• Title/Summary/Keyword: Multi-functional devices

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A Study on Protection Profile for Multi-function Devices (다기능 주변기기에 대한 보호프로파일에 관한 연구)

  • Lee, Dongubm
    • Journal of the Korea Institute of Information Security & Cryptology
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    • v.25 no.5
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    • pp.1257-1268
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    • 2015
  • Multi-functional devices was originally an equipment performing image processing, but function transmitting image data digitized by combining fax function and function of network are added and it was rapidly developed. Also, functions of internet application, application expansion, remote sharing and image treatment were added to multi-functional devices. But, multi-functional devices can cause security vulnerability such as data exposure, eavesdropping, etc. because of the threatening by network connection. Therefore, common criteria of multi-functional devices are necessary, but there is no protection profile for multi-functional devices now. Therefore, concrete standards of evaluation are not applied to evaluate secure for products, so it was difficult to maintain uniformity of evaluation quality. Therefore, this paper developed protection profile for multi-functional devices based on common criteria of evaluation so as to analyze threats of multi-functional devices and use secure multi-functional devices.

Single Crystals for Functional Devices

  • Kim, You-Song
    • Proceedings of the Korea Association of Crystal Growth Conference
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    • 1999.12a
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    • pp.93-99
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    • 1999
  • It is definite trend that the functional devices are to be integrated by miniaturizing of individual components. Bulk crystals turn into wafer form, while thin film of the functional materials is being fabricated for single and multi-layer devices. In addition, single crystals with multi-function performance would be desirable for further miniaturization. crystal growers have the responsibility for synthesis single crystals work to meet ever increasing requirement of future devices.

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Power Quality Improvement in Autonomous Microgrids Using Multi-functional Voltage Source Inverters: A Comprehensive Review

  • Miveh, Mohammad Reza;Rahmat, Mohd Fadli;Ghadimi, Ali Asghar;Mustafa, Mohd Wazir
    • Journal of Power Electronics
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    • v.15 no.4
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    • pp.1054-1065
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    • 2015
  • Multi-functional voltage source inverters (VSIs) have attracted increasing attention in recent years for their advantageous auxiliary services for power quality enhancement in autonomous microgrids. These types of VSIs can not only achieve a proper control scheme in autonomous mode but also cope with the prescribed power quality and stability requirements. These functionalities are integrated within the same device, thereby significantly improving the cost-effectiveness of microgrids while decreasing the investment and bulk compared with those of multiple devices with independent functionalities. Control strategies for power quality enhancement in autonomous microgrids using multi-functional VSIs are comprehensively reviewed in this paper. In addition, such VSIs are discussed in detail, and comparisons of which are also provided. Lastly, a number of future research directions for multi-functional VSIs are recommended.

Flexible Energy-storage Devices: Maneuvers and Intermediate Towards Multi-functional Composites

  • Son, Ji Myeong;Oh, Il Kwon
    • Composites Research
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    • v.31 no.6
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    • pp.355-364
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    • 2018
  • Flexible energy-storage devices (FESDs) have been studied and developed extensively over the last few years because of demands in various fields. Since electrochemical performance and mechanical flexibility must be taken into account together, different framework from composition of conventional energy-storage devices (ESDs) is required. Numerous types of electrodes have been proposed to implement the FESDs. Herein, we review the works related to the FESDs so far and focus on free-standing electrodes and, especially substrate-based ones. The way to utilize carbon woven fabric (CF) or carbon cloth (CC) as flexible substrates is quite simple and intuitive. However, it is meaningful in the point of that the framework exploiting CF or CC can be extended to other applications resulting in multifunctional composites. Therefore, summary, which is on utilization of carbon-based material and conductive substrate containing CF and CC for ESDs, turns out to be helpful for other researchers to have crude concepts to get into energy-storage multi-functional composite. Moreover, polymer electrolytes are briefly explored as well because safety is one of the most important issues in FESDs and the electrolyte part mainly includes difficult obstacles to overcome. Lastly, we suggest some points that need to be further improved and studied for FESDs.

Rotary CVD Process for Surface Treatment of Powders (분말소재의 표면처리를 위한 회전형 CVD 공정)

  • Jong-Hwan Lee;Goo-Hwan Jeong
    • Journal of the Korean institute of surface engineering
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    • v.56 no.6
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    • pp.341-352
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    • 2023
  • This paper reviews the potentials of a rotary chemical vapor deposition (RCVD) process for nanomaterial synthesis and coating on powder-based materials. The rotary reactor offers a significant improvement over traditional CVD methods having horizontal and fixed reaction chambers. The RCVD system yields enhanced productivity and surface coating uniformity of nanoparticles applied in various purposes, such as efficient heat dissipation, surface hardness enhancement, and enhanced energy storage performances. The effectiveness of the RCVD system would open up new possibilities in various applications because uniform coating on powder-based materials with massive productivity is inevitable to develop multi-functional materials with high reliability.

