• Title/Summary/Keyword: Moulding Temperature

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회전기계의 고온환경에서의 원격계측

  • 김치엽;최만용;허석한
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1992.10a
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    • pp.158-160
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    • 1992
  • To control internal temperature distribution of moulding machine is very important in molding products such as Polycabonate. Nylon and PVDF. In this experiment, we developed temperature measurement system in order to control temperature of moulding machine. It was measured by telemetering system because of rotational mechanism. Form experimental results, it was sufficient to apply to moulding machine under 250 .deg C.

The Effect of Mass Transfer on the Cure Properties of the Urea Resin Moulding Compounds Under the Drying Process (건조 공정 중 요소 수지 성형재료의 경화 특성에 대한 물질전달 효과)

  • Kim, Sang Yeul;Choi, Il Gon;Kim, Byoung Chul
    • Korean Chemical Engineering Research
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    • v.40 no.6
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    • pp.681-686
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    • 2002
  • In the industrial field, the theory of drying process is different from the practical application, and it is effective to reduce energy by recirculation of the heat of exhausting gas. But the study of this field may not be performed still. The cure properties of the urea resin moulding compounds was investigated according to drying temperature, drying time, recycle rate of exhausting gas and moulding temperature in the process of drying and moulding. We obtained the following results; water content of material decreases with increasing drying time and drying temperature, and the rate of drying also decreases with increasing recycle rate of exhausting gas. Specially, The cure fluidity of the urea resin moulding compounds decreases, with increasing drying temperature, recycle rate of exhausting gas and moulding temperature. And the correlation equations on water content and cure fluidity of the urea resin moulding material were obtained through a regression analysis of experimental data.

Effect of Residual Carbon on the Microstructure Evolution during the Sintering of M2 HSS Parts Shaping by Metal Injection Moulding Process

  • Herranz, G.;Levenfeld, B.;Varez, A.
    • Proceedings of the Korean Powder Metallurgy Institute Conference
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    • 2006.09a
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    • pp.225-226
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    • 2006
  • In this present investigation, Metal Injection Moulding (MIM) of M2 High Speed Steel (HSS) parts using a wax-High Density Polyethylene (HDPE) binder is shown. The elimination of organic binder was carried out by thermal debinding under inert atmosphere. In order to keep carbon in the sample that could improve the sintering process, incomplete debinding was performed between 450 and $600^{\circ}C$. The specimens were sintered at temperatures between 1210 and $1280^{\circ}C$ in high vacuum atmosphere, obtaining the 98% of the theoretical density. In the samples with higher residual carbon content, the sintering window was extended up to 20 degrees and the optimum temperature was lower.

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Comprehensive Wear Study on Powder Metallurgical Steels for the Plastics Industry, Especially Injection Moulding Machines

  • Gornik, Christian;Perko, Jochen
    • Proceedings of the Korean Powder Metallurgy Institute Conference
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    • 2006.09a
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    • pp.399-400
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    • 2006
  • M390 microclean(R) of $B{\ddot{o}}hler$ Edelstahl is a powder metallurgical plastic mould steel with a high level of corrosion and wear resistance and therefore often used in the plastics processing industry. But as a consequence of rapidly advancing developments in the plastics processing industry the required level of wear resistance of tool steels in this field is constantly rising. For that reason a new PM tool steel with higher hardness values and an increased amount of primary carbides has been developed to improve the resistance against abrasive and adhesive wear. The wear resistance of both steels against adhesive situations for components of the plastification unit of injection moulding machines has been tested with a novel method. In case of processing polyolefins with an injection moulding machine it was found that there is adhesive wear between the check-ring and the flights of the screw tip of the non-return valve under certain circumstances. The temperature in that region was measured with an infrared temperature sensor. The existence of significant peaks of that signal was used as an indicator for an adhesive wear situation.

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A Study on the Design of Cooling Channels of Injection Mould to Manufacture a Flat Part with a Partly Thick Volume (부분적으로 후육부를 가지는 평판형 제품의 제작을 위한 사출성형 금형의 냉각채널 설계에 관한 연구)

  • Ahn, Dong-Gyu;Park, Min-Woo;Kim, Hyung-Soo
    • Journal of the Korean Society for Precision Engineering
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    • v.29 no.8
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    • pp.824-833
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    • 2012
  • The shrinkage and the warpage of the moulded part are influenced by the design of the product and injection mould. In a flat part with a partly thick volume, the warpage of the flat part is created from the difference of the shrinkage between thin and thick regions. The warpage of the flat part with a partly thick volume can be reduced by a proper design of the cooling system in the injection mould. The goal of this paper is to design properly cooling channels of injection mould to manufacture a flat part with a partly thick volume. The conformal cooling channel is adopted to improve cooling characteristics of a region with the thick volume. The linear cooling channels are assigned to the other region. The proper design of the conformal cooling channels is obtained from three-dimensional injection molding analysis for various design alternatives. The moulding characteristics of the designed mould with both conformal and linear cooling channels are compared to those of the mould with linear cooling channels from viewpoints of temperature, shrinkage and warpage of the moulded part using numerical analysis. Injection mould with both conformal and linear cooling channels for the flat part with a partially thick volume is fabricated. In addition, injection moulding experiments are performed using the fabricated mould. From the results of the injection moulding experiments, it has been shown that the designed mould can successfully fabricate the flat part with a partially thick volume.

