• Transactions on Electrical and Electronic Materials
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• v.13 no.4
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• pp.208-211
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• 2012

In the present study, a ZnO thin film, as a buffer layer of ITO (indium tin oxide) film was deposited on glass substrates by RF magnetron sputtering at low temperature of $150^{\circ}C$. In order to estimate the optical characteristics and compare with the experimental results in Glass/ZnO(100 nm)/ITO(35 nm) multilayered film, the simulation program, EMP (Essential Macleod Program) was adopted. The sheet resistance and optical transmittance of the films were measured using the four-point probe method and spectrophotometer, respectively. From X-ray diffraction patterns, all the films deposited at $150^{\circ}C$ demonstrated only the amorphous phase. Optical transmittance was the highest at a ZnO thickness of 100 nm. The ITO(35 nm)/ZnO(100 nm) film exhibits an optical transmittance of >92% at 550 nm. The multilayered film showed an electrical sheet resistance of 407 ${\Omega}/sq.$, which is significantly better than that of a single-layer ITO film without a ZnO buffer layer (815 ${\Omega}/sq.$).

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.07a
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• pp.100-103
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• 2001

In this study, the adhesion and thermal property of the electroless-deposited Cu thin film were investigated. The multilayered structure of Cu/TaN/Si was fabricated by electroless-depositing the Cu thin layer on the TaN diffusion barrier which was deposited by MOCVD on the Si substrate. The thermal stability was investigated by measuring the resistivity as post-annealing temperature far the multilayered Cu/TaN/Si specimen which was annealed at Ar gas. The adhesion property of Cu 171ms was evaluated by the scratch test. The adhesion of the electroless-deposited Cu film was compared with other deposition methods of thermal evaporation and sputtering. The scratch test showed that the adhesion of electroless plated Cu film on TaN was better than those of sputtered Cu film and evaporated Cu film.

• 한국정보디스플레이학회:학술대회논문집
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• 2000.01a
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• pp.37-38
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• 2000

The ZnS:Tb thin-film electroluminescent devices were grown by atomic layer deposition with utilizing single-layer aluminum oxide and/or multilayered tantalum aluminum oxide, $Ta_xAl_yO$, as upper and lower insulating layers. These devices were investigated in terms of the luminescent and electrical characteristics. From this analysis, the devices using the $Ta_xAl_yO$ instead of $Al_2O_3$ were observed to have a lower threshold voltage for emission due to the higher relative dielectric constant of $Ta_xAl_yO$ insulators than that of the $Al_2O_3$ device. And there was a large amount of dynamic space charge generation in the phosphor of the device with the $Ta_xAl_yO$ insulators seemingly due to electron multiplication such as trap ionization.

• Proceedings of the Korean Vacuum Society Conference
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• 1996.02a
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• pp.160-160
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• 1996

• The Korean Journal of Ceramics
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• v.7 no.1
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• pp.36-40
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• 2001

In order to fabricate uncooled IR sensors for pyroelectric applications, multilayered thin films of Pt/PbTiO$_3$/Pt/Ti/Si$_3$N$_4$/SiO$_2$/Si and thermally isolating membrane structures of square-shaped/cantilevers-shaped microstructures were prepared. Cavity was also fabricated via direct silicon wafer bonding and etching technique. Metallic Pt layer was deposited by ion beam sputtering while PbTiO$_3$ thin films were prepared by sol-gel technique. Micromachining technology was used to fabricate microstructured-membrane detectors. In order to avoid a difficulty of etching active layers, silicon-nitride membrane structure was fabricated through the direct bonding and etching of the silicon wafer. Although multilayered thin film deposition and device fabrications were processed independently, these could b integrated to make IR micro-sensor devices.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.6
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• pp.31-37
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• 1993

InSb thin films were fabricated by zone melting recrystallization of In/Sb multilayered thin films prepared by sequential evaporation. Unreacted metal phase or dispersed metal precipitates lowered the electron mobility and the electron mobility increased with development of (111) prefered orientation. Properties of the film could be controlled by changing mzximum temperature and scanning speed, and the electron mobility as high as 12, 000 cm $^2$/Vsec could be obtained under the optimized conditions.

• Korean Journal of Optics and Photonics
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• v.27 no.4
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• pp.143-150
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• 2016

The thickness of each layer in a multilayered system is determined by a Fourier-transform method using spectroscopic reflectance measurements. To verify this method, we first generate theoretical reflectance spectra for three layers, and these are fast-Fourier-transformed using our own Matlab program. Each peak of the Fourier-transformed delta function denotes the optical thickness of each layer, and these are transformed to physical thicknesses. The relative thickness error of the theoretical model is less than 1.0% while a layer's optical thickness is greater than 730 nm. A PI-(thin $SiO_2$)-PImultilayeredstructure produced by the bar-coating method was analyzed, and the thickness errors compared to SEM measurements. Even though this Fourier-transform method requires knowing the film order and the refractive index of each layer prior to analysis, it is a fast and nondestructive method for the analysis of multilayered structures.

• Proceedings of the Korean Magnestics Society Conference
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• 2007.05a
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• pp.162-162
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• 2007

• Proceedings of the Korean Ceranic Society Conference
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• 2000.10a
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• pp.197.1-197
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• 2000

• Proceedings of the Korean Vacuum Society Conference
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• 1997.02a
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• pp.144-145
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• 1997