• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.8
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• pp.25-31
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• 2018

Recently, research on the development of lightweight vehicle bodies is increasing continuously as a response to fuel economy regulations. To reduce the weight of a vehicle body, a conventional steel plate has been substituted by light weight material with high specific strength and the jointing of multi-materials is generally applied. On the other hand, the customer's demand for safety and emotional quality in NVH (Noise, Vibration and Harshness) is becoming increasingly important. Therefore, a light weight with proper strength and NVH quality is needed. In the view of light weighting and NVH quality, the application of a vibration proof steel plate can be an effective solution but the formability of a sandwich panel is different with a conventional steel sheet. Therefore, careful analysis of formability is required. This study aims to characterize the formability of a sandwich high-strength steel plate. The high-strength steel plates of different thicknesses with resistance spot welding and sealer bonding were analyzed using forming limits diagram through a cup drawing test.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.04a
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• pp.41-41
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• 2008

In general, polyimides (PIs) are used in alignment layers in liquid crystal displays (LCDs). The rubbing alignment technique has been widely used to align the LC molecules on the PI layer. Although this method is suitable for mass production of LCDs because of its simple process and high productivity, it has certain limitations. A rubbed PI surface includes debris left by the cloth, and the generation of electrostatic charges during the rubbing induces local defects, streaks, and a grating-like wavy surface due to nonuniform microgrooves that degrade the display resolution of computer displays and digital television. Additional washing and drying to remove the debris, and overwriting for multi-domain formation to improve the electro-optical characteristics such as the wide viewing angle, reduce the cost-effectiveness of the process. Therefore, an alternative to non-rubbing techniques without changing the LC alignment layer (i.e, PI) is proposed. The surface of LC alignment layers as a function of the ion beam (IE) energy was modified. Various pretilt angles were created on the IB-irradiated PI surfaces. After IB irradiation, the Ar ions did not change the morphology of the PI surface, indicating that the pretilt angle was not due to microgrooves. To verify the compositional behavior for the LC alignment, the chemical bonding states of the ill-irradiated PI surfaces were analyzed in detail by XPS. The chemical structure analysis showed that ability of LCs to align was due to the preferential orientation of the carbon network, which was caused by the breaking of C=O double bonds in the imide ring, parallel to the incident 18 direction. The potential of non-rubbing technology for fabricating display devices was further conformed by achieving the superior electro-optical characteristics, compared to rubbed PI.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

• Proceedings of the Materials Research Society of Korea Conference
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• 2012.05a
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• pp.72-72
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• 2012

Lithium rechargeable batteries have been widely used as key power sources for portable devices for the last couple of decades. Their high energy density and power have allowed the proliferation of ever more complex portable devices such as cellular phones, laptops and PDA's. For larger scale applications, such as batteries in plug-in hybrid electric vehicles (PHEV) or power tools, higher standards of the battery, especially in term of the rate (power) capability and energy density, are required. In PHEV, the materials in the rechargeable battery must be able to charge and discharge (power capability) with sufficient speed to take advantage of regenerative braking and give the desirable power to accelerate the car. The driving mileage of the electric car is simply a function of the energy density of the batteries. Since the successful launch of recent Ni-MH (Nickel Metal Hydride)-based HEVs (Hybrid Electric Vehicles) in the market, there has been intense demand for the high power-capable Li battery with higher energy density and reduced cost to make HEV vehicles more efficient and reduce emissions. However, current Li rechargeable battery technology has to improve significantly to meet the requirements for HEV applications not to mention PHEV. In an effort to design and develop an advanced electrode material with high power and energy for Li rechargeable batteries, we approached to this in two different length scales - Atomic and Nano engineering of materials. In the atomic design of electrode materials, we have combined theoretical investigation using ab initio calculations with experimental realization. Based on fundamental understanding on Li diffusion, polaronic conduction, operating potential, electronic structure and atomic bonding nature of electrode materials by theoretical calculations, we could identify and define the problems of existing electrode materials, suggest possible strategy and experimentally improve the electrochemical property. This approach often leads to a design of completely new compounds with new crystal structures. In this seminar, I will talk about two examples of electrode material study under this approach; $LiNi_{0.5}Mn_{0.5}O_2$ based layered materials and olivine based multi-component systems. In the other scale of approach; nano engineering; the morphology of electrode materials are controlled in nano scales to explore new electrochemical properties arising from the limited length scales and nano scale electrode architecture. Power, energy and cycle stability are demonstrated to be sensitively affected by electrode architecture in nano scales. This part of story will be only given summarized in the talk.

