• Design & Manufacturing
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• v.14 no.3
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• pp.57-62
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• 2020

In the drug delivery system industry, the technology with even split injection becomes important for maximizing efficiency and minimizing the side effects. In conventional drug delivery system, infection can occur due to pain and splashing. Also, various applications are impossible due to disposable use, and it is the reason to avoid to use this system because of the complexity of the driving method. Therefore, in this study, a painless drug delivery device is developed for non-pain with electrical insulation breakdown method. Finite elements analysis was used to evaluate the ejection characteristics of drugs according to the shape of the micro ejection nozzle. The effect of the number of holes in the micro nozzle, the length of the nozzle and the inner shape of the nozzle on the drug discharge characteristics were analyzed.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.2
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• pp.623-628
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• 2011

Micro EDM(Electric Discharge Machining) is one of the most powerful technologies which are capable of fabricating micro-structure without any problems from high cutting force. However, there is a significant defect in the part machining with deep holes or pockets, because debris which are generated by electric discharging may frequently cause a short circuit between an electrode and workpiece material. Vibration flushing can reduce the undesirable phenomena with dynamic flow of EDM fluid in a deep and choked area. In this study, Vibration flushing with solenoid is suggested and the results show that the method can generate a remarkable EDM efficiency with high amplitude at a low frequency in comparison with current vibration flushing methods with high frequency using piezo actuators.

• The Journal of the Acoustical Society of Korea
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• v.26 no.3
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• pp.115-122
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• 2007

In this study, the property and the structure of micro-speaker had been firstly shown to be treated as a ducted speaker-system, which was consisted of the unit and the ducted enclosure. With the decrease of total hole area. the resonance frequency of micro-speaker was decreased due to increasing the stiffness or reducing the compliance. The behavior of resonance frequency relative to the total hole area was exactly agreed with that of the square root of compliance. With decreasing the total hole area. the effective chamber volume was increased, but the reference sound pressure level was exponentially reduced in the low and middle frequency range.

• The Journal of the Acoustical Society of Korea
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• v.25 no.3
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• pp.101-106
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• 2006

In this study, the impedance behavior of micro-speaker had been investigated as a function of hole area existing on the grille. In order to theoretically study the change of acoustical property due to the different total hole area, the holes were treated as a short open pipe system, such as an orifice. This theoretical result was in an excellent agreement with the experimental one. In detail, the acoustic impedance to be caused by the hole could be greatly increased with the decrease of hole area. Therefore, it can be concluded that the acoustic property of micro-speaker could be greatly changed by increasing the acoustic impedance of hole with reducing hole area.

• Journal of Environmental Impact Assessment
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• v.21 no.3
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• pp.431-443
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• 2012

Wind holes or air holes, from which cool air blows out during the summer, but mild air comes out during the winter, have provided the phytogeographically important refugia for cryophilous or cold-loving boreal flora during the Holocene period. At present, wind holes are serving as a faraway disjunctive habitat for Pleistocene relict glacial floristic elements, and present an invaluable information to reconstruct the natural history. Present work aims to collate the nationwide distribution and relevant DB on the potential wind holes of Korea based upon media and literature sources, along with geographical informations, such as place name, topographic map, environmental geographical information, flora, monitoring data of Korea National Arboretum, and field survey data. Geographical information on sixty nine wind hole sites have compiled and analyzed on the basis of flora and presence of fossilized periglacial landforms, such as talus, block field, and block stream, and sixteen sites have thereafter carefully selected and scrutinized through field surveys. To maintain a sustainability of wind hole ecosystem, including their original landform, micro-meteorological phenomena and plant community therein as a refugia or habitat for relict plant species of Pleistocene glacial period, appropriate restrictions and preservation measures are required.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.34 no.12
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• pp.1087-1092
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• 2010

A micro 3D-PTV system has been constructed using a single camera system. Two viewing holes were created behind the object lens of the microscopic system to construct a stereoscopic viewing image. A hybrid recursive PTV algorithm was used. A concept of epipolar line was adopted to eliminate many spurious candidates. Three-dimensional velocity vector fields were obtained by calculating the three-dimensional displacements of particles that were identified as being identical. The system consists of a laser light source (Ar-ion, 500 mW), one high-definition camera ($1028{\times}1024$ pixels, 500 fps), a circular plate with two viewing holes, and a host computer. The performance of the developed algorithm was tested using artificial images. The characteristic of the vector recovery ratio was investigated for the particle numbers. A micro backward-facing step channel ($H{\times}h{\times}W:\;36{\mu}m{\times}70{\mu}m{\times}3000{\mu}m$) was measured using the developed measurement system. The results were in good qualitative agreement with other results.

• Proceedings of the Korean Fiber Society Conference
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• 2001.10a
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• pp.287-290
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• 2001

최근 정보통신 산업의 급속한 발전으로 이동 통신용 단말기 및 반도체 칩 케리어 등의 플라스틱 부품의 초소형 경량화 요구가 증대되고 있다. 미세 사출성형용(micro injection molding) 박판의 사출을 위한 미세사출 성형 고분자 재료는 매우 우수한 용융 유동 특성을 가져야 하고, 반도체나 소형 엔지니어링 부품으로 사용하려면 높은 인장강도, 충격강도 및 치수안정성을 가져야 한다. (중략)

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10a
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• pp.101-106
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• 2003

Recent electronic equipment becomes smaller, more functional, and more complex. According to these trends, LTCC(low temperature co-fired ceramic) has been emerged as a promising technology in packaging industry. It consists of multi-layer ceramic sheet, and the circuit has 3D structure. In this technology via hole formation plays an important role because it provides an electric path for the packaging interconnection network. Therefore via hole quality is very important for ensuring performance of LTCC product. Via holes are formed on the green sheet that consists of ceramic(before sintering) layer and PET(polyethylene Terephthalate) one. In this paper we found the correlation between hole quality and process condition such as ceramic thickness, and tool size. The shear behavior of double layer sheet by micro hole punching which is different from that of single layer one was also discussed.

• Proceedings of the KIEE Conference
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• 1998.11c
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• pp.1017-1019
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• 1998

In this paper, the fabrication of a micropump with two giant magnetostrictive films of Sm-Fe and Tb-Fe is presented. The pump consist of one silicon wafer and one cover glass. The micropump consists of an actuator diaphragm, a paired nozzle and diffuser, and two through holes. The Structure of the micropump is fabricated by the chemical vapor deposition, the etching and the sputtering of the magnetostrictive films. The deflection of the actuator measured diaphragm is measured by using the laser vibrometer and the flow rate of the micro pump is observed by using a video microscope.

• Transactions of Materials Processing
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• v.13 no.1
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• pp.65-71
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• 2004

Recent electronic equipment becomes smaller, more functional, and more complex. According to these trends, LTCC(low temperature co-fired ceramic) has been emerged as a promising technology in packaging industry. It consists of multi-layer ceramic sheet, and the circuit has 3D structure. In this technology via hole formation plays an important role because it provides an electric path for the packaging interconnection network. Therefore via hole qualify is very important for ensuring performance of LTCC product. Via holes are formed on the green sheet that consists of ceramic(before sintering) layer and PET(polyethylene terephthalate) one. In this paper we found the correlation between hole quality and process condition such as PET thickness and ceramic thickness. The shear behavior of double layer sheet by micro hole punching which is different from that of single layer one was also discussed.