• 제목/요약/키워드: Multi-plasma

검색결과 365건 처리시간 0.036초

Modelling of Optimum Design of High Vacuum System for Plasma Process

  • Kim, Hyung-Taek
    • International journal of advanced smart convergence
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    • 제10권1호
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    • pp.159-165
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    • 2021
  • Electronic devices used in the mobile environments fabricated under the plasma conditions in high vacuum system. Especially for the development of advanced electronic devices, high quality plasma as the process conditions are required. For this purpose, the variable conductance throttle valves for controllable plasma employed to the high vacuum system. In this study, we analyzed the effects of throttle valve applications on vacuum characteristics simulated to obtain the optimum design modelling for plasma conditions of high vacuum system. We used commercial simulator of vacuum system, VacSim(multi) on this study. Reliability of simulator verified by simulation of the commercially available models of high vacuum system. Simulated vacuum characteristics of the proposed modelling agreed with the observed experimental behaviour of real systems. Pressure limit valve and normally on-off control valve schematized as the modelling of throttle valve for the constant process-pressure of below 10-3 torr. Simulation results plotted as pump down curve of chamber, variable valve conductance and conductance logic of throttle valve. Simulated behaviors showed the applications of throttle valve sustained the process-pressure constantly, stably, and reliably in plasma process.

플라즈마 정보인자 기반 가상계측을 통한 Si 식각률의 첫 장 효과 분석 (Analysis of First Wafer Effect for Si Etch Rate with Plasma Information Based Virtual Metrology)

  • 유상원;권지원
    • 반도체디스플레이기술학회지
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    • 제20권4호
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    • pp.146-150
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    • 2021
  • Plasma information based virtual metrology (PI-VM) that predicts wafer-to-wafer etch rate variation after wet cleaning of plasma facing parts was developed. As input parameters, plasma information (PI) variables such as electron temperature, fluorine density and hydrogen density were extracted from optical emission spectroscopy (OES) data for etch plasma. The PI-VM model was trained by stepwise variable selection method and multi-linear regression method. The expected etch rate by PI-VM showed high correlation coefficient with measured etch rate from SEM image analysis. The PI-VM model revealed that the root cause of etch rate variation after the wet cleaning was desorption of hydrogen from the cleaned parts as hydrogen combined with fluorine and decreased etchant density and etch rate.

High rate magnetron sputtering of thick Cr-based tribological coatings

  • Bin, Jin H.;Nam, Kyung H.;Boo, Jin H.;Han, Jeon G.
    • 한국표면공학회지
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    • 제34권5호
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    • pp.409-413
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    • 2001
  • In this study, high rate deposition of thick CrNx films was carried out by crossed field unbalanced magnetron sputtering for the special application such as piston ring employed in automobile engine. For the high rate deposition and thick CrNx films formation with thickness of 30$\mu\textrm{m}$, high power density of $35W/cm^2$ in each target was induced and the multi-layer films of Cr/CrN and $\alpha$-Cr/CrN were synthesized by control of $N_2$ flow rate. The dynamic deposition rate of Cr and $\alpha$-CrN film was reached to 0.17$\mu\textrm{m}$/min and 0.12$\mu\textrm{m}$/rnin and the thick CrN$_{x}$. film of 30$\mu\textrm{m}$ could be obtained less than 5 hours. The maximum hardness was obtained above 2200 kg/mm$^2$ and adhesion strength was measured in about 70N, in case of multi-layers films. And the friction coefficient was measured by 0.4, which was similar to the value of CrN single-layer film.m.

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침형 상압 마이크로 플라즈마 장치에서 발생하는 전기장이 세포 사멸에 미치는 효과 (The effect of RF electric fields from an atmospheric micro-plasma needle device on the death of cells)

  • 윤현진;손채화;김규천;이해준
    • 전기학회논문지
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    • 제57권12호
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    • pp.2249-2254
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    • 2008
  • A non-thermal micron size plasma needle is applicable for medical treatment because it includes radicals, charged particles, ultraviolet emission, and strong electric fields. The electric fields around the plasma needle device driven by a radio frequency wave are investigated in order to calculate the power delivered to the cell. A commercial multi-physics code, CFD-ACE, was utilized for the calculation of electric fields for the optimization of the needle structure. The electric field and energy absorption profiles are presented with the variation of the device structure and the distance between the needle and tissues. The living tissues effectively absorb the radio frequency power from the plasma needle device with the covered pyrex structure.

