• Proceedings of the KIEE Conference
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• 1996.07b
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• pp.1063-1065
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• 1996

As PLC has become central to today's FA environment, the importance of developing and providing special-module of PLC such as Analog-module, PID-module, Temperature Control-module has increased. In this paper introduces the Temperature Control-module which is developed by LGIS R&D lab. and presents the availability of PLC-control system with Temperature Control-module.

• Proceedings of the KSME Conference
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• 2001.06d
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• pp.624-629
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• 2001

An experimental study was performed to investigate adiabatic wall temperature and heat transfer coefficient around on a module with longitudinal fin heat sink cooled by forced air flow. In the first method, inlet air flow(1-7m/s) and input power(3-5W) was varied after a heated module were placed on an adiabatic floor($320{\times}550{\times}1mm^{3}$). An adiabatic wall temperature was determinated to use liquid crystal film(LCF). In the second method to determinate heat transfer coefficient, inlet air flow(1-7m/s) and the heat flux of rubber heater($0.031-0.062\;W/cm^{2}$) was varied after an adiabatic module was placed on rubber heater covering up an adiabatic floor. In addition, surface oil-film visualization were performed to characterize the macroscopic flow-field around a module.

• Proceedings of the KSME Conference
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• 2002.08a
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• pp.729-732
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• 2002

This paper reports an experimental study around a module about forced air flow by blower($35{\times}35{\times}6mm^3$) in portable PC(10mm high, 200mm wide, and 235mm long). The channel inlet flow velocity has been varied between 0.26, 0.52 and 0.78m/s. The power input to the module is 4Wthis report, particular attention is directed to the fluid flow and adiabatic wall temperature($T_(ad)$) around a module which is under fluid mechanical and thermal influences of the module. The fluid flow around a module was visualized using PIV system. Liquid crystal thernography is used to determine the adiabatic wall temperature around a heated module on an acrylic board. Plots of $T_(ad)$ (or F) show marked effects of dispersion of thermal wake near the module.

• Journal of the Korea Institute of Military Science and Technology
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• v.4 no.1
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• pp.264-273
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• 2001

The conjugate heat transfer from a protruding module in a horizontal channel with a variation of air temperature is experimentally investigated. It is an aim of this study is to estimate temperature difference between a module and air. This study is performed with a variation of parameters that are air temperatures($T_i,=25^{\circ}C{\sim}55^{\circ}C),$ thermal resistance($R_c=158 K/W),$ air velocities ( 4V_i=0.1$ m/s~l.5 m/s ), and input power (Q=3 W, 7 W ). The results show that as the thermal resistance increases, the effect of air temperatures are decreased. And input power was most effective parameter on the temperature difference between a module and air.

• Proceedings of the KIEE Conference
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• 2002.07b
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• pp.1376-1378
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• 2002

Compare and examined Full Auto Line of PV module Manufacture Equipment and PV module Manufacture Equipment in the Korea. Full Auto Line has been constructed with Cell Selection. Tabbing & Stringing. Module Setting, Lamination, Curing and Module Testing, and Module Manufacture Line in the Korea has been constructed with Tabbing & Stringing. Module Setting, Lamination and Module Testing. Laminator's temperature Control is the most important Variable in Manufacture of PV module. Temperature Transformation of Center part of PV module is most high at Lamination, and Edge part is most low.

• Journal of the Korean Solar Energy Society
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• v.32 no.3
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• pp.11-18
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• 2012

To expect accurately the maximum power of solar cell module under various installation conditions, it is required to know the performance characteristics like temperature dependence. Today, the PV (photovoltaic) market in Korea has been growing. Also BIPV (building integrated photovoltaic) systems are diversified and become popular. But thermal dependence of PV module is little known to customers and system installers. In IEC 61215,a regulation for testing the crystalline silicon solar cell module, the testing method is specified for modules. However there is limitation for testing the module with diverse application examples. In extreme installation method, there is no air flow between rear side of module and ambient, and it can induce temperature increase. In this paper, we studied the roof type installation of PV module on the surface of one-axis tracker system. We measured temperature on every component of PV module and compared to open-rack structure. As a result, we provide the foundation that explains temperature characteristics and NOCT (nominal operation cell temperature) difference. The detail description will be specified as the following paper.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.26 no.9
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• pp.1267-1275
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• 2002

An experimental study was performed to investigate adiabatic wall temperature and heat transfer coefficient around a module cooled by forced air flow. The flow angle of attack to the module were 0$^{\circ}$and 45$^{\circ}$. In the first method, inlet air flow(1~7m/s) and input power.(3, 5, 7W) were varied after a heated module was placed on an adiabatic floor(320$\times$550$\times$1㎣). An adiabatic wall temperature was determinated to use liquid crystal film. In the second method to determinate heat transfer coefficient, inlet air flow(1~7m/s) and the heat flux of rubber heater(0.031~0.062W/$m^2$) were varied after an adiabatic module was placed on rubber heater covering up an adiabatic floor. Additional information is visualized by an oil-film method of the surface flow on the floor and the module. Plots of $T_{ad}$ and $h_{ad}$ show marked effects of flow development from the module and dispersion of thermal wake near the module. Certain key features of the data set obtained by this investigation may serve as a benchmark for thermal-design codes based on CFD.

• Journal of the Korea Institute of Military Science and Technology
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• v.5 no.2
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• pp.195-206
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• 2002

The conjugate heat transfer from the simulated module in a horizontal channel with the variation of inlet air temperature is experimentally investigated. The aim of this study is to estimate temperature difference between a module and inlet air. This study is performed with the variation of parameters that are inlet air temperature(Ti=25~$55^{\circ}C), thermal resistance( $R_c$=0.05, 4.11, 158 K/W), inlet air velocity(Vi=0.1~1.5m/s), and input power(Q=3, 7 W). The results show that the effect of inlet air temperature is little, at the case of using conductive board. And input power was most effective parameter on the temperature difference between module and Inlet air.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2009.10a
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• pp.55-58
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• 2009

Photovoltaic system that is overcoming the problem of fossil fuel, changes the output quantity rapidly according to the temperature of module. so, we studied this principle and considered the method making lower the temperature of module for maximization of electric power production. In this thesis, we concluded that, we fit on below and upper direction of the module to decrease at the same temperature. lower temperature of below direction is more useful for the generating quantity.

• Journal of Welding and Joining
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• v.31 no.5
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• pp.59-63
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• 2013

A bendable electronic module has been developed for a mobile application by using a low-cost roll-to-roll manufacturing process. In flexible embedded electronic module, a thin silicon chip was embedded in a polymer-based encapsulating adhesive between flexible copper clad polyimide layers. To confirm reliability and durability of prototype bendable module, the following tests were conducted: Moisture sensitivity level, thermal shock test, high temperature & high humidity storage test, and pressure cooker tester. Those experiments to induce failure of the module due to temperature variations and moisture are the experiment to verify the reliability. Failure criterion was 20% increase in bump resistance from the initial value. The mechanism of the increase of the bump resistance was analyzed by using non-destructive X-ray analysis and scanning acoustic microscopy. During the pressure cooker test (PCT), delamination occurred at the various interfaces of the bendable embedded modules. To investigate the failure mechanism, moisture diffusion analysis was conducted to the pressure cooker's test. The hygroscopic characteristics of the encapsulating polymeric materials were experimentally determined. Analysis results have shown moisture saturation process of flexible module under high temperature/high humidity and high atmosphere conditions. Based on these results, stress factor and failure mechanism/mode of bendable embedded electronic module were obtained.