• Title/Summary/Keyword: Micro-machine tool

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Stability Analysis According to Material Alteration on Micro Stage for Micro Cutting Machine (재질 변화에 따른 초정밀가공기용 마이크로 스테이지의 안정성 해석)

  • 김재열;곽이구;김항우
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.12 no.3
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    • pp.52-57
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    • 2003
  • In this paper, stability of ultra precision cutting unit is analyzed and this unit is the kernel unit in ultra precision processing machine. According to alteration of shape and material about hinge, stability investigation is performed Through this stability investigation, trial and error is reduced in design and manufacture, at the same time, we are accumulated foundation data for unit control.

Stability Analysis according to Material Alteration on Micro Stage for Micro Cutting Machine (재질 변화에 따른 초정밀가공기용 마이크로 스테이지의 안정성 해석)

  • 김재열;곽이구;김항우;안재신;김영석;김기태
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2002.10a
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    • pp.198-202
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    • 2002
  • In this paper, stability of ultra precisio unit is analyzed, this unit is the kernel unit precision processing machine. According alteration of shape and material about stability investigation is performed. Through this stability investigation, trial is reduced in design and manufacture, at the time, we are accumulated foundation data for control.

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Micro-hole Machining Technology for using Micro-tool (마이크로 공구를 이용한 미세구멍가공기술)

  • Heo, N.H.;Lee, S.W.;Choi, H.Z.
    • Proceedings of the KSME Conference
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    • 2003.11a
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    • pp.1787-1792
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    • 2003
  • Recently with the development of semiconductor technology, the miniaturization of parts and products as well as their high precision is required. In addition, as the national competitiveness is increasingly affected by the development of the micro parts through micro machining technology, the study of the micro machining technology is being conducted in many countries. The goal of this study is to fabricate micro tools under the size of $20{\mu}m$ and to machine micro holes using them. The fabrication is done by grinding and the application of ELID to the grinding wheel. The surface roughness of the micro tools is measured to evaluate the study.

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Machining of Micro Structure using Elliptical Vibration Grooving Machine (타원궤적 진동절삭 가공기를 이용한 미세 형상 가공)

  • Kim, Gi-Dae;Loh, Byoung-Gook
    • Journal of the Korean Society for Precision Engineering
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    • v.25 no.11
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    • pp.45-51
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    • 2008
  • Successive micro-scale V-grooves and a grid of pyramids were machined by elliptical vibration tufting (EVC) to investigate feasibility of using EVC as an alternative method of creating micro-molds to photo-lithography and electroforming, which have been commonly employed. An elliptical vibration grooving machine was developed which consists of two orthogonally-arranged piezoelectric actuators, a diamond cutting tool, and a motorized xyz stage. The micro-scale features were machined on materials of copper, duralumin, nickel, and hastelloy and it was found that EVC significantly reduces cutting resistance and prohibits generation of side burrs and rollover burrs, thus resulting in improving machining qualify of micro-molds in ail experimented workpiece materials.

A study on the machining of micro-extruding die using micro-drilling (마이크로 드릴링을 이용한 미세압출다이 가공에 관한 연구)

  • 민승기;제태진;이응숙;이동주
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2003.04a
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    • pp.161-166
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    • 2003
  • The micro-extruding die is a die for manufacturing of fine-wire by extruding process. The fine-wire made from the micro-extruding can be effectively applied to fields of semiconductor parts and medical parts etc. It is predicted that the demand of fine-wire in industry is more and more increasing. In this study $\phi50\mu m$ micro-drill which is coated with diamond is used for drilling of super micro-hole sizes. For the machining of taper parts of entrance and exit, drill having $\phi50\mu\textrm{mm}$ inclination angle $20^{\circ}$and angle $30^{\circ}$ is used. This is useful for anti tool-breakage and excessive too-wear in drilling process. After micro-drilling, the polishing process by diamond abrasive and polishing wood s carried out for increasing surface roughness.

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Characteristics of Micro-polishing using the Electro-rheological Fluid (ER유체를 이용만 마이크로 폴리싱 특성)

  • 이재종;이응숙;황경현;민승기
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2002.04a
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    • pp.38-42
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    • 2002
  • In the recent, electro-rheological fluid has been used for micro polishing of the 3-dimensional micro-aspherical lens and some sectional parts with defects on the wide flat wafer. The ER fluid has the properties that its viscosity has drastic changed under some electric fields. Therefore, ER fluid can be applicable to the micro polishing fur some parts using these properties. In this paper, the experimental device has been constructed using the precision milling machine in order to micro polishing far some sectional parts of a 4 inches wafer It is consisted of a small steel electrode, a wafer fixture, DC10mA and 5KV power supply unit, and a controller unit. Using the ER experimental device, possibility of amending for wide flat wafer and micro polishing of some micro part has been analyzed.

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A study on micro grooving characteristics of planar lightwave circuit and glass using ultrasonic vibration cutting (초음파 진동절삭을 이용한 평면 광도파로와 유리의 미세 홈 가공특성에 관한 연구)

  • 이준석;김병국;정융호;이득우
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2002.04a
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    • pp.167-172
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    • 2002
  • Recent years, optical components'are widely used in optical communication industry for high speed and mass storage data processing. Micro grooving of planar lightwave circuit and glass, those are widely used in optical component, are realized by polycrystalline diamond tool with ultrasonic vibration. To know the characteristics of brittle materials cutting, ultrasonic vibration cutting tool and machining system are built for the experiment. Grooving on planar lightwave circuit and glass experiments are performed and their shape are measured by photograph with microscope. It reveals that better groove shape with low chipping of planar lightwave circuit and glass are obtained by micro grooving machining with ultrasonic vibration. These experiments are considered as a possibility to the micro grooving of optical communication components.

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Superplastic Microextrusion for Microgears (초소형 기어 제조를 위한 초소성 재료의 미세압출)

  • Kim, Jae-Yeon;Joo, Se-Min;Kim, Ho-Kyung
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.17 no.4
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    • pp.1-7
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    • 2008
  • Fine grained superplastic Zn-22%Al alloy was extruded using a laser machined micro-die to produce a micro-gear shaft. Extrusion process was conducted under a constant pressure at constant temperatures ranging from 503 to 563K. Laser machining was capable to machine a micro-die with close tolerances and adequate surface quality. The extrusion rate increased with extrusion load under constant extrusion temperature. The rate reached a steady state and became constant after a certain period. There was a small instantaneous stroke on application of the load and then a very brief primary stage which preceded steady-state flow. The micro-extrusion process was proven to produce a micro-gear shaft successfully using a fine grained superplastic Zn-22%Al alloy.

A study of electrochemical micromachining with voltage pulses (미세 펄스 전압을 이용한 마이크로 전해가공에 관한 연구)

  • 조창래;백승엽;이은상
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2003.10a
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    • pp.356-361
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    • 2003
  • Electrochemical micromachining which is not normally considered as a precision process is presented in this paper. The application of voltage Pulses between a tool electrode and a workpiece in an electrochemical environment allows the three-dimensional machining of conducting materials with micrometer precision. In this paper tool-electrodes($5\mu\textrm{m}$ in diameter, 1mm in length) are developed by electrochemical micromaching and micro holes are manufactured using this tool-electrodes we developed already. Micro holes are achieved the accuracy below $50\mu\textrm{m}$ in diameter using ultrashort voltage pulses(0.1-5$\mu\textrm{s}$).

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