• 제목/요약/키워드: Molding Method

검색결과 890건 처리시간 0.035초

성형 압력변화에 따른 고온초전도체 $Y_1Ba_2Cu_3O_7-\delta$ (Structural and electrical property studies dependent on the molding pressure in high-Tc superconductor $Y_1Ba_2Cu_3O_7-\delta$)

  • 김채옥;박정수;이교운
    • E2M - 전기 전자와 첨단 소재
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    • 제9권1호
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    • pp.18-23
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    • 1996
  • The molding pressure is also one of the important parameters in the preparation of HTSC materials by the solid state reaction method. In the present study, changes in structural, electrical and microstructural proper-ties with the molding pressure in YiB $a_{2}$C $u_{3}$ $O_{70{\delta}}$ superconductors have been performed. The investigated molding pressures were 0.5*10$^{3}$ N/c $m^{2}$, 1*10$^{3}$ N/c $m^{2}$, 2*10$^{3}$ n/c $m^{2}$ and 4*10$^{3}$ N/c $m^{2}$. As the molding pressure increased, the anisotropy of the crystal structure decreased and the grains have been grown preferentially in a c-axis direction. Since the size of the grain becomes larger with the decrease of the porosity, denser textures are formed. The results indicated that the critical current density is improved resulting from the enhanced densification due to higher molding pressure. When the molding pressure was between 1*10$^{3}$ N/c $m^{2}$ and 2*10$^{3}$ N/c $m^{2}$, while it did not affect the oxygen deficiency and Tc, the increase of the molding pressure affects remarkably on grain size and densification of the $Y_{1}$B $a_{2}$C $u_{3}$ $O_{7-{\delta}}$. When the molding pressure is larger than 2*10$^{3}$ N/c $m^{2}$, electrical proper-ties are independent on the molding pressure..

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미소 원주의 사출 성형 실험 (Injection Molding Experiments for Small Diameter Column)

  • 제태진;이응숙;김재구
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1995년도 추계학술대회 논문집
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    • pp.85-88
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    • 1995
  • Recently, the micro mold maching techining technology is developed by means of the mechanical and high energy beam process. It is possible to make the micro structure mold with high aspect ratio by the LIGA technology. This mode is used for mass production of plastic parts by the micro injection molding method. In this study, we intend to research on the basic technology of micro injection molding. As the result, we developed the injection molding technology for small column plastic parts which diameter is 500 .mu. m and 200 .mu. m respectively with wbout aspect ratio 20.

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사출압축성형 공정에 대한 유한요소 해석 (Finite Element Analysis of Injection/Compression Molding Process)

  • 이호상
    • 소성∙가공
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    • 제13권2호
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    • pp.180-187
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    • 2004
  • A computer code was developed to simulate the filling stage of the injection/compression molding process by a finite element method. The constitutive equation used here was the compressible Leonov model. The PVT relationship was assumed to follow the Tait equation. The flow-induced birefringence was related to the calculated flow stresses through the linear stress-optical law. Simulations of a disk part under different process conditions including the variation of compression stroke and compression speed were carried out to understand their effects on birefringence variation. The simulated results were also compared with those by conventional injection molding.

대형 직교 보강 플라스틱 평판의 성형특성에 관한 연구 (A Study of Molding Characteristic for Large-Sized Orthogonal Stiffened Plastic Plate)

  • 이성희;김백진
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2004년도 추계학술대회 논문집
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    • pp.543-547
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    • 2004
  • The molding characteristics of large-sized orthogonal stiffened plastic plates were investigated in the present study. Models with the geometry of 1800$\times$600$\times$12mm and 1200$\times$600$\times$12mm were designed for injection molding(IM) and injection-compression molding(ICM), respectively. To determine a mold system and reduce the warpage of the presented model after molding process, IM and ICM analyses using MOLDFLOW$^{TM}$ were performed. Also, the experiments were performed to verify the suggested mold system. It was shown that the change of molding method could significant effect on the warpage of designed model.l.

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인젝션 몰딩 기술을 이용한 마이크로 구조물 성형 (Micro Structure Fabrication Using Injection Molding Method)

  • 제태진;신보성;정석원;조진우;박순섭
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2002년도 금형가공 심포지엄
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    • pp.253-259
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    • 2002
  • Micro cell structures with high aspect ratio were fabricated by injection molding method. The mold inserts had dimension $1.9cm\times8.3cm$ composed of a lot of micro posts and were fabricated by LIGA process. The size of the micro posts was $157{\mu}m\times157{\mu}m\times500{\mu}m$ and the gaps between two adjacent posts were $50{\mu}m$. Using Polymethylmethacrylate (PMMA) injection molding was performed. The key experimental variables were temperature, pressure, and time. By controlling these, good shaped mim cell structures with $50{\mu}m$ in wall thickness and $500{\mu}m$ in depth were obtained. In order to understand micro molding mechanism, shape changes of molded PMMA were studied with experimental variables. And the durability of mold insert was investigated, too. The results show that the most important factor in molding processes was the mold temperature that is closely related to the filling of the melt into the micro cavity. And the holding time before cooling showed a great effect on the quality of molded PMMA.

