• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.4
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• pp.1999-2004
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• 2011

This research aims to develop polymer composites which can be used for PEMFC bipolar plate by injection molding process. Considering the moldability and stiffness, we used LCP(Liquid crystal polymer) as base resin. In order to improve electrical conductivity and mechanical properties, we chose carbon black, and both synthetic graphite and expanded graphite. The composites with different recipe are prepared for injection molding of PEMFC bipolar plate and CAE(Computer Aided Engineering) analysis was performed to predict melt flow and fiber orientation We did successfully fabricate the ASTM specimens by injection molding, and measure the electrical conductivity of the samples by using four point probe device. We measured mechanical properties such as flexural strength, flexural modulus and Izod impact strength. Conclusively, the electrical conductivity increased with increasing additive concentration, but both flexural strength and Izod impact strength decreased due to the brittle nature of carbon-based additives.

• Textile Coloration and Finishing
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• v.35 no.3
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• pp.159-168
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• 2023

Polyolefin elastomer (POE) is widely used in a variety of applications, particularly in the manufacture of composites, due to its excellent mechanical properties, chemical resistance, and flexibility. However, POE has a high processing temperature, which causes damage to the fiber during the manufacturing process when impregnating the fiber. Therefore, ethylene vinylacetate (EVA), which has a low melting point and excellent adhesion properties, is blended with POE to reduce the processing temperature, and POE-g-MAH (Polyolefin elastomer-grafted-maleic anhydride) is used as a compatibilizer to further improve the POE/EVA blend properties. The compatibility of POE/EVA blends is observed by SEM, and the interaction between each polymer is confirmed by DSC and FT-IR. In addition, the effect of adding the compatibilizer is analyzed through mechanical properties such as tensile strength and elongation. The optimal content of compatibilizer for POE/EVA blends considering physical properties and moldability is sought, and 20 phr is determined to be the most appropriate.

• Journal of the Korean Chemical Society
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• v.40 no.1
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• pp.81-86
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• 1996

The physical properties of epoxy molding compound (EMC) according to the change of softening point of epoxy resin have been investigated in order to study the relationship between the properties of o-cresol novolac epoxy resin, which is main component of EMC for semiconductor encapsulation, and EMC. The softening points of used epoxy resin are 65.1 $^{\circ}C$, 72.2 $^{\circ}C$, and 83.0 $^{\circ}C$, respectively. The flexural strength and flexural modulus as mechanical properties were measured, and thermal expansion coefficient, thermal conductivity and glass transition temperature (Tg) as thermal properties, and spiral flow as moldability have been investigated to see the change of physical properties of EMC. The flexural modulus, thermal expansion coefficients in the glass state (${\alpha}_1$), and thermal conductivity of EMC were found to be keep constant value irrespective of the change of softening point, but Tg increased with softening point of epoxy resin, and the spiral flow decreased with that. It can be considered that these phenomena are due to the increase of crosslinking density of EMC according to the increase of softening point. The transition points were found out in the thermal expansion coefficient data in the rubbery state (${\alpha}_2$) and the flexural strength data. These can show the decrease of filler dispersion according to increase of epoxy resin viscosity.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.9 no.6
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• pp.1726-1732
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• 2008

Injection molding is one of plastic forming technology which can easily mass-produce plastic parts with various and even complex shape. The technology has lots of difficulties in making a good part due to phase change of material, high applied pressure, and fast melt flow speed in the cavity. To overcome the problems, they had to make trial and error method until the CAE(Computer Aided Engineering) could be a tool for concurrent engineering. In this paper, we investigate the optimal design for a plastic DVD tray part by systematic approach of the commercial CAE program. In design, we should consider two objectives which are both dimensional stability and cost-down. The dimension of the part is crucial because the tray should carry a DVD correctly, but the part is too thin to injection-mold easily. In order to improve the moldability, the mold is designed in the form of stack mold which is a kind of 4 hot runner system. In first, we changed the stack-mold system with one hot-runner to cost down, and decided the optimal position of the gate. After that, we investigate the effect of both the layout of cooling channels and the cooling temperature on the shrinkage of the DVD tray. A optimal simulation approach, the gate design is 2Gate#3 and the layout is Case2 cooling line as the optimal temperature of $70^{\circ}C$. The Moldflow and PC+ABS are used for the CAE program and material respectively.