• 제목/요약/키워드: Micro-Molding

검색결과 308건 처리시간 0.03초

단열층을 이용한 광디스크 기판 성형에 대한 수치 해석 (Modeling of Passive Heating for Replicating Sub-micron Patterns in Optical Disk Substrates)

  • 배재철;김영민;김홍민;강신일
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2003년도 추계학술대회논문집
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    • pp.80-83
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    • 2003
  • Transcribability of pit or land groove structures in replicating an optical disk substrate greatly affects the performance of a high-density optical disk. However, a solidified layer, generated during the polymer filling, deteriorates transcribability because the solidified layer prevents the polymer melt in filling the sub-micro patterns. Therefore, the development of the solidified layer during filling stage of injection molding must be delayed. For this delay, passive heating by insulation layer has been used. In the present study, to examine the development of the solidified layer delayed by passive heating, the flow of polymer melt with passive heating was analyzed. Passive heating markedly delayed the development of the solidified layer, reduced the viscosity of the polymer melt, and increased the fluidity of the polymer melt in the vicinity of the stamper surface with the sub-micro patterns. As a result, we predict that passive heating can improve transcribability of an optical disk substrate. To verify our prediction, we fabricated an optical disk substrate by using passive heating of a mold and measured the transcribability.

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미세 광소자용 도파로 정밀 복제기술 연구 (Precise Replica Technology Study for Fine Optical Waveguide Device)

  • 오승훈;김창석;정명영;부정숙
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 춘계학술대회 논문집
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    • pp.1493-1496
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    • 2005
  • In this paper, we describe a simple, precise and low cost method of fabricating PDMS stamp for UV embossing. It is important to improve the replication quality of stamp because the accuracy of fabricated structure is related to that of the stamp in UV embossing. The PDMS stamp has been fabricated by the replica molding technology with ultrasonic vibration to eliminate micro-air bubbles during the fabrication process of PDMS stamp. Also, this fabrication to use ultrasonic vibration promotes PDMS solution to fill into micro channel and edge parts. We report the fabrication of an optical core using UV embossing with fabricated PDMS stamp. This fabricated core is $7\;\mu{m}\;at\;depth,\;6\;\mu{m}\;at\;width.\;This\;measured\;value\;has\;the\;difference\;below\;1\;\mu{m}$compared to the original stamp. The surface roughness of core is about 14 nm root mean square. This is satisfactory value to use low-loss optical waveguide. Our successful demonstration of precise replica technology presents an alternative approach for the stamp of UV embossing.

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전주금형 제작을 위한 폴리머의 엑시머 레이저 어블레이션 (Excimer Laser Ablation of Polymer for Electroformed Mold)

  • 이제훈;신동식;서정;김도훈
    • 한국정밀공학회지
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    • 제21권12호
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    • pp.13-20
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    • 2004
  • Manufacturing process for the microfluidic device can include such sequential steps as master fabrication, electroforming, and injection molding. The laser ablation using masks has been applied to the fabrication of channels in microfluidic devices. In this study, manufacturing of polymer master and mold insert for micro injection molding was investigated. Ablation of PET (polyethylene terephthalate) by the excimer laser radiation could be used successfully to make three dimensional master fur nickel mold insert. The mechanism fur ablative decomposition of PET with KrF excimer laser $({\lambda}: 248 nm, pulse duration: 5 ns)$ was explained by photochemical process, while ablation mechanism of PMMA (polymethyl methacrylate) is dominated by photothermal process, the .eaction between PC (polycarbonate) and KrF excimer laser beam generate too much su.face debris. Thus, PET was adopted in polymer master for nickel mold insert. Nickel electroforming using laser ablated PET master was preferable for replication method. Finally, it was shown that excimer laser ablation can substitute for X-ray lithography of LIGA process in microstructuring.

