• Title/Summary/Keyword: NX

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Study of the hydrogen concentration of SiNx film by Fourier transform infrared spectroscopy (Fourier transform infrared spectroscopy를 이용한 SiNx박막의 수소농도 연구)

  • Lee, Seok-Ryoul;Choi, Jae-Ha;Jhe, Ji-Hong;Lee, Lim-Soo;Ahn, Byung-Chul
    • Journal of the Korean Vacuum Society
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    • v.17 no.3
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    • pp.215-219
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    • 2008
  • The bonding structure and composition of silicon nitride (SiNx) films were investigated by using Fourier transform infrared spectroscopy (FT-IR). SiNx films were deposited on Si substrate at $340^{\circ}C$ using a conventional PECVD system. The compositions of Si and N in SiNx films were confirmed by using Rutherford backscattering spectroscopy (RBS) and photoluminescence (PL) analysis. The surface morphology of SiNx films was also analyzed by using atomic force microscopy (AFM). It was found that the contents of NH(at. %) is the reverse related with those of SiH corresponding to the result of FT-IR. we conclude that a quantitative analysis on SiNx films can be possible through a precise detection of the contents of H in SiNx films with a FT-IR analysis only.

Characteristic and Electrical Properties of $TiN_xO_y/TiN_x$ Multilayer Thin Film Resistors with a High Resistance ($TiN_xO_y/TiN_x$다층 박막을 이용한 고저항 박막 저항체의 특성평가)

  • Park, Kyoung-Woo;Hur, Sung-Gi;Ahn, Jun-Ku;Yoon, Soon-Gil
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.06a
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    • pp.19-19
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    • 2009
  • TiNxOy/TiNx multilayer thin films with a high resistance (~ k$Omega$) were deposited on SiO2/Si substrates at room temperature by sputtering. The TiNx thin films show island and smooth surface morphology in samples prepared by dc and rf magnetron sputtering, respectively. TiNxOy/TiNx multilayer has been developed to control temperature coefficient of resistance (TCR) by the incorporation of TiNx layer (positive TCR) inserted into TiNxOy layers(negative TCR). Electrical and structural properties of sputtered TiNxOy/TiNx multilayer films were investigated as a function of annealing temperature. In order to achieve a stable high resistivity, multilayer films were annealed at various temperatures in oxygen ambient. Samples annealed at 700 oC for 1 min exhibit a good TCR value and a stable high resistivity.

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Growth of SiC film on SiNx/Si Structure (SiNx/Si 구조를 이용한 SiC 박막성장)

  • Kim, Gwang-Cheol;Park, Chan-Il;Nam, Gi-Seok;Im, Gi-Yeong
    • Korean Journal of Materials Research
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    • v.10 no.4
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    • pp.276-281
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    • 2000
  • Silicon carbide(SiC) films were grown on modified Si(111) surface with a SiNx in the NH$_3$surrounding. Thickness of SiC films was decreased with increasing of the nitridation time. Also, voids having crystal defects were removed at interface of SiC/Si according to growth parameters. SiC films were grown on SiNx/Si substrate of 100, 300 and 500nm thickness. SiC films were deposited along [111] direction and columnar grains of SiC crystal. The void-free film was observed in the interface of SiC/SiNx. This result suggests that fabrication of SiC devices are applied to SiNx replacing silicon oxide in SOI structure.

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Fabrication and Characteristics of a-SiNx:H Thin Films (a-SiNx:H 박막의 제조 및 특성)

