• 한국정밀공학회지
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• 제21권11호
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• pp.38-45
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• 2004

This paper discusses the minimum cutting thickness with a continuous chip in sub-micrometer order precision diamond cutting. An ultra precision cutting model is proposed, in which the tool edge radius and the friction coefficient are the principal factors determining the minimum cutting thickness. The experimental results verify the proposed model and provide various supporting evidence. In order to reduce the minimum cutting thickness a vibration cutting method is applied, and the effects are investigated through a series of experiments under the same conditions as conventional cutting method.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2004년도 학술대회지
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• pp.717-722
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• 2004

A design was done, and all characteristic of photodetectr of the web pattern type which a standard process of the Bipolar which Si PIN structure was used in this paper, and was used for the current amplifier design was used, and high-speed, was used as receiving optcal area of high altitude, and the module which had a low dark current characteristic was implemented with one chip with a base. Important area decreases an area of Ie at the time of this in order to consider an electrical characteristic and economy than the existing receiving IC, and performance of a product and confidence are got done in incense. First of all, the receiving IC which a spec, pattern of a wafer to he satisfied with the following electrical optical characteristic that produced receiving IC of 5V and structure are determined, and did one-chip is made. On the other hand, the time when AR layer of double is $Si_{3}N_{4}/SiO_{2}=1500/1800$ has an optical reflectivity of less than $10{\%}$ on an incidence optical wavelength of 660 ,and, in case of photo detector which reverse voltage made with 1.8V runs in 1.65V, an error about a change of thickness is very the thickness that can be improved surely. And, as for the optical current characteristic, about 5 times increases had the optical current with 274nA in 55nA when Pc was -27dBm. A BJT process is used, and receiving IC running electricity suitable for low voltage and an optical characteristic in minimum 1.8V with a base with two phases is made with one chip. IC of low voltage operates in 1.8V and 3.0V at the same time, and optical link receiving IC is going to be implemented

• 마이크로전자및패키징학회지
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• 제22권1호
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• pp.75-81
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• 2015

본 논문에서는 2개의 패시브 소자가 임베디드된 PoP(Package on Package)용 양면 기판의 휨을 감소시키기 위해 유한요소법을 이용한 수치해석과 파라메타 설계를 위한 다구찌법이 사용되었다. 양면 회로층 두께와 솔더 레지스트 두께가 4인자 3수준으로 설계되어 파라메타 영향도가 분석되었다. 또한, 유닛 영역의 솔더 레지스트가 제거하거나 도포된 모델의 휨을 해석하여 솔더 레지스트의 영향도를 분석하였다. 마지막으로 실험을 통해 수치해석과 다구찌법에 의한 파라메타 설계의 효과를 입증하였다. 연구결과에 의하면 휨에 미치는 영향은 볼 사이드에 있는 회로층이 지배적으로 크고 칩 사이드의 회로층이 두 번째로 크며 솔더 레지스트의 영향이 가장 작았다. 또한, 칩 사이드 유닛영역의 솔더 레지스트는 도포 유무에 따른 영향도가 매우 작았다. 한편 기판의 휨은 볼 사이드 회로층의 두께가 얇을수록, 칩 사이드 회로층의 두께와 솔더 레지스트의 두께는 두꺼울수록 감소하였다.

• 한국공작기계학회논문집
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• 제17권1호
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• pp.59-64
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• 2008

Micro machining can manufacture complex shapes with high accuracy. Especially, this enables wide application of micro technology in various fields. For example, micro channels allow fluid transfer, which is a widely used technology. Therefore, liquidity research of flow in micro channels and micro channel manufacturing with use of various materials and cutting conditions has very important meaning. In this study, to find out correlation between fluid velocity in micro channels and surface roughness, we manufactured micro channels using micro end-mill and dropped ethanol into micro channels. We compared several surface roughness and fluid velocity in micro channels that were created by various processing conditions. Finally, we found out relationship between fluid velocity and surface roughness in micro channels of different materials.

• 한국산학기술학회논문지
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• 제16권7호
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• pp.5021-5028
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• 2015

탄성포장재에 대한 기존의 연구는 포장재의 투수성, 공법적용에 관한 접근이 많아 탄성포장재의 기초적인 성능연구보다 실용화에 초점을 맞춘 연구가 많았다. 본 연구에서는 경제적인 차원에서 필요한 탄성조건과 투수성 등을 만족하면서 콘크리트나 아스팔트로 포장된 장소에서 기존 하층 노면에 대한 재시공 없이 자원낭비나 환경오염이 발생하지 않도록 두께가 얇은 탄성포장재의 시공 가능성에 대하여 두께가 다른 5종류(10, 13, 15, 20, 25mm)의 시험편과 고무 칩과 바인더의 혼합비가 다른 3개(20, 22.5, 25%)의 시험편을 가지고 다양한 시험을 실시하고 기본적인 물성을 파악하였다. 결과적으로 정성적인 관점에서 탄성바닥재의 두께를 품질조건에 따라 최소한(10~25mm)으로 할 수 있는 여지가 있으며, 바닥재가 온도에 민감하여 내구성증진에 대한 대안도 필요하다고 판단된다.

• Journal of Biosystems Engineering
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• 제30권3호
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• pp.161-165
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• 2005

In this study, peeling test of the Altari radish on kimchi pre-processing system for mechanization was performed with the longitudinal plane peeling type with wider cutting blade than that of the peeled chip's. To determine the optimum cutter shape to match this plane peeling type, the peeling tests depending on variable cutting speed, rake angle and blade angle using the blade with thickness as 2 m and width as 50mm were performed, and the patterns of the peeled chips and peeling resistances were investigated. As the result of the tests, the rake angle of the blade with clean peeled surface of the Altari radish was over $45^{\circ}$, and the blade angle and rake angle with the minimum peeling resistance was $20^{\circ}\;and\;60^{\circ}$, respectively. The optimum peeling conditions were; the peeling speed 0.2m/s, blade angle $20^{\circ}$ and the rake angle $60^{\circ}$, and the peeling resistance of each blade was 15 N.