• 한국정보통신학회논문지
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• 제3권3호
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• pp.671-679
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• 1999

본 논문에서는 습도를 세어하기 위해 습도센서를 사용하여 습도를 측정 제습 입력값과 비례 제어를 위해 범용 $\mu$-processorPIC16C54와 Thermoelectric module을 사용하여 구현하였다. Pottier Module 모델에 따라 크기와 특성이 다양하고 Module의 종류에 따라 그에 따른 적절한 열저항을 유지할 수 있도록 하는 방열판 선택 또한 매우 중요한 설계 요소이다. 열전소자를 사용하여 전자제습기를 구현함으로써 국부공간의 무소음, 무진동, 저에너지 소모에 의한 효과적인 제습을 할 수 있음을 확인할 수 있었다.

• 한국전산구조공학회:학술대회논문집
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• 한국전산구조공학회 1999년도 가을 학술발표회 논문집
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• pp.378-386
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• 1999

The integrated system for the structural analysis of space frame is made up 4 modules ; pre-process module, structural analysis module, optimum member design module and post-process module. Re-process module of these 4 modules involves data input module and structure modeling module. This study is to develope an efficient modeling program as a basic for development of pre-process module. This modeling program generates geometric information of space frame and performs the input fie form for structure analysis only by input general data. User can mode1 space frame efficiently within shut time by using this program.

• 한국전자파학회논문지
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• 제22권3호
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• pp.389-398
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• 2011

본 논문에서는 Ka 대역 위상 배열 레이더용 송수신(T/R: Transmit/Receive) 모듈의 설계 및 제작을 보였다. Ka 대역 송수신 모듈 구성 시 Ka 대역의 특수성을 고려하여 5비트(bit) 위상천이기와 5 비트 30 dB 디지털 가변감쇠기를 송수신 공통으로 사용하였으며, 서큘레이터는 T/R 모듈 외부에 부착되는 형태로 구성하였다. 단위 안테나 당 송신 출력은 1 W 이상 잡음 지수는 8 dB 미만으로 설정하였으며, 설계된 T/R 모듈의 RF부의 크기는 $5\;mm{\times}4\;mm{\times}57\;mm$로 소형화를 달성하였다. 설계된 T/R 모듈을 구현하기 위하여 T/R 모듈에 소요되는 개별 MMIC 검증 후 단위 T/R 모듈을 검증하는 방법을 사용하였다. 제작된 T/R 모듈은 설계 시 예측한 바와 같이 단위 T/R 모듈의 입력 5 dBm에서 출력 30 dBm 이상을 보였으며, 수신부는 잡음 지수 8 dB 미만, 이득 20 dB 이상을 얻었다.

• 한국유체기계학회 논문집
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• 제12권3호
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• pp.31-37
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• 2009

This paper presents a implantable intrathecal drug infusion pump for pain control in cancer patients. This device consists of micropump module, drug reservoir module and control module. The micropump module using cam-follower mechanism composed of small-sized four cams and four followers. Each followers is driven by a cam and liquid is discharged by a sequential reciprocal motion of the followers. The advantage of this structure is that it allows the pump to be clean and valveless. The drug reservoir module composed of drug chamber, gas chamber and diaphragm. The control module composed of battery, wireless communication unit and controller. To design a small-sized, low power pump some analysis were performed to determine the design parameters. To verify the feasibility of the experiment, a prototype was manufactured and its operating characteristics were investigated. Experimental results were in accordance with the expected results obtained from analysis.

• 한국전자통신학회논문지
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• 제10권10호
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• pp.1079-1086
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• 2015

본 논문은 안전 무결성 레벨이 4(: Safety Integrity Level 4)인 안전 관련 시스템에 적합한 출력 모듈의 구조를 설계하였고, 설계된 출력 모듈에 요구되는 정량적 목표치의 수준을 제시하였다. 특히 다양한 출력 방식 중에서 릴레이 출력 신호와 아날로그 신호로 구성된 출력 모듈이 안전 기능을 수행하는 시스템의 구성 요소인 경우를 적용하였다. 분석 방법은 FMEA(: Failure Modes and Effect Analysis), FTA(: Fault Tree Analysis) 방식을 이용하였다. 그 결과로 철도 응용 규격인 IEC 62425의 요구사항을 준수하는 SIL4 안전 관련 시스템의 출력 모듈의 구조와 고장빈도인 정량적 목표치를 제시하였다.