대면적 Capacitively Coupled Plasma에서 Multi power feeding에 따른 Plasma uniformity 변화

  • 유광호;나병근;유대호;김은애;장홍영
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2009년도 제38회 동계학술대회 초록집
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    • pp.471-471
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    • 2010
  • 대면적 디스플레이나 태양전지를 만들기 위해 식각 공정에 주로 이용되는 capacitively coupled plasma 장비의 크기에 대한 관심이 높아지고 있다. 특히, RF power를 사용함에 따라 높은 주파수로 올라갈수록 전극에 발생하는 standing wave effect로 인해 챔버 안의 전자기장의 세기가 균일하지 않고 그로 인해 plasma의 밀도 역시 균일하지 않다.[1] 이러한 plasma의 non-uniformity를 전극에 들어가는 power의 feeding 방법을 바꿔 가면서 해결해 보려고 하였다. ($0.48\;m\;{\times}\;0.48\;m$)크기의 사각전극과 50 MHz의 RF power를 사용하였다. plasma의 분포는 ion probe를 통해 살펴 보았다.

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MICP(Multi-pole Inductively Coupled Plasma)를 이용한 deep contact etch 특성 연구

  • 김종천;구병희;설여송
    • 한국반도체및디스플레이장비학회:학술대회논문집
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    • 한국반도체및디스플레이장비학회 2003년도 춘계학술대회 발표 논문집
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    • pp.12-17
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    • 2003
  • 본 연구에서는 MICP Etching system 을 이용한 Via contact 및 Deep contact hole etch process 특성을 연구하였다. Langmuir probe 를 이용한 MICP source 의 Plasma density & electron temperature 측정하였고 탄소와 플로우르를 포함하는 혼합 Plasma 를 형성하여 RF frequency, wall temperature, chamber gap, gas chemistry 등의 변화에 따른 식각 특성을 조사하였다. Plasma density 는 1000w 에서 $10^{11}$/$cm^3$ 이상의 high density plasma와 uniform plasma 형성을 확인하였고 $CH_{2}F_{2}$와 CO의 적절한 혼합비를 이용하여 Oxide to PR 선택비가 10 이상인 고선택비 조건을 확보하였다. 고선택비 형성에 따라 Polymer 형성이 많이 되었고 이를 개선하기 위하여 반응 챔버의 온도 조절을 통하여 Polymer 증착 방지에 효과적인 것을 확인하였다. MICP source를 이용하여 탄소와 플로우르의 혼합 가스와 식각 챔버의 온도 조절에 의한 선택비 증가를 확보하여 High Aspect Ratio Contact Hole Etch 가능성을 확보하였다.

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산소 플라즈마 처리한 탄소나노튜브의 표면상태와 전계방출 특성 (Surface States and Field Emission Properties of Oxygen Plasma Treated Carbon Nanotubes)

  • 이선우;이붕주;박구범;신백균
    • 전기학회논문지
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    • 제62권3호
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    • pp.376-379
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    • 2013
  • Multi-walled carbon nanotubes (MWCNTs) were synthesized using catalytic chemical vapor deposition (CVD) method. Oxygen plasma treatment was applied to modify surface state of the CNTs synthesized for improvement of field emission performance. Surface state of the plasma treated CNTs was studied by X-ray photoelectron spectroscopy (XPS). The surface states of the CNTs were changed as a function of plasma treatment time. The oxygen related carbon shift was moved toward higher binding energy with the plasma treatment time. This result implies that the oxygen plasma treatment changes the surface state effectively. While any shift in carbon 1s peak was not detected for the as grown CNTs, oxygen related carbon shift was detected for the plasma treated CNTs. Carbon shift implies that closed CNT tips were opened by the oxygen plasma and reacted with oxygen species. Since the field emission occurs at pentagons or dangling bonds of the CNT tips, the increase of carbon-oxygen bonds plays an important role in field emission behavior by increasing the number of electron emission sites resulting in improvement of the field emission performance.