단열층을 이용한 광디스크 기판의 서브 미크론 성형에 대한 수치 해석 (Modeling of Passive Heating for Replicating Sub-micron Patterns in Optical Disk Substrates)

  • 배재철;김영민;김홍민;강신일
    • 소성∙가공
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    • 제13권1호
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    • pp.39-44
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    • 2004
  • Transcribability of pit or land groove structures in replicating an optical disk substrate greatly affects the performance of a high-density optical disk. However, a solidified layer, generated during the polymer filling, deteriorates transcribability because the solidified layer prevents the polymer melt from filling the sub-micro patterns. Therefore, the development of the solidified layer during filling stage of injection molding must be delayed. For this delay, passive heating by insulation layer has been used. In the present study, to examine the development of the solidified layer delayed by passive heating, the flow of polymer melt with passive heating was analyzed. Passive heating markedly delayed the development of the solidified layer, reduced the viscosity of the polymer melt, and increased the fluidity of the polymer melt in the vicinity of the stamper surface with the sub-micro patterns. As a result, we predict that passive heating can improve transcribability of an optical disk substrate. To verify our prediction, we fabricated an optical disk substrate by using passive heating of a mold and measured the transcribability of an optical disk substrate.

마이크로 표면 구조물을 갖는 패드의 STI CMP 특성 연구 (A Study on STI CMP Characteristics using Microstructure Pad)

  • 정재우;박기현;장원문;박선준;정문기;정해도
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2005년도 추계학술대회 논문집 Vol.18
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    • pp.356-357
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    • 2005
  • Chemical mechanical polishing (CMP) allows the planarization of wafers with two or more materials at their surfaces. Especially, polishing pad is considered as one of the most important consumables because of its properties. Subject of this investigation is to apply CMP for planarization of shallow trench isolation structure using microstructure pad. Microstructure pad is designed to have uniform structure on its surface and fabricated by micro-molding technology. And then STI CMP performances such as oxide dishing and nitride corner rounding are evaluated.

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UV Roll 임프린팅 공정을 이용한 렌티큘러 렌즈 제작 (Fabrication of Lenticular Lens by Continuous UV Roll Imprinting)

  • 명호;차주원;김석민;강신일
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2005년도 추계학술대회 논문집
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    • pp.91-94
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    • 2005
  • With increasing demands for large-scale micro-optical components in the field of digital display, the establishment of large-scale fabrication technology fur polymeric patterns has become a priority. The starting point of any polymer replication process is the mold, and the mold often has flat surface. However, It is very hard to replicate large-scale micro patterns using the flat mold, because the cost of large-scale flat mold was very high, and some uniformity and releasing problems were often occurred in large scale flat molding process. In this study, a UV roll imprinting system to overcome the financial and fabrication issues of large-scale pattern replication process was designed and constructed. As a practical example of the system, a lenticular lens with radius of curvature of $223{\mu}m$ and pitch of $280{\mu}m$, which was used to provide wide viewing angle in projection TV, was designed and fabricated. The roll stamper was fabricated using direct machining process of aluminum roll base. Finally, the shape accuracy and uniformity of roll imprinted lenticular lens sheet were measured and analyzed.

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마이크로 표면 구조를 가지는 CMP 패드의 연마 특성 평가 (Evaluation of Chemical Mechanical Polishing Performances with Microstructure Pad)

  • 정재우;박기현;장원문;박성민;정석훈;이현섭;정해도
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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    • pp.651-652
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    • 2005
  • Chemical mechanical polishing (CMP) has emerged as the planarization technique of choice in integrated circuit manufacturing. Especially, polishing pad is considered as one of the most important consumables because of its properties. Generally, conventional polishing pad has irregular pores and asperities. If conditioning process is except from whole polishing process, smoothing of asperities and pore glazing occur on the surface of the pad, so repeatability of polishing performances cannot be expected. In this paper, CMP pad with microstructure was made using micro-molding technology and repeatability of ILD(interlayer dielectric) CMP performances and was evaluated.

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반도체 봉지수지의 파괴 인성치 측정 및 패키지 적용 (Fracture Toughness Measurement of the Semiconductor Encapsulant EMC and It's Application to Package)

