• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.217-217
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• 2008

$BaTiO_3$는 perovskite 구조를 가지는 대표적인 강유전체 재료로서 MLCC (Multi Layer Ceramic Capacitor), PTC thermistor 등에 널리 사용되어지고 있으며, 그 특성을 향상시키기 위하여 많은 연구가 진행되고 있다. 현제 $BaTiO_3$ 분말 제조의 대표적인 합성법으로는 하소와 분쇄공정이 없는 수열합성법이 대표적이나, 나노 사이즈로 제작시 $BaTiO_3$는 마이크로 크기와 달리 입방정상으로 우세한 상태로 존재한다. 이는 제조과정 중의 hydroxyl defect의 영향과 나노 분말의 표면에너지 증가 때문이라고 보고된다. 따라서 본 연구는 이러한 문제점을 해결하기 위해 일반적인 세라믹 제조 방법인 고상반응법을 이용한 나노 사이즈의 $BaTiO_3$ 제조를 위한 최적의 공정 조건을 확립하기 위하여 본 연구를 진행하였다. 조성은 $BaTiO_3$와 반응온도를 낮추기 위한 anatase의 $TiO_2$를 사용하였고, $BaCO_3/TiO_2$ 의 조성비 (1. 1.01, 1.02, 1.03)를 제어하여 혼합한 후, 24h ball-mill 하여 하소 온도 ($860^{\circ}C{\sim}1000^{\circ}C$) 변화에 따른 입자 사이즈와 입도 분포를 측정하였다. 제조된 $BaTiO_3$분말의 결정 구조 분석을 위하여 XRD (X-ray diffraction) 분석을 수행 하였는데, 분석 결과로부터 제조된 분말들이 정방정 (tetragonal)의 perovskite구조를 갖고 있음을 확인하였다. 또한 분말의 미세구조 확인을 위하여 SEM (scanning electron microscope) 관찰을 수행하였는데, 나노 사이즈의 구형 분말을 얻을 수 있음을 확인할 수 있었다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.158-161
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• 2003

Recently, the evolution in production techniques (e.g. high-speed milling), the complex shapes involved in modem production design, and the ever increasing pressure for higher productivity demand a drastic improvement of the dynamic behavior of the machine tool axes used in production machinery. And also machine tools of multi functional and minimized parts are increasingly required as demand of higher accurate in some fields such as electronic and optical components etc. The accuracy and the productivity of machined parts are natural to depend on the linear system of machine tools. The complex workpiece surfaces encountered in present-day products and generated by CAD systems are to be transformed into tool paths for machine tools. The more complex these tool paths and the higher the speed requirements, the higher the acceleration requirements are needed to the machine tool axes and the motion control system, and the more difficult it is to meet the requirements. The traditional indirect drive design for high speed machine tools, which consists of a rotary motor with a ball-screw transmission to the slide, is limited in speed, acceleration, and accuracy. The direct drive design of machine tool axes. which is based on linear motors and which recently appeared on the market. is a viable candidate to meet the ever increasing demands, because of these advantages such as no backlash, less friction, no mechanical limitations on acceleration and velocity and mechanical simplicity. Therefore performance tests were carried out to machine tool axes based on linear motor. Especially, dynamic characteristics were investigated through circular test.

• 한국조경학회지
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• 제14권2호
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• pp.43-68
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• 1986

It is necessary that children's actual activities in the playgrounds should be analyzed for the study on the children's playgrounds. The purpose of this study is to establish the design principles for the improvement of the children\`s playgrounds in apartment complex by means of the various methods ; behavior mapping, questionaires and photo simulations. For the purpose of data collection, children are divided into three groups-infants(0 to 4 years), young children(pre ; 5 to 8 years, post ; 9 to 11 years), teenagers(7.2 to 14 years). The study results are as follows; 1) Analysis of behavior mapping : (a) Approximately 70 percent of the children observed stayed in the playground less than 20 minutes. (b) Playing time for each play apparatus was less than 5 minutes. (c) As a result of the observation, the duration time in the attic was 1 hour or more (d) The swing was the most frequently used apparatus as children's first and last choice. (e) Most of the users were young children(46.5%). 2) Analysis of questionaires : (a) Children considered that the existing playgrounds were lack of shadows and the play apparatuses are not interesting. (b) They felt danger and crowding at the multi-used wooden apparatus. 3) Suggestions for the playground design : It is necessary that the playgrounds are divided into the infants, the young children's and the teenagers'playground. (a) The infants'playground needs about 50 square meters and needs to be located in the apartment court. (b) The young children's playground needs about 330 to 660 square meters and needs to be located adjacent to the pedestrian road. (c) The teenagers'playground needs about 660 to 1000 square meters, which is needed for various ball games.