• Journal of the korean academy of Pediatric Dentistry
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• v.35 no.4
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• pp.619-627
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• 2008

The objective of this study was to compare the microleakage of five adhesive systems in the enamel and dentin of permanent teeth. Class V cavity preparations with occlusal margins in enamel and gingival margins in dentin were prepared on both buccal and lingual surfaces of 25 extracted human molar teeth. The tested adhesives were: Adper Scotchbond Multi-purpose Plus Adhesive (SM), Adper Single bond 2 (SB), Clearfil SE Bond (SE), Adper Prompt L-Pop (PL) and G-Bond (GB). The results were as follows: 1. At the enamel margins, PL showed the highest leakage value(0.85), and others showed values of SB(0.55), GB(0.50), SM(0.35) and SE(0.25) in decreasing order. There were statistically significant differences in PL vs. SM and PL vs. SE(p<0.05). 2. At the dentin margins, GB showed the highest leakage value(2.10), and others showed values of SE(1.45), PL(1.40), SB(1.05), SM(0.70) in decreasing order. There were statistically significant differences in GB vs. SB and GB vs. SM(p<0.05). 3. Dentin margins showed high dye penetration rate than enamel margins in all material tested groups and there were statistically significant differences for SE, PL and GB.

• Journal of the korean academy of Pediatric Dentistry
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• v.30 no.2
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• pp.238-244
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• 2003

With the purpose of evaluating the effect of ailing amount of pit and assure sealants on the microleakage, 6 groups of specimens with different filling amount, filling materials and surface pretreatment were investigated. Sixty permanent third molars were divided into three groups. The occlusal surface of each tooth was divided into two parts; the filing width of one part was below 1mm (group1, 3, 5), and in the other part more than 2mm (group 2, 4, 6) Group 1 and 2: Helioseal F was applied directly to etched enamel; Group 3 and 4: Helioseal F was applied to etched and scotchbond Multi-purpose plus pre-treated enamel; Group 5 and 6: Tetric Flow was applied. After 500 times thermocycling and dye infiltration, we evaulated the microleakage. The results were as follows; 1. The mean microleakage score at each width were increased in the following order;group 5<3<1, and group 6<4<2. 2. In comparing the groups with same material and surface pretreatment but with different filling width (group 1 versus 2, 3 versus 4, 5 versus 6), the microleakage scores were significantly different. 3 The microleage was affected by filling amount of pit and assure sealants than Oiling materials and dentin bonding agent pretreatment.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.10 no.3
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• pp.503-510
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• 2006

Readout circuit is to convert signal occurred in a defector into suitable signal for image signal processing. In general, it has to possess functions of impedance matching with perception element, amplification, noise reduction and cell selection. It also should satisfies conditions of low-power, low-noise, linearity, uniformity, dynamic range, excellent frequency-response characteristic, and so on. The technical issues in developing image processing equipment for focal plane way (FPA) can be categorized as follow: First, ultraviolet (UV) my detector material and fine processing technology. Second, ReadOut IC (ROIC) design technology to process electric signal from detector. Last, package technology for hybrid bonding between detector and ROIC. ROIC enables intelligence and multi-function of image equipment. It is a core component for high value added commercialization ultimately. Especially, in development of high-resolution image equipment ROIC, it is necessary that high-integrated and low-power circuit design technology satisfied with design specifications such as detector characteristic, signal dynamic range, readout rate, noise characteristic, ceil pitch, power consumption and so on. In this paper, we implemented a $8\times8$ FPA prototype ROIC for reduction of period and cost. We tested unit block and overall functions of designed $8\times8$ FPA ROIC. Also, we manufactured ROIC control and image boards, and then were able to verify operation of ROIC by confirming detected image from PC's monitor through UART(Universal Asynchronous Receiver Transmitter) communication.

• Restorative Dentistry and Endodontics
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• v.26 no.4
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• pp.332-340
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• 2001

