• Journal of Applied Reliability
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• 제17권3호
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• pp.207-212
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• 2017

Purpose: This article provides an efficient cushion molding method for improving reliability of the rotation driving system. Method: Allowable stress level for cushion is calculated by using physical characteristics of the rotation driving system. In addition, various test units are manufactured and used to conduct the rebound resilience, the burst pressure and the alternating load test. Results: Actual allowable stress level and test results of the rebound resilience, the burst pressure and the alternating load test are provided. Conclusion: The cushion manufactured by the compression molding method gives more preferable characteristics for improving the reliability of the rotation driving system.

• Electrical & Electronic Materials
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• 제9권1호
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• pp.18-23
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• 1996

The molding pressure is also one of the important parameters in the preparation of HTSC materials by the solid state reaction method. In the present study, changes in structural, electrical and microstructural proper-ties with the molding pressure in YiB $a_{2}$C $u_{3}$ $O_{70{\delta}}$ superconductors have been performed. The investigated molding pressures were 0.5*10$^{3}$ N/c $m^{2}$, 1*10$^{3}$ N/c $m^{2}$, 2*10$^{3}$ n/c $m^{2}$ and 4*10$^{3}$ N/c $m^{2}$. As the molding pressure increased, the anisotropy of the crystal structure decreased and the grains have been grown preferentially in a c-axis direction. Since the size of the grain becomes larger with the decrease of the porosity, denser textures are formed. The results indicated that the critical current density is improved resulting from the enhanced densification due to higher molding pressure. When the molding pressure was between 1*10$^{3}$ N/c $m^{2}$ and 2*10$^{3}$ N/c $m^{2}$, while it did not affect the oxygen deficiency and Tc, the increase of the molding pressure affects remarkably on grain size and densification of the $Y_{1}$B $a_{2}$C $u_{3}$ $O_{7-{\delta}}$. When the molding pressure is larger than 2*10$^{3}$ N/c $m^{2}$, electrical proper-ties are independent on the molding pressure..

• Proceedings of the Korean Society of Precision Engineering Conference
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• 한국정밀공학회 1995년도 추계학술대회 논문집
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• pp.85-88
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• 1995

Recently, the micro mold maching techining technology is developed by means of the mechanical and high energy beam process. It is possible to make the micro structure mold with high aspect ratio by the LIGA technology. This mode is used for mass production of plastic parts by the micro injection molding method. In this study, we intend to research on the basic technology of micro injection molding. As the result, we developed the injection molding technology for small column plastic parts which diameter is 500 .mu. m and 200 .mu. m respectively with wbout aspect ratio 20.

• Transactions of Materials Processing
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• 제13권2호
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• pp.180-187
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• 2004

A computer code was developed to simulate the filling stage of the injection/compression molding process by a finite element method. The constitutive equation used here was the compressible Leonov model. The PVT relationship was assumed to follow the Tait equation. The flow-induced birefringence was related to the calculated flow stresses through the linear stress-optical law. Simulations of a disk part under different process conditions including the variation of compression stroke and compression speed were carried out to understand their effects on birefringence variation. The simulated results were also compared with those by conventional injection molding.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 한국정밀공학회 2004년도 추계학술대회 논문집
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• pp.543-547
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• 2004

The molding characteristics of large-sized orthogonal stiffened plastic plates were investigated in the present study. Models with the geometry of 1800$\times$600$\times$12mm and 1200$\times$600$\times$12mm were designed for injection molding(IM) and injection-compression molding(ICM), respectively. To determine a mold system and reduce the warpage of the presented model after molding process, IM and ICM analyses using MOLDFLOW$^{TM}$ were performed. Also, the experiments were performed to verify the suggested mold system. It was shown that the change of molding method could significant effect on the warpage of designed model.l.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 한국소성가공학회 2002년도 금형가공 심포지엄
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• pp.253-259
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• 2002

Micro cell structures with high aspect ratio were fabricated by injection molding method. The mold inserts had dimension $1.9cm\times8.3cm$ composed of a lot of micro posts and were fabricated by LIGA process. The size of the micro posts was $157{\mu}m\times157{\mu}m\times500{\mu}m$ and the gaps between two adjacent posts were $50{\mu}m$. Using Polymethylmethacrylate (PMMA) injection molding was performed. The key experimental variables were temperature, pressure, and time. By controlling these, good shaped mim cell structures with $50{\mu}m$ in wall thickness and $500{\mu}m$ in depth were obtained. In order to understand micro molding mechanism, shape changes of molded PMMA were studied with experimental variables. And the durability of mold insert was investigated, too. The results show that the most important factor in molding processes was the mold temperature that is closely related to the filling of the melt into the micro cavity. And the holding time before cooling showed a great effect on the quality of molded PMMA.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 한국소성가공학회 2008년도 춘계학술대회 논문집
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• pp.513-516
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• 2008

We have replicated nanopillar arrays using injection molding process of active heating and cooling method by several peltier devices. The injection melding has a high accuracy ed good reproducibility that are essential for mass production at low cost. Conventional molding processes widely use the water-based mold heating and air cooling methods. However, in case of replication for nano-patterned structures, it caused several defects such as air-flow mark, non-fill, sticking and tearing. In this study, periodic nano-scale patterns are replicated by using injection molding with Peltier devices. Porous nano-scale patterns, which have pore diameter range from 120nm to 150nm, were fabricated by using anodizing process. Periodic nano-pore structures ( $20mm\;{\times}\;20mm$) were used as a mold stamp of injection molding. Finally, PMMA with nanopillar arrays was obtained by injection molding process. By using the Peltier devices, the temperature of locally adiabatic molds can be dramatically controlled and the quality of the molded patterns can be slightly improved.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 한국소성가공학회 2007년도 춘계학술대회 논문집
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• pp.183-186
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• 2007

The injection molding process has high accuracy and good reproducibility that are essential for mass production at low cost. Conventional molding processes typically use the water-based mold heating and air cooling methods. However, in the nano injection molding processes, this semi-active mold temperature control results in the several defects such as air-flow mark, non-fill, sticking and tearing, etc. Therefore, in order to control temperature of the molds actively and improve the quality of the molded products, the novel nano injection molding system, which uses active heating and cooling method, has been introduced. By using the Peltier devices, the temperature of locally adiabatic molds can be controlled dramatically and the quality of the molded patterns can be improved.

• Transactions of Materials Processing
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• 제15권1호
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• pp.76-81
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• 2006

In this study, warpage characteristics of mobile phone cover through injection molding process were investigated using design of experiments in injection molding process. Warpage in plastic injection molding has a significant effect on quality of product. Effects of injection time, packing pressure, packing time, mold temperature and melt temperature on the warpage of mobile phone cover were considered by numerical analysis and experiment with Taguchi method. The degree of warpage for the injection molded part was measured by using three dimensional coordinate measurement machine. It was shown that temperature control factor has more significant effect on the warpage of mobile phone cover than pressure control factor.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.416-417
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• 2007

MmSH injection molding method to fabricate light guiding plate with nano-sized pattern was developed. A stamper was fabricated through photolithography, dry etching, and electroplating processes. While the stamper with nano-sized pattern in mold was kept at $180^{\circ}C$ during injection process, that was cooled down to $90^{\circ}C$ quickly after the injection process. The nano-sized pattern on light guiding plate processed by MmSH injection molding method was well transferred from stamper compared to that processed by conventional injection molding process.