• Title/Summary/Keyword: Module technology

Search Result 3,549, Processing Time 0.029 seconds

Hardware Implementation of HEVC CABAC Binarizer

  • Pham, Duyen Hai;Moon, Jeonhak;Lee, Seongsoo
    • Journal of IKEEE
    • /
    • v.18 no.3
    • /
    • pp.356-361
    • /
    • 2014
  • This paper proposes hardware architecture of HEVC (high efficiency video coding) CABAC (context-based adaptive binary arithmetic coding) binarizer. The proposed binarizer was designed and implemented as an independent module that can be integrated into HEVC CABAC encoder. It generates each bin string of each syntax element in a single cycle. It consists of controller module, TU (truncated unary binarization) module, TR (truncated Rice binarization) module, FL (fixed length binarization) module, EGK (k-th order exp-Golomb coding) module, CALR (coeff_abs_level_remaining) module, QP Delta (cu_qp_delta_abs) module, Intra Pred (intra_chroma_pred_mode) module, Inter Pred (inter_pred_idc) module, and Part Mode (part_mode) module. The proposed binarizer was designed in Verilog HDL, and it was implemented in 45 nm technology. Its operating speed, gate count, and power consumption are 200 MHz, 1,678 gates, and 50 uW, respectively.

Diagnosis Method of PV Module Mismatch using Voltage and Current Waveforms (태양광 모듈의 전압 및 전류 파형을 이용한 부정합 진단 기법)

  • Ahn, Hee-Wook;Park, Gi-Yob
    • Journal of the Korean Solar Energy Society
    • /
    • v.31 no.3
    • /
    • pp.17-22
    • /
    • 2011
  • Techniques for mismatch loss minimization to increase the PV system efficiency are under development recently. In this paper, a method to make diagnosis of PV module mismatch is presented, which uses a concept of operating point factor. The method is based on the fact that the ratio of the incremental conductance of a PV module to instantaneous conductance is 1 when the module is operating at its maximum power point. The variations of module voltage and current are taking place by the maximum power point tracker in the power conditioning units of PV system. The effectiveness of the method is verified through an application to a real PV system.

A Development of Wet-based Virtual Press (웹 기반의 가상 프레스 개발)

  • 정완진;장동영;이학림;최석우;나경환
    • Proceedings of the Korean Society for Technology of Plasticity Conference
    • /
    • 2002.05a
    • /
    • pp.121-124
    • /
    • 2002
  • This paper resents a virtual forming system to simulate deep drawing process for stress-strain information by utilizing virtual system designed using Virtual Reality Modeling Language (VRML) and computer aided analysis (CAE) tool. The CAE tool to calculate stress, strain, and deformation is designed using Finite Element Method. Stress distributions and deformation profiles as well as the operation of forming machine can be simulated and visualized in the web. The developed system consists of three modules, input module, virtual forming machine module, and output module. The input nodule was designed using HTML and ASP. The input data for FEM calculation is directed to the forming machine module for calculation. The results from the forming machine module can be visualized through output module as well as the forming process simulation.

  • PDF

Fabrication of Switch Module for ATM Exchange System using MCM Technology (멀티칩 기술을 이용한 ATM 교환기용 Switch 모듈 제작)

  • Ju, Cheol-Won;Kim, Chang-Hun;Han, Byeong-Seong
    • The Transactions of the Korean Institute of Electrical Engineers C
    • /
    • v.49 no.8
    • /
    • pp.433-437
    • /
    • 2000
  • We fabricated switch module of ATM(Asynchronous Transfer Mode) exchange system with MCM-C(MultiChip Module Co-fired) technology and measured its electrical characteristics. Green tape was used as substrate and Au/Ag paste was used to form the interconnect layers. The via holes were made by drill and filled with metal paste usign screen method. After manufacturing the substrate, chips and passive components were assembled on the substrate. In electrical test, the module showed the output signal of 46.9MHz synchronized with input signal. In the view of substrate size reduction, the area of MCM switch module was 35% of conventional hybrid switch module.

  • PDF

Intelligent Diagnostic System of Photovoltaic Connection Module for Fire Prevention (화재 예방을 위한 태양광 접속반의 지능형 진단 시스템)

  • Ahn, Jae Hyun;Yang, Oh
    • Journal of the Semiconductor & Display Technology
    • /
    • v.20 no.3
    • /
    • pp.161-166
    • /
    • 2021
  • To prevent accidents caused by changes in the surrounding environment or other factors, various protection facilities are installed at the photovoltaic connection module. The main causes of fire are sparks due to foreign substances inside the photovoltaic connection module through high temperature rise and dew condensation in the photovoltaic connection module, and fire due to heat from the power diode. The proposed method can predict the fire by measuring flame, carbon dioxide, carbon monoxide, temperature, humidity, input voltage, and current on the photovoltaic connection module, and when the fire conditions are reached, fire alarm and power off can be sent to managers and users in real time to prevent fire in advance.

