• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.122-122
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• 2008

Recently, Metal/Alumina/Silicon-Nitride/Silicon-Oxide/Silicon (MANOS) structures are one of the most attractive candidates to realize vertical scaling of high-density NAND flash memory [1]. However, as ANO layers are miniaturized, negative and positive bias temperature instability (NBTI/PBTI), such as the flat band voltage shift, ${\Delta}V_{FB}$, the interfacial trap density increase, ${\Delta}D_{it}$, the gate leakage current, ${\Delta}I_G$. and the retention characteristics, in MONOS capacitors, becomes an important issue in terms of reliability. It is well known that tunnel oxide degradation is a result of the oxide and interfacial traps generation during FN (Fowler-Nordheim) stress [2]. Because the bias temperature stress causes an increase of both interfacial-traps and fixed oxide charge could be a factor, witch can degrade device reliability during the program and erase operation. However, few studies on NBTI/PBTI have been conducted on improving the reliability of MONOS devices. In this work, we investigate the effect of post-annealing gas on bias temperature instability (BTI), such as the flat band voltage shift, ${\Delta}V_{FB}$, the interfacial trap density shift, ${\Delta}I_G$ retention characteristics, and the gate leakage current characteristics of MANOS capacitors. MANOS samples annealed at $950^{\circ}C$ for 30 s by a rapid thermal process were treated via additional annealing in a furnace, using annealing gases $N_2$ and $N_2-H_2$ (2 % hydrogen and 98 % nitrogen mixture gases) at $450^{\circ}C$ for 30 min. MANOS samples annealed in $N_2-H_2$ ambient had the lowest flat band voltage shift, ${\Delta}V_{FB}$ = 1.09/0.63 V at the program/erase state, and the good retention characteristics, 123/84 mV/decade at the program/erase state more than the sample annealed at $N_2$ ambient.

• Journal of the Institute of Electronics and Information Engineers
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• v.52 no.9
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• pp.54-62
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• 2015

Although NAND flash-based SSD (Solid-State Drive) provides superior performance in comparison to HDD (Hard Disk Drive), it has a major drawback in write endurance. As a result, the lifetime of SSD is determined by the workload and thus it becomes a big challenge in current technology trend of such as the shifting from SLC (Single Level Cell) to MLC (Multi Level cell) and even TLC (Triple Level Cell). Most previous studies have dealt with wear-leveling or improving SSD lifetime regarding hardware architecture. In this paper, we propose the optimal configuration of host I/O stack focusing on file system, I/O scheduler, and link power management using JEDEC enterprise workloads in terms of WAF (Write Amplification Factor) which represents the efficiency perspective of SSD life time especially for host write processing into flash memory. Experimental analysis shows that the optimum configuration of I/O stack for the perspective of SSD lifetime is MinPower-Dead-XFS which prolongs the lifetime of SSD approximately 2.6 times in comparison with MaxPower-Cfq-Ext4, the best performance combination. Though the performance was reduced by 13%, this contributions demonstrates a considerable aspect of SSD lifetime in relation to I/O stack optimization.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.546-546
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• 2008

Copper (Cu) Chemical mechanical polishing (CMP) has been an essential process for Cu wifing of DRAM and NAND flash memory beyond 45nm. Copper has been employed as ideal material for interconnect and metal line due to the low resistivity and high resistant to electro-migration. Damascene process is currently used in conjunction with CMP in the fabrication of multi-level copper interconnects for advanced logic and memory devices. Cu CMP involves removal of material by the combination of chemical and mechanical action. Chemicals in slurry aid in material removal by modifying the surface film while abrasion between the particles, pad, and the modified film facilitates mechanical removal. In our research, we emphasized on the role of chemical effect of slurry on Cu CMP, especially on the effect of amine functional group on removal rate selectivity between Cu and Tantalum-nitride (TaN) film. We investigated the two different kinds of complexing agent both with amine functional group. On the one hand, Polyacrylamide as a polymer affected the stability of abrasive, viscosity of slurry and the corrosion current of copper film especially at high concentration. At higher concentration, the aggregation of abrasive particles was suppressed by the steric effect of PAM, thus showed higher fraction of small particle distribution. It also showed a fluctuation behavior of the viscosity of slurry at high shear rate due to transformation of polymer chain. Also, because of forming thick passivation layer on the surface of Cu film, the diffusion of oxidant to the Cu surface was inhibited; therefore, the corrosion current with 0.7wt% PAM was smaller than that without PAM. the polishing rate of Cu film slightly increased up to 0.3wt%, then decreased with increasing of PAM concentration. On the contrary, the polishing rate of TaN film was strongly suppressed and saturated with increasing of PAM concentration at 0.3wt%. We also studied the electrostatic interaction between abrasive particle and Cu/TaN film with different PAM concentration. On the other hand, amino-methyl-propanol (AMP) as a single molecule does not affect the stability, rheological and corrosion behavior of the slurry as the polymer PAM. The polishing behavior of TaN film and selectivity with AMP appeared the similar trend to the slurry with PAM. The polishing behavior of Cu film with AMP, however, was quite different with that of PAM. We assume this difference was originated from different compactness of surface passivation layer on the Cu film under the same concentration due to the different molecular weight of PAM and AMP.

• KIPS Transactions on Computer and Communication Systems
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• v.1 no.2
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• pp.71-78
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• 2012

The digital tachograph is a device that automatically records speed and distance of a vehicle, together with the driver's activity and vehicle status at an accident. It records vehicle speed, break status, acceleration, engine RPM, longitude and latitude of GPS, accumulated distance, and so on. European Commission regulation made digital tachographs mandatory for all trucks from 2005. Republic of Korea made digital tachographs mandatory for all new business vehicles from 2011 and is widening the range of vehicles that must install digital tachographs year by year. This device is used to analyze driver's daily driving information and car accidents. Under a car accident that makes the device reliability unpredictable, it is very important to store driving information with maximum reliability for its original mission. We designed and implemented a practical digital tachograph. This paper presents a storage scheme that consists of a first storage device with small capacity at a high reliability and a second storage device with large capacity at a low cost in order to reliably records data with a hardware at a low cost. The first storage device records data in a SLC NAND flash memory in a log-structured style. We present a reverse partial scan that overcomes the slow scan time of log-structured storages at the boot stage. The scheme reduced the scan time of the first storage device by 1/50. In addition, our design includes a scheme that fast stores data at a moment of accident by 1/20 of data transfer time of a normal method.