• 한국위성정보통신학회논문지
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• 제10권3호
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• pp.114-120
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• 2015

본 논문에서는 우주발사체에 적용되는 비행종단시스템의 보안명령 입력을 위한 암호화 장치의 개념설계 결과와 개발 요구조건을 보였다. 암호화 장치는 명령신호를 생성하고 암호화하기 위한 명령생성장치와 암호화 명령신호를 연계장치에 입력하기 위한 명령입력장치로 구분하여 개발되도록 설계하였으며, 미국 NIST의 권고안과 한국인터넷진흥원(KISA)의 권고안을 참고하여 보안등급과 암호 알고리즘, 암호키 관리방안 등을 설정하였다. 암호화 장치는 AES-256 블록 암호화가 적용된 비밀키 알고리즘과 SHA-256의 해쉬 알고리즘을 적용하여 기밀성, 무결성, 가용성이 확보되도록 설계되었다. 설계된 암호화 장치는 우주발사체에 탑재되는 비행종단시스템의 보안명령 입력 용도로 활용되어 비행종단명령의 보안성과 비행종단시스템의 신뢰성 향상에 기여할 것으로 판단된다.

• ETRI Journal
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• 제28권1호
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• pp.9-16
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• 2006

In this paper, we analyzed and measured the electrical crosstalk characteristics of a 1.25 Gbps triplexer module for Ethernet passive optical networks to realize fiber-tothe-home services. Electrical crosstalk characteristic of the 1.25 Gbps optical triplexer module on a resistive silicon substrate should be more serious than on a dielectric substrate. Consequently, using the finite element method, we analyze the electrical crosstalk phenomena and propose a silicon substrate structure with a dummy ground line that is the simplest low-crosstalk layout configuration in the 1.25 Gbps optical triplexer module. The triplexer module consists of a laser diode as a transmitter, a digital photodetector as a digital data receiver, and an analog photodetector as a cable television signal receiver. According to IEEE 802.3ah and ITU-T G.983.3, the digital receiver and analog receiver sensitivities have to meet -24 dBm at $BER=10^{-12}$ and -7.7 dBm at 44 dB SNR. The electrical crosstalk levels have to maintain less than -86 dB from DC to 3 GHz. From analysis and measurement results, the proposed silicon substrate structure that contains the dummy line with $100\;{\mu}m$ space from the signal lines and 4 mm separations among the devices satisfies the electrical crosstalk level compared to a simple structure. This proposed structure can be easily implemented with design convenience and greatly reduce the silicon substrate size by about 50 %.

• 한국BIM학회 논문집
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• 제5권1호
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• pp.1-7
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• 2015

Modular technology has become a major issue of the construction industries to enhance their productivity. Modular bridge construction generally requires the data exchange between the contractors, designers, fabricators and constructors. Therefore, a readily accessible information model interface module based on BIM technology is essential for their communication during a project life-cycle. In this study, BIM based information model interface module for a modular pier was developed. For the information models, the PBS(Product Breakdown Structure) and LOD(Level of Development) were defined. Next, all components of a modular pier were conducted by the parametric modeling technique, and then 3D cell library interface was developed. An nterface module was also developed using VBA(Visua basic Application) for exchanging a data from 3D model library to other softwares such as Microstation, AutoCad and Excel and was connected with MS Access database. The developed information model interface module would improve the design quality of the modular pier and reduce the time and cost for design. Updated 3D information models could be utilized for the fabrication, assembly, and construction process for modular piers.

• 디지털산업정보학회논문지
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• 제9권1호
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• pp.103-110
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• 2013

WAVE system is a vehicle communication technology. The system provides the services to prevent vehicle accidents that might occur during driving. Also, it is used to provide various services such as monitoring vehicle management and system failure. In this paper, we divide module that manages WAVE MAC state into a WSMP base MLME module and IP base module and we design and implement a parameter environment between WME module to manage the state of the WAVE system and MLMEX module to mange IP base of WAVE MAC therefore the date to be processed.Also, in order to verify the validity, we have carried out experiments to compare the speed of data processing by dividing data of 5Mbyte, 10Mbyte, 20Mbyte into the packets of 2KByte and 4KByte. Therefore, in WAVE system, the Parameter environments and data processing speed between WME and MLMEX module can be utilized in the various service of vehicle communication technology depending on the speed of data processing.

• 한국통신학회논문지
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• 제39C권3호
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• pp.234-238
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• 2014

Multichip packaging was achieved the best solution to significantly reduce thermal resistance at the same time, to increase luminance intensity in LEDs packaging application. For the packaging, thermal spreading resistance is an important parameter to get influence the total thermal performance of LEDs. In this study, silicon-based multichip light emitting diodes (LEDs) packaged module has been examined for thermal characteristics in several parameters. Compared to the general conventional single LED packaged chip module, multichip LED packaged module has many advantages of low cost, low density, small size, and low thermal resistance. This analyzed module is comprised of multichip LED array, which consists of 32 LED packaged chips with supplement power of 0.2 W at every single chip. To realize the extent of thermal distribution, the computer-aided design model of 6.4 W Si-based multichip LED module was designed and was performed by the simulation basis of actual fabrication flow. The impact of thermal distribution is analyzed in alternative ways both optimizing numbers of fins and the thickness of that heatsink. In addition, a thermal resistance model was designed and derived from analytical theory. The optimum simulation results satisfies the expectations of the design goal and the measurement of IR camera results. tart after striking space key 2 times.