• Current Optics and Photonics
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• 제4권6호
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• pp.545-550
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• 2020

We propose a hole-filling method to solve discontinuous depth representation and to reduce the visible seams and cracks that cause the limitation of the viewing angle of the three-dimensional (3D) image in the multilayer type 3D display system. The occlusion and the disocclusion regions between layers, such as the visible seams and cracks, are a major bottleneck of the multilayer type 3D display system to represent a volumetric 3D image by stacking multiple images. As a result, in the reconstructed 3D image, the visible seams and cracks appear as brighter overlapping and undesirable cut-off. In order to resolve the problems above, we applied the depth-fused effect to the sub-depth map generating algorithm and improve the viewing characteristics of the multilayer type 3D display. The experimental demonstrations are also provided to verify the proposed scheme.

• Current Optics and Photonics
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• 제5권1호
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• pp.32-39
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• 2021

We propose a three-dimensional (3D) streaming system based on a lamina display that can convey field information in real-time by creating floating 3D images that can satisfy the accommodation cue. The proposed system is mainly composed of three parts, namely: a 3D vision camera unit to obtain and provide RGB and depth data in real-time, a 3D image engine unit to realize the 3D volume with a fast response time by using the RGB and depth data, and an optical floating unit to bring the implemented 3D image out of the system and consequently increase the sense of presence. Furthermore, we devise the streaming method required for implementing augmented reality (AR) images by using a multilayered image, and the proposed method for implementing AR 3D video in real-time non-face-to-face communication has been experimentally verified.

• 반도체디스플레이기술학회지
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• 제20권4호
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• pp.171-176
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• 2021

Die-to-wafer (D2W) hybrid bonding in the multilayer semiconductor manufacturing process is one of wafer direct bonding, and various studies are being conducted around the world. A noteworthy point in the current die-to-wafer process is that a lot of voids occur on the bonding surface of the die during bonding. In this study, as a suggested method for removing voids generated during the D2W hybrid bonding process, a flexible mechanism for implementing convex for die bonding to be applied to the bond head is proposed. In addition, modeling of flexible mechanisms, analysis/design/control/evaluation of static/dynamics properties are performed. The proposed system was controlled by capacitive sensor (lion precision, CPL 290), piezo actuator (P-888,91), and dSpace. This flexure mechanism implemented a working range of 200 ㎛, resolution(3σ) of 7.276nm, Inposition(3σ) of 3.503nm, settling time(2%) of 500.133ms by applying a reverse bridge type mechanism and leaf spring guide, and at the same time realized a maximum step difference of 6 ㎛ between die edge and center. The results of this study are applied to the D2W hybrid bonding process and are expected to bring about an effect of increasing semiconductor yield through void removal. In addition, it is expected that it can be utilized as a system that meets the convex variable amount required for each device by adjusting the elongation amount of the piezo actuator coupled to the flexible mechanism in a precise unit.