저 유전 재료의 에칭 공정을 위한 $H_2/N_2$ 가스를 이용한 Capacitively Coupled Plasma 시뮬레이션 (Capacitively Coupled Plasma Simulation for Low-k Materials Etching Process Using $H_2/N_2$ gas)

  • 손채화
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제55권12호
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    • pp.601-605
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    • 2006
  • The resistance-capacitance (RC) delay of signals through interconnection materials becomes a big hurdle for high speed operation of semiconductors which contain multi-layer interconnections in smaller scales with higher integration density. Low-k materials are applied to the inter-metal dielectric (IMD) materials in order to overcome the RC delay. Relaxation continuum (RCT) model that includes neutral-species transport model have developed to model the etching process in a capacitively coupled plasma (CCP) device. We present the parametric study of the modeling results of a two-frequency capacitively coupled plasma (2f-CCP) with $N_2/H_2$ gas mixture that is known as promising one for organic low-k materials etching. For the etching of low-k materials by $N_2/H_2$ plasma, N and H atoms have a big influence on the materials. Moreover the distributions of excited neutral species influence the plasma density and profile. We include the neutral transport model as well as plasma one in the calculation. The plasma and neutrals are calculated self-consistently by iterating the simulation of both species till a spatio-temporal steady state profile could be obtained.

Active control of amplitude and phase of high-power RF systems in EAST ICRF heating experiments

  • Guanghui Zhu;Lunan Liu;Yuzhou Mao;Xinjun Zhang;Yaoyao Guo;Lin Ai;Runhao Jiang;Chengming Qin;Wei Zhang;Hua Yang;Shuai Yuan;Lei Wang;Songqing Ju;Yongsheng Wang;Xuan Sun;Zhida Yang;Jinxin Wang;Yan Cheng;Hang Li;Jingting Luo
    • Nuclear Engineering and Technology
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    • 제55권2호
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    • pp.595-602
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    • 2023
  • The EAST ICRF system operating space has been extended in power and phase control with a low-level RF system for the new double-strap antenna. Then the multi-step power and periodic phase scanning experiment were conducted in L-mode plasma, respectively. In the power scanning experiment, the stored energy, radiation power, plasma impedance and the antenna's temperature all have positive responses during the short ramp-ups of PL;ICRF. The core ion temperature increased from 1 keV to 1.5 keV and the core heating area expanded from |Z| ≤ 5 cm to |Z| ≤ 10 cm during the injection of ICRF waves. In the phasing scanning experiment, in addition to the same conclusions as the previous relatively phasing scanning experiment, the superposition effect of the fluctuation of stored energy, radiation power and neutron yield caused by phasing change with dual antenna, resulting in the amplitude and phase shift, was also observed. The active control of RF output facilitates the precise control of plasma profiles and greatly benefits future experimental exploration.

Multi-layer resist (MLR) structure with a very thin DLC layer

  • Kim, H.T.;Kwon, B.S.;Park, S.M.;Lee, N.E.;Cho, H.J.;Hong, B.Y.
    • 한국표면공학회:학술대회논문집
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    • 한국표면공학회 2007년도 춘계학술발표회 초록집
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    • pp.71-72
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    • 2007
  • In this study, we investigated the fabrication of MLR (multi-layer resist) with a very thin diamond-like carbon (DLC) layer. ArF PR/$SiO_2$/DLC MLR structure was investigated and etching characteristics of the DLC layer was patterned using $SiO_2$ hard-mask by varying the process parameters such as different high-frequency/low-frequency combination ($f_{LF}/f_{HF}$), HF/LF power ratio ($P_{HF}/P_{LF}$), $O_2$ flow and $N_2$ flow rate in $O_2/N_2$/Ar plasmas. The results indicated an increased etch rate of DLC for the higher $f_{LF}/f_{HF}$ combination and for the increased low-frequency power ($P_{LF}$). And the etch rate of DLC was decreased with increasing the $N_2$ flow rate in $O_2/N_2$/Ar plasmas. In order to confirm the application of DLC MLR for the etching process of silicon oxide, the stack of ArF PR/BARC/$SiO_2$/DLC/TEOS/Si was investigated.

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