Hyung
    • Polymer(Korea)
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    • v.33 no.3
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    • pp.219-223
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    • 2009
  • The nanofibers fabricated by using an electrohydrodynamic process has been used as various applications, such as nano-device, filtering system, protective clothes, wound dressing, and drug delivery system (DDS). Of these applications, the DDS should be needed to minimize side effects of drugs, maximize the properties of medicine, and efficiently deliver the required amount of drugs to the diseased area. In this paper, by using the electro spinning process, which is one of electrohydrodynamic processes, two different types, polycarprolactone and poly(ethylene oxide)/Rhodamine B, of electrospun mats were fabricated layer by layer and the release behavior of Rhodamine B was characterized with time. In addition, to show the feasibility of DDS of this type, we tested release behavior of a peptide of the nanofiber system, a PCL/(Peptide+PEO)/PCL nanofiber mat. The released peptide did not loss biological activities. From these results, we believe that the layered nanofiber mat as a DDS has enough function of a new drug delivery system.

High Density MRAM Device Technology Based on Magnetic Tunnel Junctions (자기터널접합을 활용한 고집적 MRAM 소자 기술)

  • Chun, Byong-Sun;Kim, Young-Keun
    • Journal of the Korean Magnetics Society
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    • v.16 no.3
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    • pp.186-191
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    • 2006
  • Ferromagnetic amorphous $Ni_{16}Fe_{62}Si_8B_{14}$ and $Co_{70.5}Fe_{4.5}Si_{15}B_{10}$ layers have been devised and incorporated as free layers of magnetic tunnel junctions (MTJs) to improve MRAM reading and writing performance. The NiFeSiB and CoFeSiB single-layer film exhibited a lower saturation magnetization ($Ms=800emu/cm^3,\;and\;560emu/cm^3$, respectively) compared to that of a $Co_{90}Fe_{10}(Ms=1400emu/cm^3)$. Because amorphous ferromagnetic materials have lower Ms than crystalline ones, the MTJs incorporating amorphous ferromagnetic materials offer lower switching field ($H_{sw}$) values than that of the traditional CoFe-based MTJ. The double-barrier MTJ with an amorphous NiFeSiB free layer offered smooth surface resulting in low bias voltage dependence, and high $V_h\;and\;V_{bd}$ compared with the values of the traditional CoFe-based MTJ.

High $f_T$ 30nm Triple-Gate $In_{0.7}GaAs$ HEMTs with Damage-Free $SiO_2/SiN_x$ Sidewall Process and BCB Planarization

  • Kim, Dae-Hyun;Yeon, Seong-Jin;Song, Saegn-Sub;Lee, Jae-Hak;Seo, Kwang-Seok
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.4 no.2
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    • pp.117-123
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    • 2004
  • A 30 nm $In_{0.7}GaAs$ High Electron Mobility Transistor (HEMT) with triple-gate has been successfully fabricated using the $SiO_2/SiN_x$ sidewall process and BCB planarization. The sidewall gate process was used to obtain finer lines, and the width of the initial line could be lessened to half by this process. To fill the Schottky metal effectively to a narrow gate line after applying the developed sidewall process, the sputtered tungsten (W) metal was utilized instead of conventional e-beam evaporated metal. To reduce the parasitic capacitance through dielectric layers and the gate metal resistance ($R_g$), the etchedback BCB with a low dielectric constant was used as the supporting layer of a wide gate head, which also offered extremely low Rg of 1.7 Ohm for a total gate width ($W_g$) of 2x100m. The fabricated 30nm $In_{0.7}GaAs$ HEMTs showed $V_{th}$of -0.4V, $G_{m,max}$ of 1.7S/mm, and $f_T$ of 421GHz. These results indicate that InGaAs nano-HEMT with excellent device performance could be successfully fabricated through a reproducible and damage-free sidewall process without the aid of state-of-the-art lithography equipment. We also believe that the developed process will be directly applicable to the fabrication of deep sub-50nm InGaAs HEMTs if the initial line length can be reduced to below 50nm order.

Etch characteristics of TiN thin film adding $Cl_2$ in $BCl_3$/Ar Plasma ($BCl_3$/Ar 플라즈마에서 $Cl_2$ 첨가에 따른 TiN 박막의 식각 특성)

  • Um, Doo-Seung;Kang, Chan-Min;Yang, Xue;Kim, Dong-Pyo;Kim, Chang-Il
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.168-168
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    • 2008
  • Dimension of a transistor has rapidly shrunk to increase the speed of device and to reduce the power consumption. However, it is accompanied with several problems like direct tunneling through the gate dioxide layer and low conductivity characteristic of poly-Si gate in nano-region. To cover these faults, study of new materials is urgently needed. Recently, high dielectric materials like $Al_2O_3$, $ZrO_2$, and $HfO_2$ are being studied for equivalent oxide thickness (EOT). However, poly-Si gate is not compatible with high-k materials for gate-insulator. Poly Si gate with high-k material has some problems such as gate depletion and dopant penetration problems. Therefore, new gate structure or materials that are compatible with high-k materials are also needed. TiN for metal/high-k gate stack is conductive enough to allow a good electrical connection and compatible with high-k materials. According to this trend, the study on dry etching of TiN for metal/high-k gate stack is needed. In this study, the investigations of the TiN etching characteristics were carried out using the inductively coupled $BCl_3$-based plasma system and adding $Cl_2$ gas. Dry etching of the TiN was studied by varying the etching parameters including $BCl_3$/Ar gas mixing ratio, RF power, DC-bias voltage to substrate, and $Cl_2$ gas addition. The plasmas were characterized by optical emission spectroscopy analysis. Scanning electron microscopy was used to investigate the etching profile.