  • Park, Wug-Dong;Kim, Young-Jin;Kim, Ki-Wan
    • Journal of Sensor Science and Technology
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    • v.4 no.2
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    • pp.58-63
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    • 1995
  • The effects of substrate temperature, RF power, and $NH_{3}/SiH_{4}$ gas flow ratio on the dielectric constant and optical bandgap of amorphous silicon nitride (a-SiNx:H) thin films prepared by PECVD method using RF glow discharge decomposition of $SiH_{4}$ and $NH_{3}$ gas mixtures have been studied. The dielectric constant and optical bandgap of a-SiNx:H thin films were greatly exchanged as by increasing substrate temperature, RF power, and $NH_{3}/SiH_{4}$ gas flow ratio. The dielectric constant of a-SiNx:H films was increased and optical bandgap of a-SiNx:H films was decreased as the substrate temperature was increased. When the substrate temperature, RF power, gas pressure, $NH_{3}/SiH_{4}$ gas flow ratio, and thickness were $250^{\circ}C$, 20 W, 500 mTorr, 10 and $1500\;{\AA}$, respectively, the dielectric constant, breakdown field and optical bandgap of a-SiNx:H film were 4.3, 1 MV/cm, and 2.9 eV, respectively.

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Improvement of Learning Behavior of Mice by an Antiacetylcholinesterase and Neuroprotective Agent NX42, a Laminariales-Alga Extract (Acetylcholinesterase 억제 및 신경세포 보호 활성을 갖는 다시마목 해조 추출물 NX42의 마우스 학습능력 향상 효과)

  • Lee, Bong-Ho;Stein, Steven M.
    • Korean Journal of Food Science and Technology
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    • v.36 no.6
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    • pp.974-978
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    • 2004
  • Brown-alga-derived natural agent NX42, mainly composed of algal polysaccharides and phlorotannins, showed mild but dose-dependent inhibition of acetylcholinesterase with $IC_{50}=600-700\;{\mu}g/mL$. Phlorotannin-rich fraction of NX42 showed substantial increase of the activity by more than one order of magnitude ($IC_{50}=54\;{\mu}g/mL$) and significant protection of SK-N-SH cells from oxidative stress by $H_2O_2$. Learning trials of mice for 5 consecutive days revealed electric-shock treatment during learning period significantly retarded learning process, whereas NX42-treated mice showed significant resistance against leaning deficiency possibly mainly due to anticholinesterase and neuroprotective activities of phlorotannin.

Nitric Acid를 이용한 SiNx/SiO2 Double Layer Passivation

  • Choe, Jae-U;Kim, Hyeon-Yeop;Lee, Jun-Sin
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.08a
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    • pp.405-405
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    • 2011
  • 실리콘 질화막(SiNx : H)는 결정질 실리콘 태양전지 제작 공정에서 ARC (Anti Reflection Coating)과 표면 패시베이션의 역할로써 많이 사용되었지만, layer 자체의 quality가 좋지 않기 때문에 최근에는 SiNx/SiO2 이중 layer로 passivation layer를 형성하고 있다. SiO2 layer는 Si substrate를 소스로 하여 성장시키기 때문에 막의 질이 우수하기는 하지만, 막 성장을 위해서 Furnace를 이용해야 하기 때문에, 공정 시간과 공정 비용을 증가시키는 단점이 있다. 본 연구에서는 SiO2 layer를 Furnace가 아닌, 질산(HNO3)을 이용하여SiNx/Thin SiO2 passivation layer 제작하였다. 실험에서는 SiO2 성장을 위해서 질산 용액에 p-type wafer를 dipping하여 시간대 별, SiO2 막의 두께를 관찰하였고, passivation의 효과를 확인하기 위해 lifetime을 측정하였다. 그 결과 SiNx/SiO2 이중 passivation layer는 SiNx 단일 막으로 passivation을 하였을 때보다, lifetime이 10 us 상승했고, 셀 제작시 효율은 약 1.1%, Fill Factor는 약 4% 정도 증가한 것을 확인할 수 있었다.