Flowable composite resin has lower filler content, increased flow, and lower modules of elasticity. It is suggested that flowable composite resin can be bonded to the tooth structure intimately and absorb or dissipate the stress. Therefore, it may be advantageous to use flowable composite resin for the base material of class II restoration and for the class V restoraton. The purpose of this study was to evaluate the microleakage and shear bond strength of four flowable composite resins (Aeliteflo, Flow-It, Revolution, Ultraseal XT Plus) compared to Z100 using Scotchbond Multi Purpose dentin bonding system. To evaluate the microleakage, notch-shaped class V cavities were prepared on buccal and lingual surfaces of 80 extracted human premolars and molars on cementum margin. The teeth were randomly divided into non-thermocycling group (group 1) and thermocycling group (group 2) of 40 teeth each. The experimental teeth of each group were randomly divided onto five subgroups of eight samples (sixteen surfaces). The Scotchbond Multi-Purpose and composite resin were applied for each group following the manufacturer's instructions. the teeth of group 2 were thermocycled five hundred times between 5$^{\circ}C$ and 55$^{\circ}C$. The teeth of group 2 were placed in 2% methylene blue dye for 24 hours, then rinsed with tab water. The specimens were embedded in clear resin, and sectioned longitudinally with a diamond saw. The dye penetration on each of the specimen were observed with a stereomicioscope at $\times$20 magnification. To evaluate the shear bond strength, 60 teeth were divided into five groups of twelve teeth each. The experimental teeth were ground horizontally below the dentinoenamel junction, so that no enamel remained. After applying Scotchbond Multi-Purpose on the dentin surface, composite resin was applied in the shape of cylinder. The cylinder was 4mm in diameter and 2mm in thickness. Shear bond strength was measured using Instron with a cross-head speed of 0.5mm/min. After shear bond strength measurement, mode of failure was evaluated with a stereomicroscope at $\times$30 magnification. All data were statistically analyzed by One Way ANOVA and Student-Newman-Keuls method. The correlation between microleakage and shear bond strength was analyzed by linear regression. The results of this study were as follows ; 1. In non-thermocycling group, the leakage value of Z100 was significantly lower than those of flowable composite resins at the enamel and dentin margin, margin, except that Revolution showed the lower leakage value than that of Z100 at the dentin margin (p<0.05). 2. In thermocycling group, the leakage values of Z100 and Ultraseal XT Plus were lower than those of other subgroup at the enamel and dentin margin, except that Flow-It showed the lower leakage value than that of Ultraseal XT Plus at the dentin margin (p<0.05). 3. The leakage value of Z100 and Ultraseal XT Plus in thermocycling group were not higher than that in non-thermocycling group at the enamel margin. The leakage value of Z100 in thermocycling group was not higher than that in non-thermocycling group at the dentin margin (p<0.05). 4. As for the shear bond strength measurement, there were no statistically significant differences among groups (p<0.05). The shear bond strengths given in descending order were as follows: Z100(16.81$\pm$2.98 MPa), Flow-It(14.8$\pm$4.43 MPa), Aeliteflo(14.34$\pm$3.69 MPa), Revolution(13.46$\pm$4.23 MPa), Ultraseal XT Plus(12.83$\pm$3.16 MPa). 5. Failure modes of all specimens were adhesive failures. 6. There was no correlation between microleakage and shear bond strength.

• Journal of the Korean Wood Science and Technology
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• v.27 no.2
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• pp.38-45
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• 1999

This study was to figure out proper Formaldehyde/Urea molar ratio of UF resin with satisfactory bonding strength of plywood and properties of particleboard. The six kinds of UF resins were manufactured with F/U molar ratio 1.0, 1.2, 1.4, 1.6, 1.8, and 2.0. The boards were made of three kinds of raw materials : Veneer, Sliver-Particle and Strand-Particle. Manufacturing condition of plywood : amount of mixing resin was 150g/$m^2$. The fourty secs/mm simple-pressing schedule in the pressure 10kgf/$m^2$ was applied for 480mm${\times}$700mm board at the temperature of $110^{\circ}C$ in a hot press. Manufacturing condition of particleboard : Target density was 0.65g/$cm^2$. The stepwise 9 minutes- multi-pressing schedule in the maximum pressure 40kgf/$cm^2$, the minimum pressure 15kgf/$cm^2$ was applied for $480mm{\times}634mm{\times}12mm$ board at the temperature of $150^{\circ}C$ in a hot press. The results are as follows : I. In bonding strength, plywood which was made by F/U molar ratio 1.2 showed the highest value. Other molar ratio resin also gave the satisfied value of KS standard, 7.5kgf/$cm^2$. 2. In internal bond strength of particleboard, Sliver-Particleboard(SLPB) and Strand-Particleboard(STPB) varied respectively from 5.9kgf/$cm^2$ to 4.8kgf/$cm^2$, from 6.7kgf/$cm^2$ to 5.4kgf/$cm^2$. SLPB with F/U=1.2 and STPB with F/U=1.6 had higher IB value. Also, both SLPB and STPB showed lower IB value in F/U molar ratio 2.0 and 1.0. 3. SLPB and STPB with six kinds of UF resin respectively satisfied bending strength of KS standard 150 Type(130kgf/$cm^2$) and 200 Type(180kgf/$cm^2$). Bending strength data for both of SLPB and STPB showed little or no loss from F/U=1.8 to F/U=1.2. Also, STPB was approximately two times higher than that of SLPB. Therefore, the raw material's shape had more effect on bending strength than the FlU molar ratio. 4. F/U=1.6 and 1.4 showed the lower thickness swelling in SLPB and STPB. All of STPBs satisfied thickness swelling of KS standard, under 12%.