A Study on Correlation Peel Strength and the Efficiency of Shingled Modules According to Curing Condition of Electrically Conductive Adhesives (슁글드 모듈에서 경화조건에 따른 ECA 접합강도와 효율의 상관관계에 관한 연구)

  • Jun, Dayeong;Son, Hyoungin;Moon, Jiyeon;Cho, Seonghyeon;Kim, Sung hyun
    • Current Photovoltaic Research
    • /
    • v.9 no.2
    • /
    • pp.31-35
    • /
    • 2021
  • Shingled module shows high ratio active area per total area due to more efficient packing without inactive space between cells. The module is fabricated by connecting the pre-cut cells into the string using electrically conductive adhesives (ECA). ECAs are used for electric and structural connections to fabricate the shingled modules. In this work, we investigated a correlation between ECA peel strength and the efficiency of pre-cut 5 cells module which are fabricated according to ECA interconnection conditions. The curing conditions are varied to determine whether ECA interconnection properties can affect module properties. As a result of the peel test, the highest peel strength was 1.27 N/mm in the condition of 170℃, the lowest peel strength was 0.89 N/mm in the condition of 130℃. The efficiency was almost constant regardless of the curing conditions at an average of 20%. However, the standard deviation of the fill factor increased as the adhesive strength decreased.

Development of mechanistic cladding rupture model for severe accident analysis and application in PHEBUS FPT3 experiment

  • Gao, Pengcheng;Zhang, Bin;Li, Jishen;Shan, Jianqiang
    • Nuclear Engineering and Technology
    • /
    • v.54 no.1
    • /
    • pp.138-151
    • /
    • 2022
  • Cladding ballooning and rupture are the important phenomena at the early stage of a severe accident. Most severe accident analysis codes determine the cladding rupture based on simple parameter models. In this paper, a FRTMB module was developed using the thermal-mechanical model to analyze the fuel mechanical behavior. The purpose is to judge the cladding rupture with the severe accident analysis code. The FRTMB module was integrated into the self-developed severe accident analysis code ISAA to simulate the PHEBUS FPT3 experiment. The predicted rupture time and temperature of the cladding were basically consistent with the measured values, which verified the correctness and effectiveness of the FRTMB module. The results showed that the rising of gas pressure in the fuel rod and high temperature led to cladding ballooning. Consequently, the cladding hoop strain exceeded the strain limit, and the cladding burst. The developed FRTMB module can be applied not only to rod-type fuel, but also to plate-type fuel and other types of reactor fuel rods. Moreover, the FRTMB module can improve the channel blockage model of ISAA code and make contributions to analyzing the effect of clad ballooning on transient and subsequent parts of core degradation.

A study on the EDOF(Extended depth of field) camera module performance optimization (EDOF 카메라 모듈의 성능 최적화에 대한 연구)

  • Choi, Kyung-Hoon;Kim, Young-Gil
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
    • /
    • 2011.05a
    • /
    • pp.313-315
    • /
    • 2011
  • Smart phone camera module are mounted on the focus are 2 types depending on the behavior. AF (Auto focus) camera module and the FF (Fixed focus) camera module two are different types. AF camera module to move the location of the lens and is a way to automatically focus, FF camera module lens position of the focus is the way to a fixed state. EDOF camera module the location of the lens as a frozen state EDOF AF module using the algorithm to focus on applied technology is a module. In this paper, optimization EDOF camera module implementation of the resolution.

  • PDF

A Study on the Security Module for Data Integrity of Mobile Client (모바일 클라이언트의 데이터 무결성 보장을 위한 보안모듈에 관한 연구)

  • Joo, Hae-Jong;Hong, Bong-Hwa
    • The Journal of Information Technology
    • /
    • v.10 no.3
    • /
    • pp.77-92
    • /
    • 2007
  • This study aims to suggest an implementation methodology of security module for data integrity of mobile internet terminal. This is based on the WTLS(Wileless Transport Layer Security) of WAP Protocol. This security module is expected to achieve central role in conversion of wireless internet environment and emphasis of encryption technology and safe and calculable wireless communication environment construction.

  • PDF

A Bluetooth/WiFi Dual-Mode RF Front-End Module Using LTCC Technology (LTCC 기술을 이용한 Bluetooth/WiFi 이중 모드 무선 전단부 모듈 구현)

  • Ham, Beom-Cheol;Ryu, Jong-In;Kim, Jun-Chul;Kim, Dong-Su;Park, Young-Cheol
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
    • /
    • v.23 no.8
    • /
    • pp.958-966
    • /
    • 2012
  • This paper presents a compact bluetooth/WiFi dual-mode dual-band RF front-end module(FEM) is realized by low temperature co-fired ceramic(LTCC) technology. The proposed RF front-end module consists of a diplexer, baluns in the LTCC substrate, and an SPDT switch, an SP3T switch on the LTCC substrate. In order to reduce the module size and increase integration level, the proposed diplexer and balun are designed using LC lumped elements. The parasitic elements caused by coupling effect between metal pattern layers and ground plane layer are considered during the design. The fabricated dual-mode RF front-end module has 13 pattern layers including three inner ground layers and it occupies less than $3.0mm{\times}3.7mm{\times}0.66mm$.