Microstructural Morphology of Molded Thin Composites of Thermotropic Liquid Crystalline Polymer and Polyamide 6 (서모트로픽 액정폴리머와 폴리아미드6으로 성형된 얇은 복합재료의 미세구조형태)

  • Choe, Nak-Sam;Choe, Gi-Yeong;Ha, Seong-Gyu
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.24 no.7 s.178
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    • pp.1703-1711
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    • 2000
  • Microstructural morphology of molded composites of thermotropic liquid crystalline polymer(LCP) and polyamide 6 (PA6) has been studied as a function of epoxy fraction. Injection-moulding of a thin composite plaque at a temperature below the melting point of the LCP fibrils by suing the extruded LCP/PA6 pellets produced multi-layered structures: 1) the surface skin layer with thickness of 65-120 ym exhibiting a transverse orientation, 2) the sub-skin layer with an orientation perpendicular to the surface skin, i.e. in the flow direction, 3) the core layer with arc-curved flow patterns. Similar microstructural orientations were observed in the respective layers for the composite plaques with different fractions of epoxy.

Process optimization for the steam injection molding (스팀사출성형에 의한 공정의 최적화)

  • Moon, Yonng-dae
    • Design & Manufacturing
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    • v.9 no.2
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    • pp.10-15
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    • 2015
  • The water has been the suitable for the cooling medium until now. But the water as cooling medium seem to have the limit for high speed injection. The steam plastic molding injection use the steam as the medium when raise the mold temperature. The weld line has been the major quality problems in a plastic injection parts to be difficult to be solved. These problems in injection-molded plastic parts are difficult to find the reason because these issues are usually in tradeoff realtions with each other. The purpose of this paper is to obtain the optimum injection moulding condition for improving the quality of plastic injection parts and to inquire the productivity improvement with the measured cycle time by steam plastic moluding injection. Based on these numerical results, the guidelines of mould design and injection processing condition were established. As a result, the improvement of quality and the reduction of cycle time was achieved.

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Influence of Binders on the Structure and Properties of High Speed-steel HS6-5-2 Type Fabricated Using Pressureless Forming and PIM Methods

  • Matula, G.;Dobrzanski, L.A.;Kloc, A.;Herranz, G.;Varez, A.;Levenfeld, B.;Torralba, J.M.
    • Proceedings of the Korean Powder Metallurgy Institute Conference
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    • 2006.09a
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    • pp.589-590
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    • 2006
  • Based on the comparison of structures and properties of the HS6-5-2 high speed steels made with the powder injection moulding method, pressureless forming, compacting and sintering, and commercial steels made with the ASEA-STORA method, fine carbides spread evenly in the steel matrix were found in the structure of all tested high-speed steels in the sintered state. The steels made with the pressureless forming method are characteristic of the lowest sintering temperature and the highest density, resulting from the high carbon concentration coming from the binding agent degradation.

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초음파 Spectroscopy에 의한 Resin내의 크기 측정에 관한 연구

  • 한응교;김용재;이범성;박익근;소반신부
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2001.10a
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    • pp.139-143
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    • 2001
  • In manufacturing process of semiconductor package, thermal stress owing to high temperature in moulding and bubbles generated in chip bonding process become main causes to producing void. Therefore, on this study we evaluated quantitatively void size by ultrasonic spectroscopy method which analyze the frequency of this received pulse using pulses with broad band frequency, and after destructive test we verified effectiveness of sizing void by ultrasonic spectroscopy as we find error degree between the real size of void and the sizing void by ultrasonic spectroscopy.

Sizing of lnner Flaw in Resin by using Ultrasonic spectroscopy (초음파 분량법에 의한 레진 내부 결합의 크기 측정에 관한 연구)

  • Han, E.K.;Kim, Y.J.;Park, I.G.
    • Journal of the Korean Society for Precision Engineering
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    • v.10 no.3
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    • pp.182-190
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    • 1993
  • In manufacturing process of semiconductor package, the thermal stress owing to high temperature in moulding and the bubbles generated in chip bonding process become main causes to produce void. On this study we evaluated quantitatively void size by use of ultrasonic spectroscopy method which analyze the reflective pulses with broad band frequency in frequency domain, and after destructive testing we verified effectiv- eness of sizing void by use of ultasonic spectroscopy.

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