• 한국표면공학회지
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• 제38권3호
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• pp.95-99
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• 2005

Quaternary Ti-Cr-Si-N coatings were synthesized onto steel substrates (SKD 11) using a hybrid method of arc ion plating (AIP) and sputtering techniques. For the Syntheses of Ti-Cr-Si-N coatings, the Ti-Cr-N coating process was performed substantially by a multi-cathodic AIP technique rising Cr and Ti targets, and Si was added by sputtering Si target during Ti-Cr-N deposition. In this work, comparative studies on microstructure and evaluation of mechanical properties between Ti-Cr-N and Ti-Cr-Si-N coatings were conducted. As the Si was incorporated into Ti-Cr-N coatings, the Ti-Cr-Si-N coatings showed largely increased hardness value of approximately 42 GPa than one of 28 GPa for Ti-Cr-N coatings. The average friction coefficient of Ti-Cr-N coatings largely decreased from 0.7 to 0.35 with increasing Si content up to 20 at. $\%$. In addition, wear behavior of Ti-Cr-N coatings against steel ball was much improved with Si addition due to the surface smoothening effect and tribe-chemical reaction.

• 반도체디스플레이기술학회지
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• 제17권4호
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• pp.42-45
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• 2018

As The semiconductor decrease from 10 nanometer to 7 nanometer, It is suggested that "More than Moore" is needed to follow Moore's Law, which has been a guide for the semiconductor industry. Fan-Out Wafer Level Package(FOWLP) is considered as the key to "More than Moore" to lead the next generation in semiconductors, and the reasons are as follows. the fan-out WLP does not require a substrate, unlike conventional wire bonding and flip-chip bonding packages. As a result, the thickness of the package reduces, and the interconnection becomes shorter. It is easy to increase the number of I / Os and apply it to the multi-layered 3D package. However, FOWLP has many issues that need to be resolved in order for mass production to become feasible. One of the most critical problem is the warpage problem in a process. Due to the nature of the FOWLP structure, the RDL is wired to multiple layers. The warpage problem arises when a new RDL layer is created. It occurs because the solder ball reflow process is exposed to high temperatures for long periods of time, which may cause cracks inside the package. For this reason, we have studied warpage in the FOWLP structure using commercial simulation software through the implementation of the reflow process. Simulation was performed to reproduce the experiment of products of molding compound company. Young's modulus and poisson's ratio were found to be influenced by the order of influence of the factors affecting the distortion. We confirmed that the lower young's modulus and poisson's ratio, the lower warpage.

• Tribology and Lubricants
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• 제31권3호
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• pp.95-101
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• 2015

Carbon nanotubes (CNTs) are widely used in polymer composites as filler materials to enhance various characteristics of the composites because of their remarkable mechanical, electrical, and thermal properties. In this study, we investigate the effects of MWCNTs on the electrical and wear characteristics of high-impact polystyrene (HIPS) composites, and compare the results with the effects of carbon black (CB). The HIPS composites are classified as Bare-HIPS, MWCNT-HIPS composites containing 2, 3, 4, and 5 wt% MWCNTs, and CB-HIPS containing 17 wt% CB. Electrical characteristics are evaluated by measuring the surface resistance using a 4-point probe. Wear characteristics are evaluated using the reciprocating wear test, and a chrome steel ball with a curvature of 6.3 mm is used as the counterpart. The results show that the addition of MWCNTs or CB can improve the electrical and wear characteristics of HIPS composites. In the case of MWCNT-HIPS composites, surface resistance, friction coefficient, and specific wear rate decrease as the concentrations of MWCNTs increase. Moreover, the addition of MWCNTs is more effective in improving the electrical and wear characteristics of HIPS composites compared to the addition of CB. To fabricate the HIPS composite with appropriate electrical and wear characteristics, more than 4 wt% MWCNTs is added to HIPS.

• 한국응급구조학회지
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• 제9권2호
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• pp.147-168
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• 2005

