• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.89-94
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• 2021

The mechanical reliability of flexible devices has become a major concern on their commercialization, where the importance of reliable bonding is highlighted. In terms of component materials' properties, it is important to consider thermal damage of polymer substrates that occupy large area of the flexible device. Therefore, room temperature bonding process is highly advantageous for implementing flexible device assemblies with mechanical reliability. Conventional epoxy resins for the bonding still require curing at high temperatures. Even after the curing procedure, the bonding joint loses flexibility and exhibits poor fatigue durability. To solve this problems, low-temperature and adhesive-free bonding are required. In this work, we develop a room temperature bonding process for polymer substrates using carbon nanotube heated by microwave irradiations. After depositing multiple-wall carbon nanotubes (MWNTs) on PET polymer substrates, they are heated locally with by microwave while the entire bonding specimen maintains room temperature and the heating induces mechanical entanglement of CNT-PET. The room temperature bonding was conducted for a PET/CNT/PET specimen at 600 watt of microwave power for 10 seconds. Thickness of the CNT bonding joint was very thin that it obtains flexibility as well. In order to evaluate the mechanical reliability of the joint specimen, we performed lap shear test, three-point bending test, and dynamic bending test, and confirmed excellent joint strength, flexibility, and bending durability from each test.

• Journal of Welding and Joining
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• v.6 no.4
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• pp.54-62
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• 1988

Major problems in welding Al-7020 include shrinkage, rpopositgy in welds and loss of strength in the heat affected zone. Thus it is important to examine the mechanical properties and reliability of welds. In this study, a series of experiments was carried out to determine the mechanical properties such as micro-hardness distribution, tensile strength, porosity and residual stress distribution of the Al-7020 weldment made by pulse-GMA welding. The resuts of the experiemnts are as folows. 1) The micro-hardness of weld metal and heat affected zone was lower than that of the base metal. 2) The tensile strength of the deposited metal was much lower than that of the base metal. 3) The porrosity in weld metal zone was negligible under the adopted conditsion of experiemnts. 4) The residual stress in the weld metal was lower than that of the heat affected zone, because the weld metal was softened. And the mciro-hardness distribution, the tensile strength and the residual stess distribution of the weldment in the as-welded condition were compared with those of the weldment after heat treatment.

• Journal of Welding and Joining
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• v.12 no.4
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• pp.110-116
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• 1994

This paper has been researched bondability of electronics devices, such as lead frame and the thick film of Ag/Pd on an alumina substrate by different heat sources. To obtain the bonds with high quality, it is very important to consist of different materials. Therefore, this paper clarifies not only heat mechanism of micro parallel gap resistance bonding method and pulse heat tip bonding method but also investigates selection of heat sources with micro-electronic materials for bonding. Finally, it is realized fluxless bonding process with filler metal such as plating layers.

• Journal of Welding and Joining
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• v.19 no.4
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• pp.406-412
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• 2001

This study is focussed on the numerical prediction of the thermal fatigue life of a ${\mu}BGA$(Micro Ball Grid Array) solder joint. Numerical method is used to perform three-dimensional finite element analysis for Sn-37mass%Pb. Sn-3.5mass%Ag solder alloys during the given thermal cycling. Strain values, along with the result of mechanical fatigue tests for solder alloys were then used to predict the solder joint fatigue life using the Coffin-Manson equation. In this study, a practical correlation for the prediction of the thermal fatigue life is suggested by using the dimensionless variable $\gamma$. As a result. it could be found that Sn-3.5mass%Ag has longer fatigue life than Sn-37mass%Pb in low cycle fatigue. In addition. the result with ${\gamm}ashow$a good agreement with the FEA results.

• Journal of Welding and Joining
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• v.35 no.3
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• pp.52-61
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• 2017

Transient liquid phase (TLP) bonding is essential technology to repair micro-cracking on the airfoil of blades and vanes for gas turbines. Understanding of the characteristics of TLP bonding of the superalloys is necessary in the application of the technology for repairing these components. In this study, the focus was on investigating TLP bonding characteristics of ${\gamma}^{\prime}$ precipitation strengthened Ni based superalloy. TLP bonding was carried out with an amorphous filler metal in various bonding conditions, and the microstructural characterization was investigated through optical microscopy (OM) and electron probe micro-analysis (EPMA). The experimantal results explained clearly that bonding temperatures had critical effects on the TLP bonding behaviors, and that isothermal solidication of the joints made at higher temperatures than $1170^{\circ}C$ was controlled by Ti diffusion instead of B.

• Journal of Welding and Joining
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• v.26 no.5
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• pp.36-42
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• 2008

Carbon nanotube (CNT) aluminum composite coatings were built up through kinetic spraying process. Deposition behavior of CNT aluminum composite on an aluminum 1050 alloy substrate was analyzed based on deposition mechanism of kinetic spraying. The microstructure of CNT aluminum composite coating were observed and analyzed. Also, the electrical resistivity, bond strength and micro-hardness of the CNT aluminum composite coatings were measured and compared to kinetic sprayed aluminum coatings. The CNT aluminum composite coatings have a dense structure with low porosity. Compared to kinetic sprayed aluminum coating, the CNT aluminum composite coatings present lower electrical resistivity and higher micro-hardness due to high electrical conductivity and dispersion hardening effects of CNTs.

• Journal of Welding and Joining
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• v.13 no.3
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• pp.96-105
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• 1995

An advantage offered by brazing over fusion welding is that strong joints may be produced at relatively low heat input. To minimize the thermal effects and maintain the desired dimension of assemblies. the CO$_{2}$ laser beam can be applied to the brazed joint of pin and plate as a micro heat source. This paper presents a analysis model of the laser brazing process considering the laser beam mode and heat flow in brazed parts by using the finite element method. The simulation results were compared with the experimental results obtained from the infrared temperature sensing system. Based on these results, the proper process parameters were investigated to get a good joining quality. The influence of the beam mode change was examined with respect to the temperature distribution and joint quality.

• Proceedings of the KWS Conference
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• v.43
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• pp.46-48
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• 2004

• Proceedings of the KWS Conference
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• 2000.10a
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• pp.320-323
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• 2000

• Proceedings of the KWS Conference
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• 1998.05a
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• pp.126-130
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• 1998