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펠티어 소자를 이용한 다공성 나노패턴의 사출에 대한 연구 (Injection molding using porous nano-scale patterned master with Pettier devices)

  • 홍남표;권종태;신홍규;서영호;김병희
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2008년도 춘계학술대회 논문집
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    • pp.513-516
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    • 2008
  • We have replicated nanopillar arrays using injection molding process of active heating and cooling method by several peltier devices. The injection melding has a high accuracy ed good reproducibility that are essential for mass production at low cost. Conventional molding processes widely use the water-based mold heating and air cooling methods. However, in case of replication for nano-patterned structures, it caused several defects such as air-flow mark, non-fill, sticking and tearing. In this study, periodic nano-scale patterns are replicated by using injection molding with Peltier devices. Porous nano-scale patterns, which have pore diameter range from 120nm to 150nm, were fabricated by using anodizing process. Periodic nano-pore structures ( $20mm\;{\times}\;20mm$) were used as a mold stamp of injection molding. Finally, PMMA with nanopillar arrays was obtained by injection molding process. By using the Peltier devices, the temperature of locally adiabatic molds can be dramatically controlled and the quality of the molded patterns can be slightly improved.

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펠티어 소자를 이용한 사출 금형의 온도제어 (Active Control of Injection Mold Temperature using the Peltier Device)

  • 조창연;신홍규;박동영;홍남표;김병희
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2007년도 춘계학술대회 논문집
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    • pp.183-186
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    • 2007
  • The injection molding process has high accuracy and good reproducibility that are essential for mass production at low cost. Conventional molding processes typically use the water-based mold heating and air cooling methods. However, in the nano injection molding processes, this semi-active mold temperature control results in the several defects such as air-flow mark, non-fill, sticking and tearing, etc. Therefore, in order to control temperature of the molds actively and improve the quality of the molded products, the novel nano injection molding system, which uses active heating and cooling method, has been introduced. By using the Peltier devices, the temperature of locally adiabatic molds can be controlled dramatically and the quality of the molded patterns can be improved.

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모바일폰 커버의 휨특성 평가를 위한 사출 성형에 관한 연구 (A Study on Plastic Injection Molding for Warpage Characteristics Evaluation of Mobile Phone Cover)

  • 김옥래;김무연;이성희;권창오
    • 소성∙가공
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    • 제15권1호
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    • pp.76-81
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    • 2006
  • In this study, warpage characteristics of mobile phone cover through injection molding process were investigated using design of experiments in injection molding process. Warpage in plastic injection molding has a significant effect on quality of product. Effects of injection time, packing pressure, packing time, mold temperature and melt temperature on the warpage of mobile phone cover were considered by numerical analysis and experiment with Taguchi method. The degree of warpage for the injection molded part was measured by using three dimensional coordinate measurement machine. It was shown that temperature control factor has more significant effect on the warpage of mobile phone cover than pressure control factor.

MmSH 사출성형법을 이용한 도광판용 나노패턴 형성기술 개발 (Technology to Form Nano-sized Pattern on Light Guiding Plate Using MmSH Injection Molding Method)

  • 이병욱;이종하;이태성;이근우;김동학;김영균;홍진수;정재훈;김창교
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2007년도 추계학술대회 논문집
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    • pp.416-417
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    • 2007
  • MmSH injection molding method to fabricate light guiding plate with nano-sized pattern was developed. A stamper was fabricated through photolithography, dry etching, and electroplating processes. While the stamper with nano-sized pattern in mold was kept at $180^{\circ}C$ during injection process, that was cooled down to $90^{\circ}C$ quickly after the injection process. The nano-sized pattern on light guiding plate processed by MmSH injection molding method was well transferred from stamper compared to that processed by conventional injection molding process.

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항복응력과 미끄럼현상을 고려한 분말사출성형 충전공정의 유한요소해석 (Finite Element Analysis of Powder Injection Molding Filling Process Including Yield Stress and Slip Phenomena)

  • 박주배;권태헌
    • 대한기계학회논문집
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    • 제17권6호
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    • pp.1465-1477
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    • 1993
  • 본 연구에서는 분말혼합체의 특성인 항복응력을 포함한 Generalized Newtonian Fluid의 구성 방정식을 도입하고 미끄럼현상을 고려한 신소재의 사출성형 충전과정 해석용 CAE(computer aided engineering)시스템을 개발하였다. 수치모사를 위한 수치해석방법으로는, 유한요소법(finite element method)과 유한차분법(finite difference method)을 함께 사용하였다. 유한요소법과 검사체적법(control volume technique) 을 병용하여 유동의 진행을 수치모사 하였으며, 유한차분법을 사용하여 온도분포를 계산하였다.