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SiC/SiNx 복합층을 열처리에 의하여 형성된 SiC 나노입자의 광학적 성질

  • Park, Hun-Min;O, Do-Hyeon;Kim, Tae-Hwan
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.393-393
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    • 2013
  • 나노입자를 포함하는 합성물은 전자소자와 광전소자의 응용 가능성 때문에 많은 연구가 진행되고 있다. 복합층을 사용한 소자의 전기적 성질에 대한 연구는 많이 진행되었으나, SiC/SiNx 다층 복합층 소자에 대한 광학적 특성에 대한 연구는 상대적으로 미흡하다. 본 연구는 SiC/SiNx 다층 복합층을 사용하여 스퍼터링 방법으로 형성하고 열처리를 사용하여 복합층의 미세구조와 광학적 특성을 조사하였다. SiNx층을 p-형 Si 기판 위에 성장한 후 SiC층을 형성하였다. 3번의 주기적인 성장으로 다층구조를 형성하고, 30분 동안 열처리 하였다. 투과전자현미경상은 SiC/SiNx 복합층에 SiC 나노입자가 형성한 것을 확인하였다. 광류미네센스 스펙트럼 결과는 형성한 SiC/SiNx 복합층을 열처리할 때 SiC층에서 나타나는 주된 피크 위치가 변위되는 것을 보였다. 광류 미네센스 스펙트럼 결과에서 나타난 주된 피크가 열치리에 따라 변화하는 원인을 규명하였다.

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The characteristics of MIS devices using difference between various band gap of the SiNx (SiNx의 band gap 차이를 이용한 MIS 소자의 메모리 특성)

  • Son, Hyuk-Joo;Jung, Sung-Wook;Jang, Kyung-Soo;Kim, Kyung-Hae;Yi, Jun-Sin
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.197-198
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    • 2008
  • 이 논문에서는 다양한 SiNx의 band gap을 이용하여 MIS 구조의 메모리 소자를 제작하고 이를 분석하였다. SiNx 박막은 증착 가스비에 따라 다양한 band gap을 가지게 된다. 본 실험에서는 $SiH_4$ 가스와 $NH_3$ 가스를 사용하여 SiNx 박막을 증착하였다. n-type 단결정 실리콘 기판위에 다양한 가스비에 따라 단일 SiNx 박막을 증착 및 분석하였고, 이를 이용하여 NNN 구조의 MIS 소자를 제작하였다. 제작된 소자는 4.6 V의 hysteresis roof 폭과 1000 초 후에 84.8 %의 retention 값을 갖는 우수한 메모리 특성을 보였다.

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PR페이지 - 코닥, 플렉셀 NX 시스템 확장 버전 출시

  • 대한인쇄문화협회
    • 프린팅코리아
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    • v.13 no.8
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    • pp.98-98
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    • 2014
  • 코닥 플렉셀 NX 시스템(KODAK Flexcel NX System)은 플렉소 인쇄용 솔루션으로, 그라비어 인쇄와 비교해 월등히 좋은 인쇄품질과 지속성을 제공한다. 코닥은 최근 코닥 플렉셀 NX 시스템의 새로운 확장 버전을 출시해 인쇄 안정성과 프레스룸 효율성을 증가시키면서 고객들로 하여금 골판지 박스 포장인쇄 전후 단계에서 인쇄 품질 향상이 가능하도록 지원하고 있다.

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SiNx 무기 박막의 수직액정 배향 능력

  • Kim, Byeong-Yong;Kim, Yeong-Hwan;Park, Hong-Gyu;O, Byeong-Yun;Ok, Cheol-Ho;Han, Jeong-Min;Seo, Dae-Sik
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.11a
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    • pp.185-185
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    • 2009
  • The aligned liquid crystals (LCs) display on SiNx thin films using ion-beam (IB) irradiation was studied with controllability ofpretilt angle depending on incident energies of the IB. Plasma-enhanced chemical vapor deposition (PECVD) was used to orient the LCs on SiNx alignment films. The LCs alignment property for the SiNx thin films were observed to verify the practical application potential (figure1). A good LCs alignment of vertical alignment LCs cells on SiNx thin film surfaces irradiated with incident IB energy of 1800eV was achieved. Also, a good LC alignment by the IB irradiation on the SiNx thin film surface was observed at an annealing temperature of $180^{\circ}C$. However, the alignment defects of the nematic liquid crystal was observed at an annealing temperature above $230^{\circ}C$. The atomic force microscopy (AFM) images of LCs on SiNx thin film surfaces irradiated with IB energy was used for the surface analysis.

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