Transparent and Flexible All-Organic Multi-Functional Sensing Devices Based on Field-effect Transistor Structure

  • Trung, Tran Quang;Tien, Nguyen Thanh;Seol, Young-Gug;Lee, Nae-Eung
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.491-491
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    • 2011
  • Transparent and flexible electronic devices that are light-weight, unbreakable, low power consumption, optically transparent, and mechanical flexible possibly have great potential in new applications of digital gadgets. Potential applications include transparent displays, heads-up display, sensor, and artificial skin. Recent reports on transparent and flexible field-effect transistors (tf-FETs) have focused on improving mechanical properties, optical transmittance, and performances. Most of tf-FET devices were fabricated with transparent oxide semiconductors which mechanical flexibility is limited. And, there have been no reports of transparent and flexible all-organic tf-FETs fabricated with organic semiconductor channel, gate dielectric, gate electrode, source/drain electrode, and encapsulation for sensor applications. We present the first demonstration of transparent, flexible all-organic sensor based on multifunctional organic FETs with organic semiconductor channel, gate dielectric, and electrodes having a capability of sensing infrared (IR) radiation and mechanical strain. The key component of our device design is to integrate the poly(vinylidene fluoride-triflouroethylene) (P(VDF-TrFE) co-polymer directly into transparent and flexible OFETs as a multi-functional dielectric layer, which has both piezoelectric and pyroelectric properties. The P(VDF-TrFE) co-polumer gate dielectric has a high sensitivity to the wavelength regime over 800 nm. In particular, wavelength variations of P(VDF-TrFE) molecules coincide with wavelength range of IR radiation from human body (7000 nm ~14000 nm) so that the devices are highly sensitive with IR radiation of human body. Devices were examined by measuring IR light response at different powers. After that, we continued to measure IR response under various bending radius. AC (alternating current) gate biasing method was used to separate the response of direct pyroelectric gate dielectric and other electrical parameters such as mobility, capacitance, and contact resistance. Experiment results demonstrate that the tf-OTFT with high sensitivity to IR radiation can be applied for IR sensors.

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An Implementation of Single Stack Multi-threading for Small Embedded Systems

  • Kim, Yong-Seok
    • Journal of the Korea Society of Computer and Information
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    • v.21 no.4
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    • pp.1-8
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    • 2016
  • In small embedded systems including IoT devices, memory size is very small and it is important to reduce memory amount for execution of application programs. For multi-threaded applications, stack may consume a large amount of memory because each thread has its own stack of sufficiently large size for worst case. This paper presents an implementation of single stack multi-threading, called SSThread (Single Stack Thread), by sharing a stack for all threads to reduce stack memory size. By using SSThread, multi-threaded applications can be programmed based on normal C language environment and there is no requirement of transporting multi-threading operating systems. It consists of several library functions and various C macro definitions. Even though some functional restrictions in comparison to operating systems supporting complete multi-thread functionalities, it is very useful for small embedded systems with tiny memory size and it is simple to setup programming environment for multi-thread applications.

Technical Trend of Fusion Semiconductor Devices Composed of Silicon and Compound Materials (실리콘-화합물 융합 반도체 소자 기술동향)

  • Lee, S.H.;Chang, S.J.;Lim, J.W.;Baek, Y.S.
    • Electronics and Telecommunications Trends
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    • v.32 no.6
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    • pp.8-16
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    • 2017
  • In this paper, we review studies attempting to triumph over the limitation of Si-based semiconductor technologies through a heterogeneous integration of high mobility compound semiconductors on a Si substrate, and the co-integration of electronic and/or optical devices. Many studies have been conducted on the heterogeneous integration of various materials to overcome the Si semiconductor performance and obtain multi-purpose functional devices. On the other hand, many research groups have invented device fusion technologies of electrical and optical devices on a Si substrate. They have co-integrated Si-based CMOS and InGaAs-based optical devices, and Ge-based electrical and optical devices. In addition, chip and wafer bonding techniques through TSV and TOV have been introduced for the co-integration of electrical and optical devices. Such intensive studies will continue to overcome the device-scaling limitation and short-channel effects of a MOS transistor that Si devices have faced using a heterogeneous integration of Si and a high mobility compound semiconductor on the same chip and/or wafer.

New Material and Processing Issues for High Quality Parts by Micro-MIM

  • Rota, A.;Imgrund, Ph.;Haack, J.;Petzoldt, F.
    • Proceedings of the Korean Powder Metallurgy Institute Conference
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    • 2006.09a
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    • pp.34-35
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    • 2006
  • The development of Micro MIM as a new manufacturing process for metallic micro parts made of advanced functional materials has been the subject of considerable research over the last years. This paper addresses important quality aspects on processing of new materials by Micro-MIM. Three examples of new functional materials that can be processed are reviewed in this paper. The first example is two-component-Micro-MIM to obtain multi-functional devices. A micro positioning encoder consisting of a magnetic / non-magnetic material combination is presented. The second issue is series production of the replicate of the smallest human bone in the ear (stapes) from Titanium as an example of medical application. Quality assurance and reproducibility in terms of injection moulding parameters are addressed. In the third part, first results on the processing of the shape memory alloy NiTi by Micro-MIM are presented. Potential applications include biocompatible devices and transportation, for example automotive and aerospace. Processing routes and initial microstructures obtained are discussed.

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