It examined the doubt point which AED motive relates until now, the AED should have bought a life how, present address of our country site pre-hospital care, comparison it tried to observe the advanced nation instance back. Gist of this research the AED important cold region once compared to informed to how many cardiac arrest patient, against him the what kind of preparation wanted informing the necessary cold region. It soaks simultaneously but the AED motive is widely supplied distant in future and it is generality and it is feeble but it wanted doing one morning. The habit difference of an American who does of course meat diet mainly and a Korean is many and it compares in the United States and the cardiac arrest patient comparison occurs holds a point few. To become Western anger but and be caused by with thin dietary life, stanching bleeding cung, with the fact that the heart attack is increasing rapidly with the hyperextension. It is a talk which anyone it knows all. The major league most Choi huy Sub in condition will catch the ball which floats and the multi co-player and to collide when falling down, the medical device which is committed with emergency aid is AED motive. From the United States subway station and the shopping which are a public place on the baseball field outside the jar which it will drive, the museum and the school, easily there is it will be able to discover the AED from the court of justice back. The Pittsburg university the students per the individual $30 the core phyey were receiving the smallness lifestyle alcoholic beverage and a AED motive actual training with mercy of degree. From the United States distant in future the AED motive is sold even from the retail store and. From our country like this plan government offices temporary disposal education from from 119 fire fighters emergency structure company in fire fighting government employee and nursing must magnify a former enterprise rainy spell in summer multi temporary disposal education with the head which it will burn with the head. This plan in early rising will be able to become fixed in Korea it forecasts with the fact that. The research which it sees it leads and like the United States to some day become fixed even from our country to believe and suspicion it is not and in the people in approach ease one AED supply plan fire fighting government employees stand in the first and feed with the fact that must be positive at this enterprise they become.

• 한국음향학회지
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• 제42권6호
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• pp.565-571
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• 2023

사후확인제 도입으로 현장에서의 바닥충격음 성능 측정이 의무화되고, 평가 방법이 변경되었다. 제도 변화에 따른 바닥충격음 성능 변화를 추적하기 위해서는 변경된 평가방법에 따라 중량충격음 특성이 어떻게 나타나는지에 대한 연구가 필요하다. 본 연구에서는 평면과 바닥구조가 동일한 하나의 아파트 건물에 위치한 59세대를 대상으로 충격원 및 평가지표에 따라 단일수치평가량을 결정하는 주파수 대역의 기여율을 분석하였다. 단일수치평가량에 따른 주파수대역별 기여도 산출방법이 상이하여 단순 비교는 어려우나, 사후확인제 도입 이전 평가방법(뱅머신 측정 및 L'_i,Fmax,AW으로 평가)에서는 63 Hz가 미치는 기여율은 평균 80.8 %로 나타났으며, 125 Hz가 미치는 기여율은 평균 19.2 %으로 나타났다. 현행 평가방법(고무공 측정 및 L'_iA,Fmax으로 평가) 에서는 기여율은 50 Hz ~ 80 Hz에서 평균 33.1 %, 100 Hz ~ 160 Hz에서 평균 58.7 %, 200 Hz ~ 315 Hz에서 평균 6.9 %, 400 Hz ~ 630 Hz에서 평균 1.3 %으로, 63 Hz 대역의 기여도가 낮아진 것으로 나타났다. 이 결과는 대상 공동주택에 대한 사례 분석 내용으로, 더 다양한 공동주택에 대한 측정 데이터를 분석할 필요가 있다.

• 아시안잔디학회지
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• 제20권1호
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• pp.11-23
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• 2006

본 연구는 골프 코스 관리자가 관리 방법에 따른 그린 스피드를 쉽게 예측할 수 있는 정보를 제공하기 위해 롤링, 이슬제거, 그리고 롤링+이슬 제거를 각각 1회 작업 후 깎기 높이의 변화($4.0{\sim}2.5mm$)와 시간 경과($0{\sim}8hr$)에 따른 4가지 유형의 그린스피드 예측 모형을 통한 빠른 그린 관리 방법을 제시하고자 수행하였다. 공 구름 거리 측정 값은 레이크사이드 컨트리 클럽 동코스 연습용 퍼팅 그린[(Creeping bentgrass (Agrosis palustris Huds. 'Penncross')]에서 2001년 10월 18일과 2002년 5월 25일에 하였다. 자료는 SPSS for window Rel. 10.0(SPSS Inc, 2000) 통계 패키지를 이용하여 다중 회귀 분석하였다. 4가지 유형의 그린스피드 예측 모형중, 빠른 그린 관리 방법의 기준을 설명해 줄 수 있는 회귀식은 식4[($Y_4=4.171-0.225{\cdot}X_1-0.038{\cdot}X_2$(여기서 $Y_4$ : 1회 이슬 제거+1회 롤링시 그린 스피드(m), $X_1$ : 깎기 높이($4.0{\sim}2.5mm,\;X_2$) : 시간 경과($0{\sim}8hr$)]이었다. 이 식은 1회 이슬 제거(스펀지 롤러) $\rightarrow$ 3.0mm 이하의 깎기 높이(21인치 11날 보행식 그린모아, 토너먼트 밑날 장착) $\rightarrow$ 1회 롤링(경량 롤러)의 관리 작업을 할 경우 라운드 종료까지도 3.2m이상의 빠른 그린을 얻을 수 있는 것을 예측하였다. 따라서 이런 관리 시스템은 공식 골프 대회를 위한 빠른 그린의 관리의 기준이 될 것으로 기대되어 진다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.