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The Effect of a Sol-gel Formed TiO2 Blocking Layer on the Efficiency of Dye-sensitized Solar Cells

  • Cho, Tae-Yeon;Yoon, Soon-Gil;Sekhon, S.S.;Kang, Man-Gu;Han, Chi-Hwan
    • Bulletin of the Korean Chemical Society
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    • v.32 no.10
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    • pp.3629-3633
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    • 2011
  • The effect of a dense $TiO_2$ blocking layer prepared using the sol-gel method on the performance of dye-sensitized solar cells was studied. The blocking layer formed directly on the working electrode, separated it from the electrolyte, and prevented the back transfer of electrons from the electrode to the electrolyte. The dyesensitized solar cells were prepared with a working electrode of fluorine-doped tin oxide glass coated with a blocking layer of dense $TiO_2$, a dye-attached mesoporous $TiO_2$ film, and a nano-gel electrolyte, and a counter electrode of Pt-deposited FTO glass. The gel processing conditions and heat treatment temperature for blocking layer formation affected the morphology and performance of the cells, and their optimal values were determined. The introduction of the blocking layer increased the conversion efficiency of the cell by 7.37% for the cell without a blocking layer to 8.55% for the cell with a dense $TiO_2$ blocking layer, under standard illumination conditions. The short-circuit current density ($J_{sc}$) and open-circuit voltage ($V_{oc}$) also were increased by the addition of a dense $TiO_2$ blocking layer.

SiGe Nanostructure Fabrication Using Selective Epitaxial Growth and Self-Assembled Nanotemplates

  • Park, Sang-Joon;Lee, Heung-Soon;Hwang, In-Chan;Son, Jong-Yeog;Kim, Hyung-Jun
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2009.05a
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    • pp.24.2-24.2
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    • 2009
  • Nanostuctures such as nanodot and nanowire have been extensively studied as building blocks for nanoscale devices. However, the direct growth of the nanostuctures at the desired position is one of the most important requirements for realization of the practical devices with high integrity. Self-assembled nanotemplate is one of viable methods to produce highly-ordered nanostructures because it exhibits the highly ordered nanometer-sized pattern without resorting to lithography techniques. And selective epitaxial growth (SEG) can be a proper method for nanostructure fabrication because selective growth on the patterned openings obtained from nanotemplate can be a proper direction to achieve high level of control and reproducibility of nanostructucture fabrication. Especially, SiGe has led to the development of semiconductor devices in which the band structure is varied by the composition and strain distribution, and nanostructures of SiGe has represented new class of devices such nanowire metal-oxide-semiconductor field-effect transistors and photovoltaics. So, in this study, various shaped SiGe nanostructures were selectively grown on Si substrate through ultrahigh vacuum chemical vapor deposition (UHV-CVD) of SiGe on the hexagonally arranged Si openings obtained using nanotemplates. We adopted two types of nanotemplates in this study; anodic aluminum oxide (AAO) and diblock copolymer of PS-b-PMMA. Well ordered and various shaped nanostructure of SiGe, nanodots and nanowire, were fabricated on Si openings by combining SEG of SiGe to self-assembled nanotemplates. Nanostructure fabrication method adopted in this study will open up the easy way to produce the integrated nanoelectronic device arrays using the well ordered nano-building blocks obtained from the combination of SEG and self-assembled nanotemplates.

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Optical Behavior and Electrical Properties of Functional Dendrimer Thin Films (기능성 덴드리머 박막의 광학적 거동 및 전기적 특성)

  • 박재철;정상범;권영수
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.52 no.5
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    • pp.201-205
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    • 2003
  • We synthesized dendrimers containing light switchable units, azobenzene group. And the dendrimer containing 48 pyridinepropanol functional end group, which could form a complex structure with metal ions was synthesized. To apply to the molecular level devices or data storage system using Langmuir-Blodgett(LB) film, we firstly investigated the monolayer behavior using the surface pressure-area($\pi$-A) isotherms at air-water interface. And then the surface pressure shift of monolayer by light irradiation was also measured to the dendrimer with azobezene group. As a result, the monolayer of dendrimer with azobenzene group showed the reversible photo-switching behavior by the isomerization of azobenzene group in their periphery. The samples for electrical measurement were fabricated to two types which were pure dendrimer with pyridinepropanol group and its complexes with $Pt^4+$ ions by LB method. We have studied the electrical properties of the ultra thin dendrimer LB films investigated by the current-voltage(I-V) characteristics of Metal/Dendrimer LB films/Metal(MIM) structure. And we have investigated different results in the surface activity at the air-water interface as well as the electrical properties for the monolayers of pure dendrimer with pyridinevopanol group and its complex with $Pt^4+$ ions. In conclusion, it is demonstrated that the metal ion around dendrimer with pyri야nepropanol group can contribute to make formation of network structure among dendrimers and it result from the change of electrical properties. This results suggest that the dendrimers with azobenzene group and pvridinedropanol group can be applied to high efficient nano-device of molecular level.