  • 김경섭;신영의;장의구
    • E2M - 전기 전자와 첨단 소재
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    • 제10권6호
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    • pp.519-527
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    • 1997
  • The micro crack was occurred where the stress concentrated by the thermal stress which was induced during the cooling period after molding process or by the various reliability tests. In order to estimate the possibility of development from inside micro crack to outside fracture, the fracture toughness of EMC should be measured under the various applicable condition. But study was conducted very rarely for the above area. In order to provide a was to decide the fracture resistance of EMC (Epoxy Molding Compound) of plastic package which is produced by using transfer molding method, measuring fracture is studied. The specimens were made with various EMC material. The diverse combination of test conditions, such as different temperature, temperature /humidity conditions, different filler shapes, and post cure treatment, were tried to examine the effects of environmental condition on the fracture toughness. This study proposed a way which could improve the reliability of LOC(Lead On Chip) type package by comparing the measured $J_{IC}$ of EMC and the calculated J-integral value from FEM(Finite Element Method). The measured $K_{IC}$ value of EMC above glass transition temperature dropped sharply as the temperature increased. The $K_{IC}$ was observed to be higher before the post cure treatment than after the post cure treatment. The change of $J_{IC}$ was significant by time change. J-integral was calculated to have maximum value the angle of the direction of fracture at the lead tip was 0 degree in SOJ package and -30 degree in TSOP package. The results FEM simulation were well agreed with the results of measurement within 5% tolerance. The package crack was proved to be affected more by the structure than by the composing material of package. The structure and the composing material are the variables to reduce the package crack.ack.

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SMC 복합재료 멀티스케일 모델링을 위한 RVE 재구성 알고리즘 개발 (Development of RVE Reconstruction Algorithm for SMC Multiscale Modeling)

  • 임형준;최호일;윤상재;임상원;최치훈;윤군진
    • Composites Research
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    • 제34권1호
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    • pp.70-75
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    • 2021
  • 본 논문은 단섬유 칩으로 구성된 Sheet Molding Compound(SMC) 복합재료를 실험적으로 관찰된 특징들을 바탕으로 메소스케일(meso-scale) 대표체적요소(RVE: Representative Volume Element)를 재구성하는 새로운 알고리즘을 제시한다. 전산해석을 이용하여 SMC 복합재료의 비등방성 거동의 정확한 예측은 어려운 문제이다. 이를 극복하기 위해, SMC 복합재료를 위한 일련의 이미지 프로세싱 기술과 재구성 알고리즘 및 유한요소(FE: Finite Element) 생성기로 구성된 SMC RVE 모델을 개발하였다. 첫째, micro-CT 이미지 프로세싱은 SMC 물성에 직접적인 상관관계를 가지는 섬유칩의 배향 및 분산의 확률적 분포를 평가한다. 둘째, 해당 통계적 분포를 바탕으로 섬유칩 간의 겹침효과를 고려한 섬유칩 팩킹 재구성 알고리즘을 개발한다. 마지막으로, SMC 복합재료 멀티스케일 해석을 이용하여 매크로스케일(macro-scale)에서의 거동을 파악하고 실험데이터를 통해 검증을 수행한다.

펨토초 레이저 유도 나노 및 마이크로 구조물을 활용한 금속 표면 기능성 제어 (Controlled Surface Functionalities of metals using Femtosecond Laser-induced Nano- and Micro-scale Surface Structures)

  • 박태훈;이효수;이해중;황택용
    • Design & Manufacturing
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    • 제17권2호
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    • pp.55-61
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    • 2023
  • With femtosecond (fs) laser pulse irradiation on metals, various types of nano- and micro-scale structures can be naturally induced at the surface through laser-matter interaction. Two notable structures are laser-induced periodic surface structures (LIPSSs) and cone/spike structures, which are known to significantly modify the optical and physical properties of metal surfaces. In this work, we irradiate fs laser pulses onto various types of metals, cold-rolled steel, pickled & oiled steel, Fe-18Cr-8Ni alloy, Zn-Mg-Al alloy coated steel, and pure Cu which can be useful for precise molding and imprinting processes, and adjust the morphological profiles of LIPSSs and cone/spike structures for clear structural coloration and a larger range of surface wettability control, respectively, by changing the fluence of laser and the speed of raster scan. The periods of LIPSSs on metals used in our experiments are nearly independent of laser fluence. Accordingly, the structural coloration of the surface with LIPSSs can be optimized with the morphological profile of LIPSSs, controlled only by the speed of the raster scan once the laser fluence is determined for each metal sample. However, different from LIPSSs, we demonstrate that the morphological profiles of the cone/spike structures, including their size, shape, and density, can be manipulated with both the laser fluence and the raster scan speed to increase a change in the contact angle. By injection molding and imprinting processes, it is expected that fs laser-induced surface structures on metals can be replicated to the plastic surfaces and potentially beneficial to control the optical and wetting properties of the surface of injection molded and imprinted products.