Heterogeneous Device Packaging Technology for the Internet of Things Applications (IoT 적용을 위한 다종 소자 전자패키징 기술)

  • Kim, Sarah Eunkyung
    • Journal of the Microelectronics and Packaging Society
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    • v.23 no.3
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    • pp.1-6
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    • 2016
  • The Internet of Things (IoT) is a new technology paradigm demanding one packaged system of various semiconductor and MEMS devices. Therefore, the development of electronic packaging technology with very high connectivity is essential for successful IoT applications. This paper discusses both fan-out wafer level packaging (FOWLP) and 3D stacking technologies to achieve the integrattion of heterogeneous devices for IoT. FOWLP has great advantages of high I/O density, high integration, and design flexibility, but ultra-fine pitch redistribution layer (RDL) and molding processes still remain as main challenges to resolve. 3D stacking is an emerging technology solving conventional packaging limits such as size, performance, cost, and scalability. Among various 3D stacking sequences wafer level via after bonding method will provide the highest connectivity with low cost. In addition substrates with ultra-thin thickness, ultra-fine pitch line/space, and low cost are required to improve system performance. The key substrate technologies are embedded trace, passive, and active substrates or ultra-thin coreless substrates.

Optimization of SWCNT-Coated Fabric Sensors for Human Joint Motion Sensing

  • Cho, Hyun-Seung;Park, Seon-Hyung;Yang, Jin-Hee;Park, Su-Youn;Han, Bo-Ram;Kim, Jin-Sun;Lee, Hae-Dong;Lee, Kang-Hwi;Lee, Jeong-Whan;Kang, Bok-Ku;Chon, Chang-Soo;Kim, Han-Sung;Lee, Joo-Hyeon
    • Journal of Electrical Engineering and Technology
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    • v.13 no.5
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    • pp.2059-2066
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    • 2018
  • This study explored the feasibility of utilizing an SWCNT-coated fabric sensor for the development of a wearable motion sensing device. The extent of variation in electric resistance of the sensor material was evaluated by varying the fiber composition of the SWCNT-coated base fabrics, attachment methods, number of layers, and sensor width and length. 32 sensors were fabricated by employing different combinations of these variables. Using a custom-built experimental jig, the amount of voltage change in a fabric sensor as a function of the length was measured as the fabric sensors underwent loading-unloading test with induced strains of 30 %, 40 %, and 50 % at a frequency of 0.5 Hz. First-step analysis revealed the following: characteristics of the strain-voltage curves of the fabric sensors confirmed that 14 out of 32 sensors were evaluated as more suitable for measuring human joint movement, as they yield stable resistance values under tension-release conditions; furthermore, significantly stable resistance values were observed at each level of strain. Secondly, we analyzed the averaged maximum, minimum, and standard deviations at various strain levels. From this analysis, it was determined that the two-layer sensor structure and welding attachment method contributed to the improvement of sensing accuracy.

Optical Behavior and Electrical Properties of Functional Dendrimer Thin Films (기능성 덴드리머 박막의 광학적 거동 및 전기적 특성)

  • 박재철;정상범;권영수
    • The Transactions of the Korean Institute of Electrical Engineers D
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    • v.52 no.5
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    • pp.201-201
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    • 2003
  • We synthesized dendrimers containing light switchable units, azobenzene group. And the dendrimer containing 48 pyridinepropanol functional end group, which could form a complex structure with metal ions was synthesized. To apply to the molecular level devices or data storage system using Langmuir-Blodgett(LB) film, we firstly investigated the monolayer behavior using the surface pressure-area($\pi$-A) isotherms at air-water interface. And then the surface pressure shift of monolayer by light irradiation was also measured to the dendrimer with azobezene group. As a result, the monolayer of dendrimer with azobenzene group showed the reversible photo-switching behavior by the isomerization of azobenzene group in their periphery. The samples for electrical measurement were fabricated to two types which were pure dendrimer with pyridinepropanol group and its complexes with $Pt^4+$ ions by LB method. We have studied the electrical properties of the ultra thin dendrimer LB films investigated by the current-voltage(I-V) characteristics of Metal/Dendrimer LB films/Metal(MIM) structure. And we have investigated different results in the surface activity at the air-water interface as well as the electrical properties for the monolayers of pure dendrimer with pyridinevopanol group and its complex with $Pt^4+$ ions. In conclusion, it is demonstrated that the metal ion around dendrimer with pyri야nepropanol group can contribute to make formation of network structure among dendrimers and it result from the change of electrical properties. This results suggest that the dendrimers with azobenzene group and pvridinedropanol group can be applied to high efficient nano-device of molecular level.